KR102870969B1 - 디바이스용 경화성 접착 시트 - Google Patents

디바이스용 경화성 접착 시트

Info

Publication number
KR102870969B1
KR102870969B1 KR1020227033294A KR20227033294A KR102870969B1 KR 102870969 B1 KR102870969 B1 KR 102870969B1 KR 1020227033294 A KR1020227033294 A KR 1020227033294A KR 20227033294 A KR20227033294 A KR 20227033294A KR 102870969 B1 KR102870969 B1 KR 102870969B1
Authority
KR
South Korea
Prior art keywords
adhesive layer
compound
group
adhesive sheet
curable adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227033294A
Other languages
English (en)
Korean (ko)
Other versions
KR20220154130A (ko
Inventor
겐타 니시지마
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=76918213&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102870969(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Priority claimed from PCT/JP2020/036884 external-priority patent/WO2021181732A1/ja
Publication of KR20220154130A publication Critical patent/KR20220154130A/ko
Application granted granted Critical
Publication of KR102870969B1 publication Critical patent/KR102870969B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020227033294A 2020-03-13 2020-09-29 디바이스용 경화성 접착 시트 Active KR102870969B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020043698 2020-03-13
JPJP-P-2020-043698 2020-03-13
PCT/JP2020/036884 WO2021181732A1 (ja) 2020-03-13 2020-09-29 デバイス用硬化性接着シート

Publications (2)

Publication Number Publication Date
KR20220154130A KR20220154130A (ko) 2022-11-21
KR102870969B1 true KR102870969B1 (ko) 2025-10-14

Family

ID=76918213

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227033294A Active KR102870969B1 (ko) 2020-03-13 2020-09-29 디바이스용 경화성 접착 시트

Country Status (3)

Country Link
JP (1) JP6905160B1 (https=)
KR (1) KR102870969B1 (https=)
CN (1) CN115135736B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117616097A (zh) * 2021-07-20 2024-02-27 琳得科株式会社 固化性粘接剂组合物和固化性粘接片

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147984A1 (ja) * 2015-03-13 2016-09-22 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP2019099787A (ja) 2018-05-23 2019-06-24 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP2020002217A (ja) * 2018-06-26 2020-01-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05309785A (ja) * 1992-05-12 1993-11-22 Asahi Chem Ind Co Ltd 耐熱性積層体
JP2001342450A (ja) * 2000-05-30 2001-12-14 Kyocera Corp 接着材およびこれを用いた電子部品
US20090323300A1 (en) * 2006-04-25 2009-12-31 Daisuke Fujimoto Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
JP5297609B2 (ja) * 2007-07-26 2013-09-25 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、及び積層体
NO2595460T3 (https=) * 2010-07-14 2018-03-10
JP2015086328A (ja) * 2013-10-31 2015-05-07 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、プリプレグ、金属張積層板、及びプリント配線板
TWI667276B (zh) * 2014-05-29 2019-08-01 美商羅傑斯公司 具改良耐燃劑系統之電路物質及由其形成之物件
JP6332458B2 (ja) 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
US20160137890A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Coverlay adhesive composition
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
US10233365B2 (en) * 2015-11-25 2019-03-19 Rogers Corporation Bond ply materials and circuit assemblies formed therefrom
CN106190004B (zh) * 2016-07-20 2020-05-15 律胜科技（苏州）有限公司 一种具有高频特性的接着剂组合物及其用途
TWI721236B (zh) * 2017-03-28 2021-03-11 日商京瓷股份有限公司 附接著劑之銅箔、銅箔積層板及配線基板
JP2019023263A (ja) * 2017-07-25 2019-02-14 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN111670236B (zh) * 2018-05-28 2022-07-08 东洋纺株式会社 低介电粘合剂组合物
JP7375364B2 (ja) * 2018-08-21 2023-11-08 東洋紡エムシー株式会社 接着剤組成物、積層体、およびリチウムイオン電池用包装材料
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147984A1 (ja) * 2015-03-13 2016-09-22 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP2019099787A (ja) 2018-05-23 2019-06-24 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP2020002217A (ja) * 2018-06-26 2020-01-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板

Also Published As

Publication number Publication date
KR20220154130A (ko) 2022-11-21
CN115135736A (zh) 2022-09-30
JP6905160B1 (ja) 2021-07-21
CN115135736B (zh) 2025-05-02
JPWO2021181732A1 (https=) 2021-09-16

Similar Documents

Publication Publication Date Title
JP7650223B2 (ja) デバイス用接着シート
KR102870969B1 (ko) 디바이스용 경화성 접착 시트
JP7522126B2 (ja) 接着剤組成物及び接着シート
JP7700017B2 (ja) デバイス用硬化性接着シート
KR20240036556A (ko) 경화성 접착제 조성물, 및 경화성 접착 시트
KR20230164004A (ko) 경화성 접착제 조성물, 및 경화물
KR102958579B1 (ko) 접착제 조성물 및 접착 시트
TWI913232B (zh) 裝置用黏著片
TWI922443B (zh) 裝置用硬化性黏著片
KR20230161422A (ko) 접착 시트
WO2023054677A1 (ja) 硬化性接着シート、及び硬化物の製造方法
WO2023054676A1 (ja) 硬化性接着シート
KR20230163357A (ko) 경화성 접착제 조성물, 경화물 및 경화물의 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)