JPWO2021181732A1 - - Google Patents

Info

Publication number
JPWO2021181732A1
JPWO2021181732A1 JP2021502911A JP2021502911A JPWO2021181732A1 JP WO2021181732 A1 JPWO2021181732 A1 JP WO2021181732A1 JP 2021502911 A JP2021502911 A JP 2021502911A JP 2021502911 A JP2021502911 A JP 2021502911A JP WO2021181732 A1 JPWO2021181732 A1 JP WO2021181732A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021502911A
Other languages
Japanese (ja)
Other versions
JP6905160B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=76918213&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPWO2021181732(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Priority claimed from PCT/JP2020/036884 external-priority patent/WO2021181732A1/ja
Priority to JP2021087733A priority Critical patent/JP6967171B2/ja
Application granted granted Critical
Publication of JP6905160B1 publication Critical patent/JP6905160B1/ja
Publication of JPWO2021181732A1 publication Critical patent/JPWO2021181732A1/ja
Priority to JP2021172806A priority patent/JP7700017B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021502911A 2020-03-13 2020-09-29 デバイス用硬化性接着シート Active JP6905160B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021087733A JP6967171B2 (ja) 2020-03-13 2021-05-25 デバイス用硬化性接着シート
JP2021172806A JP7700017B2 (ja) 2020-03-13 2021-10-22 デバイス用硬化性接着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020043698 2020-03-13
JP2020043698 2020-03-13
PCT/JP2020/036884 WO2021181732A1 (ja) 2020-03-13 2020-09-29 デバイス用硬化性接着シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021087733A Division JP6967171B2 (ja) 2020-03-13 2021-05-25 デバイス用硬化性接着シート

Publications (2)

Publication Number Publication Date
JP6905160B1 JP6905160B1 (ja) 2021-07-21
JPWO2021181732A1 true JPWO2021181732A1 (https=) 2021-09-16

Family

ID=76918213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021502911A Active JP6905160B1 (ja) 2020-03-13 2020-09-29 デバイス用硬化性接着シート

Country Status (3)

Country Link
JP (1) JP6905160B1 (https=)
KR (1) KR102870969B1 (https=)
CN (1) CN115135736B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117616097A (zh) * 2021-07-20 2024-02-27 琳得科株式会社 固化性粘接剂组合物和固化性粘接片

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05309785A (ja) * 1992-05-12 1993-11-22 Asahi Chem Ind Co Ltd 耐熱性積層体
JP2001342450A (ja) * 2000-05-30 2001-12-14 Kyocera Corp 接着材およびこれを用いた電子部品
US20090323300A1 (en) * 2006-04-25 2009-12-31 Daisuke Fujimoto Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
JP5297609B2 (ja) * 2007-07-26 2013-09-25 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、及び積層体
NO2595460T3 (https=) * 2010-07-14 2018-03-10
JP2015086328A (ja) * 2013-10-31 2015-05-07 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、プリプレグ、金属張積層板、及びプリント配線板
TWI667276B (zh) * 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
JP6332458B2 (ja) 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
US20160137890A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Coverlay adhesive composition
JP6335384B2 (ja) * 2015-03-13 2018-05-30 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
US10233365B2 (en) * 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
CN106190004B (zh) * 2016-07-20 2020-05-15 律胜科技（苏州）有限公司 一种具有高频特性的接着剂组合物及其用途
TWI721236B (zh) * 2017-03-28 2021-03-11 日商京瓷股份有限公司 附接著劑之銅箔、銅箔積層板及配線基板
JP2019023263A (ja) * 2017-07-25 2019-02-14 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP6555491B2 (ja) * 2018-05-23 2019-08-07 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
CN111670236B (zh) * 2018-05-28 2022-07-08 东洋纺株式会社 低介电粘合剂组合物
JP7117498B2 (ja) * 2018-06-26 2022-08-15 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP7375364B2 (ja) * 2018-08-21 2023-11-08 東洋紡エムシー株式会社 接着剤組成物、積層体、およびリチウムイオン電池用包装材料
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用

Also Published As

Publication number Publication date
KR20220154130A (ko) 2022-11-21
KR102870969B1 (ko) 2025-10-14
CN115135736A (zh) 2022-09-30
JP6905160B1 (ja) 2021-07-21
CN115135736B (zh) 2025-05-02

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