DE112021001902T5 - Abbildungsvorrichtung und elektronische vorrichtung - Google Patents

Abbildungsvorrichtung und elektronische vorrichtung Download PDF

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Publication number
DE112021001902T5
DE112021001902T5 DE112021001902.3T DE112021001902T DE112021001902T5 DE 112021001902 T5 DE112021001902 T5 DE 112021001902T5 DE 112021001902 T DE112021001902 T DE 112021001902T DE 112021001902 T5 DE112021001902 T5 DE 112021001902T5
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DE
Germany
Prior art keywords
imaging
imaging element
light
partition wall
receiving surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021001902.3T
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German (de)
English (en)
Inventor
Masahiko Nakamizo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of DE112021001902T5 publication Critical patent/DE112021001902T5/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182—Colour image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE112021001902.3T 2020-03-27 2021-03-16 Abbildungsvorrichtung und elektronische vorrichtung Pending DE112021001902T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-059006 2020-03-27
JP2020059006 2020-03-27
PCT/JP2021/010674 WO2021193254A1 (ja) 2020-03-27 2021-03-16 撮像装置及び電子機器

Publications (1)

Publication Number Publication Date
DE112021001902T5 true DE112021001902T5 (de) 2023-02-23

Family

ID=77891807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021001902.3T Pending DE112021001902T5 (de) 2020-03-27 2021-03-16 Abbildungsvorrichtung und elektronische vorrichtung

Country Status (5)

Country Link
US (1) US20230232125A1 (https=)
JP (1) JP7620005B2 (https=)
CN (1) CN115335997B (https=)
DE (1) DE112021001902T5 (https=)
WO (1) WO2021193254A1 (https=)

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KR20220073033A (ko) * 2020-11-26 2022-06-03 삼성전자주식회사 이미지 센서 및 이미지 센싱 시스템
KR102899037B1 (ko) * 2021-01-04 2025-12-11 삼성전자주식회사 이미지 센서
KR20230130951A (ko) * 2022-03-04 2023-09-12 삼성전자주식회사 이미지 센서
WO2023234069A1 (ja) * 2022-05-30 2023-12-07 ソニーセミコンダクタソリューションズ株式会社 撮像装置および電子機器
WO2023243237A1 (ja) * 2022-06-15 2023-12-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
JP2024014424A (ja) * 2022-07-22 2024-02-01 ソニーセミコンダクタソリューションズ株式会社 撮像装置
JP2024041483A (ja) * 2022-09-14 2024-03-27 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光検出装置の製造方法、及び電子機器
JP2025024416A (ja) * 2023-08-07 2025-02-20 ソニーセミコンダクタソリューションズ株式会社 光検出装置及び電子機器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216186A (ja) 2014-05-09 2015-12-03 ソニー株式会社 固体撮像装置および電子機器

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JP4386084B2 (ja) * 2007-03-06 2009-12-16 エプソンイメージングデバイス株式会社 液晶装置及び電子機器
JP5371339B2 (ja) * 2008-09-11 2013-12-18 富士フイルム株式会社 固体撮像素子及び撮像装置
US8742525B2 (en) * 2011-03-14 2014-06-03 Sony Corporation Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus
JP4872024B1 (ja) * 2011-04-22 2012-02-08 パナソニック株式会社 固体撮像装置およびその製造方法
JP2016031993A (ja) * 2014-07-28 2016-03-07 キヤノン株式会社 固体撮像装置及びカメラ
WO2017104438A1 (ja) * 2015-12-16 2017-06-22 ソニー株式会社 撮像素子および駆動方法、並びに電子機器
TWI875555B (zh) 2016-01-27 2025-03-01 日商新力股份有限公司 固體攝像元件
JP6738200B2 (ja) * 2016-05-26 2020-08-12 キヤノン株式会社 撮像装置
JP2018029170A (ja) * 2016-08-10 2018-02-22 キヤノン株式会社 撮像装置およびその製造方法ならびにカメラ
JP2018148039A (ja) * 2017-03-06 2018-09-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および固体撮像装置の製造方法
JP7316764B2 (ja) 2017-05-29 2023-07-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、及び電子機器
JP2019033195A (ja) * 2017-08-09 2019-02-28 キヤノン株式会社 撮像装置の製造方法
JP2019165136A (ja) * 2018-03-20 2019-09-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2018142739A (ja) 2018-06-06 2018-09-13 キヤノン株式会社 光電変換装置
TWI910139B (zh) * 2020-03-27 2026-01-01 日商索尼半導體解決方案公司 攝像裝置及電子機器
KR102904474B1 (ko) * 2020-10-05 2025-12-24 삼성전자 주식회사 이미지 센서 및 이를 포함하는 전자 시스템
US20250228020A1 (en) * 2022-04-28 2025-07-10 Sony Semiconductor Solutions Corporation Photodetector and electronic apparatus
KR20250068921A (ko) * 2023-11-10 2025-05-19 삼성전자주식회사 이미지 센서
KR20250102932A (ko) * 2023-12-28 2025-07-07 삼성전자주식회사 이미지 센서

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216186A (ja) 2014-05-09 2015-12-03 ソニー株式会社 固体撮像装置および電子機器

Also Published As

Publication number Publication date
JP7620005B2 (ja) 2025-01-22
JPWO2021193254A1 (https=) 2021-09-30
US20230232125A1 (en) 2023-07-20
WO2021193254A1 (ja) 2021-09-30
CN115335997A (zh) 2022-11-11
CN115335997B (zh) 2025-07-11

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Free format text: PREVIOUS MAIN CLASS: H01L0027146000

Ipc: H10F0039180000