JPWO2021186562A1 - - Google Patents
Info
- Publication number
- JPWO2021186562A1 JPWO2021186562A1 JP2022508665A JP2022508665A JPWO2021186562A1 JP WO2021186562 A1 JPWO2021186562 A1 JP WO2021186562A1 JP 2022508665 A JP2022508665 A JP 2022508665A JP 2022508665 A JP2022508665 A JP 2022508665A JP WO2021186562 A1 JPWO2021186562 A1 JP WO2021186562A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/011754 WO2021186562A1 (ja) | 2020-03-17 | 2020-03-17 | 基板処理装置、半導体装置の製造方法及びプログラム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021186562A1 true JPWO2021186562A1 (https=) | 2021-09-23 |
| JPWO2021186562A5 JPWO2021186562A5 (https=) | 2022-07-27 |
| JP7529764B2 JP7529764B2 (ja) | 2024-08-06 |
Family
ID=77770981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508665A Active JP7529764B2 (ja) | 2020-03-17 | 2020-03-17 | 基板処理装置、半導体装置の製造方法及びプログラム |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7529764B2 (https=) |
| TW (1) | TWI775328B (https=) |
| WO (1) | WO2021186562A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102843769B1 (ko) * | 2024-05-24 | 2025-08-08 | 주식회사 테스 | 기판처리장치 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964028A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置の製造方法および製造装置 |
| JP2006274316A (ja) * | 2005-03-28 | 2006-10-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2012237026A (ja) * | 2011-05-10 | 2012-12-06 | Tokyo Electron Ltd | 成膜装置 |
| JP2013084895A (ja) * | 2011-09-29 | 2013-05-09 | Mitsubishi Electric Corp | 基板処理装置、基板処理方法、及び太陽電池の製造方法 |
| JP2017212466A (ja) * | 2012-03-28 | 2017-11-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | シームレスのコバルト間隙充填を可能にする方法 |
| JP2018070906A (ja) * | 2016-10-24 | 2018-05-10 | 東京エレクトロン株式会社 | 処理装置及びカバー部材 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5907188A (en) * | 1995-08-25 | 1999-05-25 | Kabushiki Kaisha Toshiba | Semiconductor device with conductive oxidation preventing film and method for manufacturing the same |
| US6869641B2 (en) * | 2002-07-03 | 2005-03-22 | Unaxis Balzers Ltd. | Method and apparatus for ALD on a rotary susceptor |
| JP2015195312A (ja) * | 2014-03-31 | 2015-11-05 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
| JP6704008B2 (ja) * | 2018-03-26 | 2020-06-03 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法および記録媒体 |
-
2020
- 2020-03-17 WO PCT/JP2020/011754 patent/WO2021186562A1/ja not_active Ceased
- 2020-03-17 JP JP2022508665A patent/JP7529764B2/ja active Active
-
2021
- 2021-02-26 TW TW110106856A patent/TWI775328B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964028A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体装置の製造方法および製造装置 |
| JP2006274316A (ja) * | 2005-03-28 | 2006-10-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2012237026A (ja) * | 2011-05-10 | 2012-12-06 | Tokyo Electron Ltd | 成膜装置 |
| JP2013084895A (ja) * | 2011-09-29 | 2013-05-09 | Mitsubishi Electric Corp | 基板処理装置、基板処理方法、及び太陽電池の製造方法 |
| JP2017212466A (ja) * | 2012-03-28 | 2017-11-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | シームレスのコバルト間隙充填を可能にする方法 |
| JP2018070906A (ja) * | 2016-10-24 | 2018-05-10 | 東京エレクトロン株式会社 | 処理装置及びカバー部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7529764B2 (ja) | 2024-08-06 |
| TW202205477A (zh) | 2022-02-01 |
| WO2021186562A1 (ja) | 2021-09-23 |
| TWI775328B (zh) | 2022-08-21 |
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