JPWO2021130962A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2021130962A5 JPWO2021130962A5 JP2021566684A JP2021566684A JPWO2021130962A5 JP WO2021130962 A5 JPWO2021130962 A5 JP WO2021130962A5 JP 2021566684 A JP2021566684 A JP 2021566684A JP 2021566684 A JP2021566684 A JP 2021566684A JP WO2021130962 A5 JPWO2021130962 A5 JP WO2021130962A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- irradiation
- work
- irradiation position
- processing beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims 13
- 238000003672 processing method Methods 0.000 claims 13
- 238000000034 method Methods 0.000 claims 7
- 230000001678 irradiating effect Effects 0.000 claims 6
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024017354A JP7772114B2 (ja) | 2019-12-26 | 2024-02-07 | ビーム加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/051135 WO2021130962A1 (ja) | 2019-12-26 | 2019-12-26 | ビーム加工装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024017354A Division JP7772114B2 (ja) | 2019-12-26 | 2024-02-07 | ビーム加工装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021130962A1 JPWO2021130962A1 (https=) | 2021-07-01 |
| JPWO2021130962A5 true JPWO2021130962A5 (https=) | 2022-11-28 |
| JP7435626B2 JP7435626B2 (ja) | 2024-02-21 |
Family
ID=76575835
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021566684A Active JP7435626B2 (ja) | 2019-12-26 | 2019-12-26 | ビーム加工装置 |
| JP2024017354A Active JP7772114B2 (ja) | 2019-12-26 | 2024-02-07 | ビーム加工装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024017354A Active JP7772114B2 (ja) | 2019-12-26 | 2024-02-07 | ビーム加工装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12594628B2 (https=) |
| EP (1) | EP4082713B1 (https=) |
| JP (2) | JP7435626B2 (https=) |
| CN (3) | CN117943695A (https=) |
| WO (1) | WO2021130962A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117943695A (zh) | 2019-12-26 | 2024-04-30 | 株式会社尼康 | 加工装置以及加工方法 |
| US20240416449A1 (en) * | 2021-10-27 | 2024-12-19 | Nikon Corporation | Data generation method, cloud system, processing apparatus, computer program, and recording medium |
| CN119300948A (zh) * | 2022-05-31 | 2025-01-10 | 株式会社 尼康 | 加工系统 |
| EP4512567A1 (en) * | 2023-08-24 | 2025-02-26 | Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras | A system for forming a three-dimensional cavity and a method for forming a three-dimensional cavity |
| JP7585451B1 (ja) | 2023-12-27 | 2024-11-18 | 株式会社ソディック | 三次元除去加工システム、加工プログラムの生成装置、三次元造形物の製造方法、および、プログラム |
| JP2026027896A (ja) * | 2024-08-06 | 2026-02-19 | 浜松ホトニクス株式会社 | レーザ加工方法、及び、レーザ加工装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071086A (ja) | 1998-08-31 | 2000-03-07 | Yasuoka:Kk | レーザ光による形状加工方法及び装置 |
| DE10157647C5 (de) | 2001-11-26 | 2012-03-08 | Cl Schutzrechtsverwaltungs Gmbh | Verfahren zur Herstellung von dreidimensionalen Werkstücken in einer Laser-Materialbearbeitungsanlage oder einer Stereolitographieanlage |
| JP3842769B2 (ja) | 2003-09-01 | 2006-11-08 | 株式会社東芝 | レーザ加工装置、レーザ加工方法、及び半導体装置の製造方法 |
| US20050100578A1 (en) * | 2003-11-06 | 2005-05-12 | Schmid Steven R. | Bone and tissue scaffolding and method for producing same |
