JPWO2021186797A5 - - Google Patents

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Publication number
JPWO2021186797A5
JPWO2021186797A5 JP2022508050A JP2022508050A JPWO2021186797A5 JP WO2021186797 A5 JPWO2021186797 A5 JP WO2021186797A5 JP 2022508050 A JP2022508050 A JP 2022508050A JP 2022508050 A JP2022508050 A JP 2022508050A JP WO2021186797 A5 JPWO2021186797 A5 JP WO2021186797A5
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JP
Japan
Prior art keywords
circuit board
main surface
conductive sheet
thermally conductive
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508050A
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English (en)
Japanese (ja)
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JPWO2021186797A1 (https=
JP7494901B2 (ja
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Publication date
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Priority claimed from PCT/JP2020/043644 external-priority patent/WO2021186797A1/ja
Publication of JPWO2021186797A1 publication Critical patent/JPWO2021186797A1/ja
Publication of JPWO2021186797A5 publication Critical patent/JPWO2021186797A5/ja
Application granted granted Critical
Publication of JP7494901B2 publication Critical patent/JP7494901B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022508050A 2020-03-18 2020-11-24 回路基板モジュール Active JP7494901B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047121 2020-03-18
JP2020047121 2020-03-18
PCT/JP2020/043644 WO2021186797A1 (ja) 2020-03-18 2020-11-24 回路基板モジュール

Publications (3)

Publication Number Publication Date
JPWO2021186797A1 JPWO2021186797A1 (https=) 2021-09-23
JPWO2021186797A5 true JPWO2021186797A5 (https=) 2022-11-30
JP7494901B2 JP7494901B2 (ja) 2024-06-04

Family

ID=77771192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508050A Active JP7494901B2 (ja) 2020-03-18 2020-11-24 回路基板モジュール

Country Status (3)

Country Link
US (1) US12446144B2 (https=)
JP (1) JP7494901B2 (https=)
WO (1) WO2021186797A1 (https=)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183098U (https=) * 1984-11-06 1986-06-02
US5739581A (en) * 1995-11-17 1998-04-14 National Semiconductor Corporation High density integrated circuit package assembly with a heatsink between stacked dies
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
JP2004140286A (ja) * 2002-10-21 2004-05-13 Nec Semiconductors Kyushu Ltd 半導体装置及びその製造方法
JP2006093526A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Ind Co Ltd 導電性熱伝導シート
TWI273379B (en) * 2004-09-30 2007-02-11 Asustek Comp Inc Heat sink module
US7623349B2 (en) * 2005-03-07 2009-11-24 Ati Technologies Ulc Thermal management apparatus and method for a circuit substrate
DE102005063281A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integriertes elektronisches Bauteil sowie Kühlvorrichtung für ein integriertes elektronisches Bauteil
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
JP5388598B2 (ja) 2008-11-14 2014-01-15 カルソニックカンセイ株式会社 素子の放熱構造
TW201103381A (en) * 2009-07-03 2011-01-16 qi-rui Cai High heat dissipation circuit board and fabrication method thereof
JP5902598B2 (ja) * 2012-07-05 2016-04-13 株式会社フジクラ 電子装置の放熱構造
US9209141B2 (en) * 2014-02-26 2015-12-08 International Business Machines Corporation Shielded package assemblies with integrated capacitor
JP6112073B2 (ja) * 2014-06-20 2017-04-12 株式会社豊田自動織機 半導体装置
US10199904B2 (en) * 2017-02-23 2019-02-05 Schaft Inc. Cooling a heat-generating electronic device
CN111801794B (zh) * 2018-03-14 2024-10-18 三菱电机株式会社 半导体功率模块以及电力变换装置
CN210325761U (zh) * 2018-12-29 2020-04-14 华为技术有限公司 一种芯片装置及电子设备

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