JPWO2021145416A1 - - Google Patents
Info
- Publication number
- JPWO2021145416A1 JPWO2021145416A1 JP2021571254A JP2021571254A JPWO2021145416A1 JP WO2021145416 A1 JPWO2021145416 A1 JP WO2021145416A1 JP 2021571254 A JP2021571254 A JP 2021571254A JP 2021571254 A JP2021571254 A JP 2021571254A JP WO2021145416 A1 JPWO2021145416 A1 JP WO2021145416A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
- C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020005184 | 2020-01-16 | ||
JP2020126347 | 2020-07-27 | ||
PCT/JP2021/001207 WO2021145416A1 (ja) | 2020-01-16 | 2021-01-15 | 樹脂シート |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021145416A1 true JPWO2021145416A1 (ja) | 2021-07-22 |
Family
ID=76864660
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021571254A Pending JPWO2021145416A1 (ja) | 2020-01-16 | 2021-01-15 | |
JP2021571252A Pending JPWO2021145414A1 (ja) | 2020-01-16 | 2021-01-15 | |
JP2021571253A Pending JPWO2021145415A1 (ja) | 2020-01-16 | 2021-01-15 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021571252A Pending JPWO2021145414A1 (ja) | 2020-01-16 | 2021-01-15 | |
JP2021571253A Pending JPWO2021145415A1 (ja) | 2020-01-16 | 2021-01-15 |
Country Status (5)
Country | Link |
---|---|
US (3) | US20230090587A1 (ja) |
JP (3) | JPWO2021145416A1 (ja) |
CN (3) | CN114981343A (ja) |
TW (3) | TW202132496A (ja) |
WO (3) | WO2021145414A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7467014B2 (ja) * | 2021-03-25 | 2024-04-15 | 信越化学工業株式会社 | フレキシブルプリント配線板(fpc)用接着剤組成物、並びに該組成物を含む熱硬化性樹脂フィルム、プリプレグ、及びfpc基板 |
WO2023002874A1 (ja) * | 2021-07-20 | 2023-01-26 | リンテック株式会社 | 樹脂シート |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5180440B2 (ja) * | 2006-02-21 | 2013-04-10 | 三井化学株式会社 | 放熱材料 |
MX2009003364A (es) * | 2006-09-29 | 2009-04-14 | Denki Kagaku Kogyo Kk | Hoja acrilica adhesiva, muy termicamente conductiva. |
JP4893415B2 (ja) * | 2006-10-19 | 2012-03-07 | 日立化成工業株式会社 | 放熱性フィルム |
JP5881540B2 (ja) * | 2012-06-13 | 2016-03-09 | 株式会社トクヤマ | 熱伝導性絶縁シートの製造方法 |
JP2015019051A (ja) * | 2013-06-14 | 2015-01-29 | 株式会社日本触媒 | 放熱シート |
EP3015487B1 (en) * | 2013-06-27 | 2018-04-04 | Hitachi Chemical Co., Ltd. | Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and led device |
JP6348700B2 (ja) * | 2013-11-01 | 2018-06-27 | 京セラ株式会社 | 半導体接着用熱硬化型樹脂組成物及びそれを用いた半導体装置 |
JP6420121B2 (ja) * | 2014-10-31 | 2018-11-07 | 京セラ株式会社 | 半導体接着用樹脂組成物及び半導体装置 |
SG11201705674TA (en) * | 2015-01-13 | 2017-08-30 | Hitachi Chemical Co Ltd | Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board |
CN107735417B (zh) * | 2015-07-06 | 2020-06-26 | 三菱瓦斯化学株式会社 | 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板 |
JP6789030B2 (ja) * | 2016-08-09 | 2020-11-25 | 京セラ株式会社 | 封止用樹脂組成物及び半導体装置 |
