JP6905160B1 - デバイス用硬化性接着シート - Google Patents

デバイス用硬化性接着シート Download PDF

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Publication number
JP6905160B1
JP6905160B1 JP2021502911A JP2021502911A JP6905160B1 JP 6905160 B1 JP6905160 B1 JP 6905160B1 JP 2021502911 A JP2021502911 A JP 2021502911A JP 2021502911 A JP2021502911 A JP 2021502911A JP 6905160 B1 JP6905160 B1 JP 6905160B1
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JP
Japan
Prior art keywords
adhesive layer
group
compound
adhesive sheet
resin
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Active
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JP2021502911A
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English (en)
Japanese (ja)
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JPWO2021181732A1 (https=
Inventor
健太 西嶋
健太 西嶋
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Lintec Corp
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Lintec Corp
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=76918213&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP6905160(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lintec Corp filed Critical Lintec Corp
Priority claimed from PCT/JP2020/036884 external-priority patent/WO2021181732A1/ja
Priority to JP2021087733A priority Critical patent/JP6967171B2/ja
Application granted granted Critical
Publication of JP6905160B1 publication Critical patent/JP6905160B1/ja
Publication of JPWO2021181732A1 publication Critical patent/JPWO2021181732A1/ja
Priority to JP2021172806A priority patent/JP7700017B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021502911A 2020-03-13 2020-09-29 デバイス用硬化性接着シート Active JP6905160B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021087733A JP6967171B2 (ja) 2020-03-13 2021-05-25 デバイス用硬化性接着シート
JP2021172806A JP7700017B2 (ja) 2020-03-13 2021-10-22 デバイス用硬化性接着シート

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020043698 2020-03-13
JP2020043698 2020-03-13
PCT/JP2020/036884 WO2021181732A1 (ja) 2020-03-13 2020-09-29 デバイス用硬化性接着シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021087733A Division JP6967171B2 (ja) 2020-03-13 2021-05-25 デバイス用硬化性接着シート

Publications (2)

Publication Number Publication Date
JP6905160B1 true JP6905160B1 (ja) 2021-07-21
JPWO2021181732A1 JPWO2021181732A1 (https=) 2021-09-16

Family

ID=76918213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021502911A Active JP6905160B1 (ja) 2020-03-13 2020-09-29 デバイス用硬化性接着シート

Country Status (3)

Country Link
JP (1) JP6905160B1 (https=)
KR (1) KR102870969B1 (https=)
CN (1) CN115135736B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023002970A1 (ja) * 2021-07-20 2023-01-26 リンテック株式会社 硬化性接着剤組成物、及び硬化性接着シート

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130180770A1 (en) * 2010-07-14 2013-07-18 Guangdong Shengyi Sci.Tech Co., Ltd Composite Material, High-frequency Circuit Substrate Made Therefrom and Making Method Thereof
US20150351237A1 (en) * 2014-05-29 2015-12-03 Rogers Corporation Circuit materials with improved fire retardant system and articles formed therefrom
US20160137890A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Coverlay adhesive composition
US20180022976A1 (en) * 2016-07-20 2018-01-25 Microcosm Technology (Suzhou) Co., Ltd. Adhesive Composition with High Frequency Characteristics and Application thereof
JP2019504124A (ja) * 2015-11-25 2019-02-14 ロジャーズ コーポレーション ボンドプライ材料及びそれから形成された回路アセンブリ
WO2019230445A1 (ja) * 2018-05-28 2019-12-05 東洋紡株式会社 低誘電接着剤組成物
JP2020029557A (ja) * 2018-08-21 2020-02-27 東洋紡株式会社 接着剤組成物、積層体、およびリチウムイオン電池用包装材料

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05309785A (ja) * 1992-05-12 1993-11-22 Asahi Chem Ind Co Ltd 耐熱性積層体
JP2001342450A (ja) * 2000-05-30 2001-12-14 Kyocera Corp 接着材およびこれを用いた電子部品
US20090323300A1 (en) * 2006-04-25 2009-12-31 Daisuke Fujimoto Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
JP5297609B2 (ja) * 2007-07-26 2013-09-25 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、及び積層体
JP2015086328A (ja) * 2013-10-31 2015-05-07 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、プリプレグ、金属張積層板、及びプリント配線板
JP6332458B2 (ja) 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP6335384B2 (ja) * 2015-03-13 2018-05-30 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP6635415B2 (ja) * 2015-06-30 2020-01-22 パナソニックＩｐマネジメント株式会社 硬化性組成物、プリプレグ、組成物付き金属箔、金属張積層板、及び配線板
TWI721236B (zh) * 2017-03-28 2021-03-11 日商京瓷股份有限公司 附接著劑之銅箔、銅箔積層板及配線基板
JP2019023263A (ja) * 2017-07-25 2019-02-14 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP6555491B2 (ja) * 2018-05-23 2019-08-07 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP7117498B2 (ja) * 2018-06-26 2022-08-15 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板、及びプリント配線板
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130180770A1 (en) * 2010-07-14 2013-07-18 Guangdong Shengyi Sci.Tech Co., Ltd Composite Material, High-frequency Circuit Substrate Made Therefrom and Making Method Thereof
US20150351237A1 (en) * 2014-05-29 2015-12-03 Rogers Corporation Circuit materials with improved fire retardant system and articles formed therefrom
US20160137890A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Coverlay adhesive composition
JP2019504124A (ja) * 2015-11-25 2019-02-14 ロジャーズ コーポレーション ボンドプライ材料及びそれから形成された回路アセンブリ
US20180022976A1 (en) * 2016-07-20 2018-01-25 Microcosm Technology (Suzhou) Co., Ltd. Adhesive Composition with High Frequency Characteristics and Application thereof
WO2019230445A1 (ja) * 2018-05-28 2019-12-05 東洋紡株式会社 低誘電接着剤組成物
JP2020029557A (ja) * 2018-08-21 2020-02-27 東洋紡株式会社 接着剤組成物、積層体、およびリチウムイオン電池用包装材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023002970A1 (ja) * 2021-07-20 2023-01-26 リンテック株式会社 硬化性接着剤組成物、及び硬化性接着シート

Also Published As

Publication number Publication date
KR20220154130A (ko) 2022-11-21
KR102870969B1 (ko) 2025-10-14
CN115135736A (zh) 2022-09-30
CN115135736B (zh) 2025-05-02
JPWO2021181732A1 (https=) 2021-09-16

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