JPWO2023002970A1 - - Google Patents

Info

Publication number
JPWO2023002970A1
JPWO2023002970A1 JP2023536748A JP2023536748A JPWO2023002970A1 JP WO2023002970 A1 JPWO2023002970 A1 JP WO2023002970A1 JP 2023536748 A JP2023536748 A JP 2023536748A JP 2023536748 A JP2023536748 A JP 2023536748A JP WO2023002970 A1 JPWO2023002970 A1 JP WO2023002970A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023536748A
Other languages
Japanese (ja)
Other versions
JPWO2023002970A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023002970A1 publication Critical patent/JPWO2023002970A1/ja
Publication of JPWO2023002970A5 publication Critical patent/JPWO2023002970A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • C09J201/02Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2023536748A 2021-07-20 2022-07-19 Pending JPWO2023002970A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021119880 2021-07-20
PCT/JP2022/027985 WO2023002970A1 (ja) 2021-07-20 2022-07-19 硬化性接着剤組成物、及び硬化性接着シート

Publications (2)

Publication Number Publication Date
JPWO2023002970A1 true JPWO2023002970A1 (https=) 2023-01-26
JPWO2023002970A5 JPWO2023002970A5 (https=) 2025-05-30

Family

ID=84979995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536748A Pending JPWO2023002970A1 (https=) 2021-07-20 2022-07-19

Country Status (5)

Country Link
JP (1) JPWO2023002970A1 (https=)
KR (1) KR20240036556A (https=)
CN (1) CN117616097A (https=)
TW (1) TW202313890A (https=)
WO (1) WO2023002970A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250166950A (ko) * 2023-03-31 2025-11-28 린텍 가부시키가이샤 열경화성 접착 시트, 적층체, 및 적층체의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015196729A (ja) * 2014-03-31 2015-11-09 コニシ株式会社 硬化性樹脂組成物
JP6332458B2 (ja) 2014-07-31 2018-05-30 東亞合成株式会社 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル
JP6335384B2 (ja) * 2015-03-13 2018-05-30 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP6749055B2 (ja) * 2016-09-09 2020-09-02 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP2020100759A (ja) * 2018-12-25 2020-07-02 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
WO2021085008A1 (ja) * 2019-10-30 2021-05-06 リンテック株式会社 デバイス用接着シート
WO2021085009A1 (ja) * 2019-10-30 2021-05-06 リンテック株式会社 接着剤組成物及び接着シート
JP6905160B1 (ja) * 2020-03-13 2021-07-21 リンテック株式会社 デバイス用硬化性接着シート

Also Published As

Publication number Publication date
CN117616097A (zh) 2024-02-27
WO2023002970A1 (ja) 2023-01-26
KR20240036556A (ko) 2024-03-20
TW202313890A (zh) 2023-04-01

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Legal Events

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A521 Request for written amendment filed

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Effective date: 20250522

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Effective date: 20250522