JPWO2021145416A1 - - Google Patents

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Publication number
JPWO2021145416A1
JPWO2021145416A1 JP2021571254A JP2021571254A JPWO2021145416A1 JP WO2021145416 A1 JPWO2021145416 A1 JP WO2021145416A1 JP 2021571254 A JP2021571254 A JP 2021571254A JP 2021571254 A JP2021571254 A JP 2021571254A JP WO2021145416 A1 JPWO2021145416 A1 JP WO2021145416A1
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JP
Japan
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JP2021571254A
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Japanese (ja)
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JP7628965B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2021571254A 2020-01-16 2021-01-15 樹脂シート Active JP7628965B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020005184 2020-01-16
JP2020005184 2020-01-16
JP2020126347 2020-07-27
JP2020126347 2020-07-27
PCT/JP2021/001207 WO2021145416A1 (ja) 2020-01-16 2021-01-15 樹脂シート

Publications (2)

Publication Number Publication Date
JPWO2021145416A1 true JPWO2021145416A1 (https=) 2021-07-22
JP7628965B2 JP7628965B2 (ja) 2025-02-12

Family

ID=76864660

Family Applications (3)

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JP2021571254A Active JP7628965B2 (ja) 2020-01-16 2021-01-15 樹脂シート
JP2021571252A Pending JPWO2021145414A1 (https=) 2020-01-16 2021-01-15
JP2021571253A Active JP7751490B2 (ja) 2020-01-16 2021-01-15 樹脂シート

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021571252A Pending JPWO2021145414A1 (https=) 2020-01-16 2021-01-15
JP2021571253A Active JP7751490B2 (ja) 2020-01-16 2021-01-15 樹脂シート

Country Status (5)

Country Link
US (3) US12247124B2 (https=)
JP (3) JP7628965B2 (https=)
CN (3) CN114981343B (https=)
TW (2) TWI885043B (https=)
WO (3) WO2021145414A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7467014B2 (ja) * 2021-03-25 2024-04-15 信越化学工業株式会社 フレキシブルプリント配線板（ｆｐｃ）用接着剤組成物、並びに該組成物を含む熱硬化性樹脂フィルム、プリプレグ、及びｆｐｃ基板
JP2024125435A (ja) * 2021-07-20 2024-09-19 リンテック株式会社 樹脂シート
WO2024202840A1 (ja) * 2023-03-31 2024-10-03 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2026063096A1 (ja) * 2024-09-17 2026-03-26 株式会社巴川コーポレーション 硬化性接着剤組成物および積層体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007224060A (ja) * 2006-02-21 2007-09-06 Mitsui Chemicals Inc 放熱材料
JP2013258296A (ja) * 2012-06-13 2013-12-26 Tokuyama Corp 熱伝導性絶縁シートの製造方法
JP2016088992A (ja) * 2014-10-31 2016-05-23 京セラケミカル株式会社 半導体接着用樹脂組成物及び半導体装置
JP2019108496A (ja) * 2017-12-19 2019-07-04 日本ゼオン株式会社 熱伝導シート及びその製造方法
JP2019182932A (ja) * 2018-04-03 2019-10-24 積水化学工業株式会社 硬化性樹脂組成物及び積層体