| DE102007012816B4 (de) | 2007-03-16 | 2009-12-03 | Sauer Gmbh Lasertec | Verfahren und Vorrichtung zur Werkstückbearbeitung |
| DE102010011508B4 (de) * | 2010-03-15 | 2015-12-10 | Ewag Ag | Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung |
| JP2012071314A (ja) * | 2010-09-27 | 2012-04-12 | Mitsubishi Heavy Ind Ltd | 複合材の加工方法及び複合材の加工装置 |
| US20210331273A1 (en) * | 2016-09-22 | 2021-10-28 | Electro Scientific Industries, Inc. | Laser processing apparatus and methods of laser-processing workpieces |
| RU2742207C1 (ru) * | 2017-10-20 | 2021-02-03 | Арселормиттал | Способ производства листовой стали с предварительно нанесенным покрытием и соответствующий лист |
| BR112020006289A2 (pt) * | 2017-11-30 | 2020-10-06 | Saint-Gobain Glass France | painel laminado com parte de anexação elétrica integrada |
| KR102631904B1 (ko) * | 2018-09-28 | 2024-01-31 | 주식회사 엘지화학 | 이종 소재 접합체의 제조방법 및 이종 소재 접합체 |
| DE112018008110T5 (de) * | 2018-12-03 | 2021-08-19 | Mitsubishi Electric Corporation | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung |
| WO2020194603A1 (ja) * | 2019-03-27 | 2020-10-01 | 三菱重工業株式会社 | レーザ加工システム及びレーザ加工方法 |
| CN117943695A (zh) | 2019-12-26 | 2024-04-30 | 株式会社尼康 | 加工装置以及加工方法 |
-
2019
- 2019-12-26 CN CN202410288952.1A patent/CN117943695A/zh active Pending
- 2019-12-26 WO PCT/JP2019/051135 patent/WO2021130962A1/ja not_active Ceased
- 2019-12-26 CN CN202410288953.6A patent/CN117943696A/zh active Pending
- 2019-12-26 US US17/787,818 patent/US12594628B2/en active Active
- 2019-12-26 JP JP2021566684A patent/JP7435626B2/ja active Active
- 2019-12-26 CN CN201980103236.9A patent/CN114845833B/zh active Active
- 2019-12-26 EP EP19958060.6A patent/EP4082713B1/en active Active
-
2024
- 2024-02-07 JP JP2024017354A patent/JP7772114B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2021130962A5 (https=) | ||
| JP2015516352A5 (https=) | ||
| ATE482050T1 (de) | Maschine zum bearbeiten von werkstücken und verfahren zum maschinellen bearbeiten von werkstücken | |
| EP2095903B1 (de) | Verfahren und Vorrichtung zum Entfernen der Glasformnähte mit Polieren der Nahtstellen unter Verwendung eines Laserstrahles | |
| KR101688001B1 (ko) | 얇은 반도체 기판들을 다이싱하는 방법 | |
| CN103056528B (zh) | 激光加工装置 | |
| KR101820222B1 (ko) | 예각을 따라 처리되도록 표면을 조사하는 레이저 표면 처리 방법 및 레이저 표면 처리 장치 | |
| JP2015529161A5 (https=) | ||
| JP2005193285A5 (https=) | ||
| ATE524771T1 (de) | Verfahren und vorrichtung zum einrichten einer bahnkurve einer robotervorrichtung | |
| JP2014223671A5 (ja) | レーザ加工方法及びレーザ加工装置 | |
| CN114367749A (zh) | 用于射束加工板状或管状工件的方法 | |
| JP2016132035A5 (https=) | ||
| CN107073646A (zh) | 用于工件的激光烧蚀和焊接方法 | |
| ATE535342T1 (de) | Maschine und verfahren zum bearbeiten von länglichen werkstücken | |
| WO2016135005A9 (de) | Vorrichtung, verfahren und schneidplatte zur spanenden bearbeitung eines rotierenden werkstücks | |
| CN105817768A (zh) | 激光加工装置 | |
| SG10201709847QA (en) | Laser processing apparatus | |
| JP6020715B2 (ja) | レーザ加工機および孔開け加工方法 | |
| JP2018008307A5 (https=) | ||
| KR102272649B1 (ko) | 작업 품질 검사 기능을 구비한 레이저 클리닝 장치 및 그 방법 | |
| JP2016198877A (ja) | 加工機用の工具 | |
| KR101819074B1 (ko) | 레이저 가공 장치 | |
| JP5874237B2 (ja) | レーザ加工システム | |
| KR20130138575A (ko) | 레이저 가공방법 |