KR20180022423A (ko) * | 2016-08-24 | 2018-03-06 | 엘지이노텍 주식회사 | 방열 기판 및 이의 제조 방법 |
JP6748967B2 (ja) * | 2016-11-30 | 2020-09-02 | パナソニックIpマネジメント株式会社 | シート状熱硬化性樹脂組成物、並びにそれを用いた樹脂シート、モジュール部品、パワーデバイス及びコイル部品 |
US10834854B2 (en) * | 2017-02-28 | 2020-11-10 | Northeastern University | Methods for the manufacture of thermal interfaces, thermal interfaces, and articles comprising the same |
WO2019111978A1 (ja) * | 2017-12-05 | 2019-06-13 | デンカ株式会社 | 窒化物系セラミックス樹脂複合体 |
JP2019108516A (ja) * | 2017-12-15 | 2019-07-04 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール |
JP7087372B2 (ja) * | 2017-12-19 | 2022-06-21 | 日本ゼオン株式会社 | 熱伝導シート及びその製造方法 |
JP2019132932A (ja) * | 2018-01-30 | 2019-08-08 | 株式会社リコー | 画像形成装置及び消費電力量算出方法 |
JP6978371B2 (ja) * | 2018-04-03 | 2021-12-08 | 積水化学工業株式会社 | 硬化性樹脂組成物及び積層体 |
JP7066654B2 (ja) * | 2019-04-10 | 2022-05-13 | 信越化学工業株式会社 | 低誘電放熱フィルム用組成物及び低誘電放熱フィルム |
JP7115445B2 (ja) * | 2019-09-03 | 2022-08-09 | 信越化学工業株式会社 | マレイミド樹脂フィルム及びマレイミド樹脂フィルム用組成物 |
-
2021
- 2021-01-15 CN CN202180009389.4A patent/CN114981343A/zh active Pending
- 2021-01-15 WO PCT/JP2021/001205 patent/WO2021145414A1/ja active Application Filing
- 2021-01-15 US US17/792,615 patent/US20230090587A1/en active Pending
- 2021-01-15 TW TW110101566A patent/TW202132496A/zh unknown
- 2021-01-15 CN CN202180009382.2A patent/CN114981352A/zh active Pending
- 2021-01-15 WO PCT/JP2021/001207 patent/WO2021145416A1/ja active Application Filing
- 2021-01-15 WO PCT/JP2021/001206 patent/WO2021145415A1/ja active Application Filing
- 2021-01-15 JP JP2021571254A patent/JPWO2021145416A1/ja active Pending
- 2021-01-15 TW TW110101581A patent/TW202136391A/zh unknown
- 2021-01-15 US US17/792,349 patent/US20230097896A1/en active Pending
- 2021-01-15 JP JP2021571252A patent/JPWO2021145414A1/ja active Pending
- 2021-01-15 CN CN202180009532.XA patent/CN114945625A/zh active Pending
- 2021-01-15 JP JP2021571253A patent/JPWO2021145415A1/ja active Pending
- 2021-01-15 TW TW110101614A patent/TW202134326A/zh unknown
- 2021-01-15 US US17/792,575 patent/US20230064310A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021145416A1 (ja) | 2021-07-22 |
US20230097896A1 (en) | 2023-03-30 |
CN114945625A (zh) | 2022-08-26 |
US20230064310A1 (en) | 2023-03-02 |
JPWO2021145414A1 (ja) | 2021-07-22 |
TW202134326A (zh) | 2021-09-16 |
TW202132496A (zh) | 2021-09-01 |
WO2021145414A1 (ja) | 2021-07-22 |
US20230090587A1 (en) | 2023-03-23 |
CN114981343A (zh) | 2022-08-30 |
CN114981352A (zh) | 2022-08-30 |
WO2021145415A1 (ja) | 2021-07-22 |
JPWO2021145415A1 (ja) | 2021-07-22 |
TW202136391A (zh) | 2021-10-01 |
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Legal Events
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Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231109 |