JPWO2021193254A1 - - Google Patents
Info
- Publication number
- JPWO2021193254A1 JPWO2021193254A1 JP2022509989A JP2022509989A JPWO2021193254A1 JP WO2021193254 A1 JPWO2021193254 A1 JP WO2021193254A1 JP 2022509989 A JP2022509989 A JP 2022509989A JP 2022509989 A JP2022509989 A JP 2022509989A JP WO2021193254 A1 JPWO2021193254 A1 JP WO2021193254A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020059006 | 2020-03-27 | ||
| JP2020059006 | 2020-03-27 | ||
| PCT/JP2021/010674 WO2021193254A1 (ja) | 2020-03-27 | 2021-03-16 | 撮像装置及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193254A1 true JPWO2021193254A1 (https=) | 2021-09-30 |
| JP7620005B2 JP7620005B2 (ja) | 2025-01-22 |
Family
ID=77891807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022509989A Active JP7620005B2 (ja) | 2020-03-27 | 2021-03-16 | 撮像装置及び電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230232125A1 (https=) |
| JP (1) | JP7620005B2 (https=) |
| CN (1) | CN115335997B (https=) |
| DE (1) | DE112021001902T5 (https=) |
| WO (1) | WO2021193254A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220073033A (ko) * | 2020-11-26 | 2022-06-03 | 삼성전자주식회사 | 이미지 센서 및 이미지 센싱 시스템 |
| KR102899037B1 (ko) * | 2021-01-04 | 2025-12-11 | 삼성전자주식회사 | 이미지 센서 |
| KR20230130951A (ko) * | 2022-03-04 | 2023-09-12 | 삼성전자주식회사 | 이미지 센서 |
| WO2023234069A1 (ja) * | 2022-05-30 | 2023-12-07 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および電子機器 |
| WO2023243237A1 (ja) * | 2022-06-15 | 2023-12-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置 |
| JP2024014424A (ja) * | 2022-07-22 | 2024-02-01 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP2024041483A (ja) * | 2022-09-14 | 2024-03-27 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置、光検出装置の製造方法、及び電子機器 |
| JP2025024416A (ja) * | 2023-08-07 | 2025-02-20 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016031993A (ja) * | 2014-07-28 | 2016-03-07 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| WO2017130723A1 (ja) * | 2016-01-27 | 2017-08-03 | ソニー株式会社 | 固体撮像素子および電子機器 |
| JP2017212351A (ja) * | 2016-05-26 | 2017-11-30 | キヤノン株式会社 | 撮像装置 |
| JP2018029170A (ja) * | 2016-08-10 | 2018-02-22 | キヤノン株式会社 | 撮像装置およびその製造方法ならびにカメラ |
| JP2018142739A (ja) * | 2018-06-06 | 2018-09-13 | キヤノン株式会社 | 光電変換装置 |
| JP2018201015A (ja) * | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
| JP2019033195A (ja) * | 2017-08-09 | 2019-02-28 | キヤノン株式会社 | 撮像装置の製造方法 |
| JP2019165136A (ja) * | 2018-03-20 | 2019-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4386084B2 (ja) * | 2007-03-06 | 2009-12-16 | エプソンイメージングデバイス株式会社 | 液晶装置及び電子機器 |
| JP5371339B2 (ja) * | 2008-09-11 | 2013-12-18 | 富士フイルム株式会社 | 固体撮像素子及び撮像装置 |
| US8742525B2 (en) * | 2011-03-14 | 2014-06-03 | Sony Corporation | Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus |
| JP4872024B1 (ja) * | 2011-04-22 | 2012-02-08 | パナソニック株式会社 | 固体撮像装置およびその製造方法 |
| JP2015216186A (ja) | 2014-05-09 | 2015-12-03 | ソニー株式会社 | 固体撮像装置および電子機器 |
| WO2017104438A1 (ja) * | 2015-12-16 | 2017-06-22 | ソニー株式会社 | 撮像素子および駆動方法、並びに電子機器 |
| JP2018148039A (ja) * | 2017-03-06 | 2018-09-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および固体撮像装置の製造方法 |
| TWI910139B (zh) * | 2020-03-27 | 2026-01-01 | 日商索尼半導體解決方案公司 | 攝像裝置及電子機器 |
| KR102904474B1 (ko) * | 2020-10-05 | 2025-12-24 | 삼성전자 주식회사 | 이미지 센서 및 이를 포함하는 전자 시스템 |
| US20250228020A1 (en) * | 2022-04-28 | 2025-07-10 | Sony Semiconductor Solutions Corporation | Photodetector and electronic apparatus |
| KR20250068921A (ko) * | 2023-11-10 | 2025-05-19 | 삼성전자주식회사 | 이미지 센서 |
| KR20250102932A (ko) * | 2023-12-28 | 2025-07-07 | 삼성전자주식회사 | 이미지 센서 |
-
2021
- 2021-03-16 WO PCT/JP2021/010674 patent/WO2021193254A1/ja not_active Ceased
- 2021-03-16 DE DE112021001902.3T patent/DE112021001902T5/de active Pending
- 2021-03-16 CN CN202180022953.6A patent/CN115335997B/zh active Active
- 2021-03-16 JP JP2022509989A patent/JP7620005B2/ja active Active
- 2021-03-16 US US17/910,272 patent/US20230232125A1/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016031993A (ja) * | 2014-07-28 | 2016-03-07 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| WO2017130723A1 (ja) * | 2016-01-27 | 2017-08-03 | ソニー株式会社 | 固体撮像素子および電子機器 |
| JP2017212351A (ja) * | 2016-05-26 | 2017-11-30 | キヤノン株式会社 | 撮像装置 |
| JP2018029170A (ja) * | 2016-08-10 | 2018-02-22 | キヤノン株式会社 | 撮像装置およびその製造方法ならびにカメラ |
| JP2018201015A (ja) * | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
| JP2019033195A (ja) * | 2017-08-09 | 2019-02-28 | キヤノン株式会社 | 撮像装置の製造方法 |
| JP2019165136A (ja) * | 2018-03-20 | 2019-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
| JP2018142739A (ja) * | 2018-06-06 | 2018-09-13 | キヤノン株式会社 | 光電変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021001902T5 (de) | 2023-02-23 |
| JP7620005B2 (ja) | 2025-01-22 |
| US20230232125A1 (en) | 2023-07-20 |
| WO2021193254A1 (ja) | 2021-09-30 |
| CN115335997A (zh) | 2022-11-11 |
| CN115335997B (zh) | 2025-07-11 |
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