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3888554B2 (ja) * 2004-08-05 2007-03-07 日立化成工業株式会社 変性ポリアミドエポキシ樹脂を含む組成物及びそれを用いた接着剤、フィルム
JP2006086217A (ja) * 2004-09-14 2006-03-30 Hitachi Chem Co Ltd フレキシブル回路基板
KR101353768B1 (ko) 2006-09-29 2014-01-21 덴끼 가가꾸 고교 가부시키가이샤 아크릴계 고열 전도 점착 시트
JP4893415B2 (ja) 2006-10-19 2012-03-07 日立化成工業株式会社 放熱性フィルム
CN103906785A (zh) 2011-11-02 2014-07-02 日立化成株式会社 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法
JP2015019051A (ja) * 2013-06-14 2015-01-29 株式会社日本触媒 放熱シート
JPWO2014208694A1 (ja) * 2013-06-27 2017-02-23 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
JP6348700B2 (ja) * 2013-11-01 2018-06-27 京セラ株式会社 半導体接着用熱硬化型樹脂組成物及びそれを用いた半導体装置
KR102244404B1 (ko) * 2014-02-24 2021-04-26 헨켈 아이피 앤드 홀딩 게엠베하 열전도성 선-적용형 언더필 제제 및 그의 용도
US11161979B2 (en) * 2014-07-18 2021-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
US10434750B2 (en) * 2015-01-13 2019-10-08 Hitachi Chemical Company, Ltd. Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
WO2017006887A1 (ja) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板
JP6789030B2 (ja) * 2016-08-09 2020-11-25 京セラ株式会社 封止用樹脂組成物及び半導体装置
KR20180022423A (ko) * 2016-08-24 2018-03-06 엘지이노텍 주식회사 방열 기판 및 이의 제조 방법
TWI899456B (zh) 2016-09-26 2025-10-01 日商力森諾科股份有限公司 樹脂組成物、半導體用配線層積層體及半導體裝置
JP6748967B2 (ja) * 2016-11-30 2020-09-02 パナソニックＩｐマネジメント株式会社 シート状熱硬化性樹脂組成物、並びにそれを用いた樹脂シート、モジュール部品、パワーデバイス及びコイル部品
US10834854B2 (en) * 2017-02-28 2020-11-10 Northeastern University Methods for the manufacture of thermal interfaces, thermal interfaces, and articles comprising the same
JP6769912B2 (ja) * 2017-03-31 2020-10-14 京セラ株式会社 半導体接着用シート及び半導体装置
EP3722368B1 (en) * 2017-12-05 2021-10-13 Denka Company Limited Nitride ceramic resin composite body
JP2019108516A (ja) * 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
JP2019132932A (ja) * 2018-01-30 2019-08-08 株式会社リコー 画像形成装置及び消費電力量算出方法
JP6774035B2 (ja) * 2018-05-23 2020-10-21 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板及びプリント配線板
JP7066654B2 (ja) * 2019-04-10 2022-05-13 信越化学工業株式会社 低誘電放熱フィルム用組成物及び低誘電放熱フィルム
JP7115445B2 (ja) * 2019-09-03 2022-08-09 信越化学工業株式会社 マレイミド樹脂フィルム及びマレイミド樹脂フィルム用組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007224060A (ja) * 2006-02-21 2007-09-06 Mitsui Chemicals Inc 放熱材料
JP2013258296A (ja) * 2012-06-13 2013-12-26 Tokuyama Corp 熱伝導性絶縁シートの製造方法
JP2016088992A (ja) * 2014-10-31 2016-05-23 京セラケミカル株式会社 半導体接着用樹脂組成物及び半導体装置
JP2019108496A (ja) * 2017-12-19 2019-07-04 日本ゼオン株式会社 熱伝導シート及びその製造方法
JP2019182932A (ja) * 2018-04-03 2019-10-24 積水化学工業株式会社 硬化性樹脂組成物及び積層体

Also Published As

Publication number Publication date
WO2021145414A1 (ja) 2021-07-22
US12247124B2 (en) 2025-03-11
WO2021145415A1 (ja) 2021-07-22
CN114981343A (zh) 2022-08-30
US20230090587A1 (en) 2023-03-23
US20230064310A1 (en) 2023-03-02
TWI885043B (zh) 2025-06-01
US20230097896A1 (en) 2023-03-30
WO2021145416A1 (ja) 2021-07-22
TW202134326A (zh) 2021-09-16
CN114981343B (zh) 2025-09-02
TW202136391A (zh) 2021-10-01
CN114981352A (zh) 2022-08-30
JPWO2021145414A1 (https=) 2021-07-22
JPWO2021145415A1 (https=) 2021-07-22
JP7628965B2 (ja) 2025-02-12
JP7751490B2 (ja) 2025-10-08
TW202132496A (zh) 2021-09-01
CN114945625A (zh) 2022-08-26

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