JP7435626B2 - ビーム加工装置 - Google Patents

ビーム加工装置 Download PDF

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Publication number
JP7435626B2
JP7435626B2 JP2021566684A JP2021566684A JP7435626B2 JP 7435626 B2 JP7435626 B2 JP 7435626B2 JP 2021566684 A JP2021566684 A JP 2021566684A JP 2021566684 A JP2021566684 A JP 2021566684A JP 7435626 B2 JP7435626 B2 JP 7435626B2
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Japan
Prior art keywords
processing
workpiece
unit
irradiation
light
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JP2021566684A
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English (en)
Japanese (ja)
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JPWO2021130962A5 (https=
JPWO2021130962A1 (https=
Inventor
智樹 宮川
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Nikon Corp
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Nikon Corp
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Publication of JPWO2021130962A1 publication Critical patent/JPWO2021130962A1/ja
Publication of JPWO2021130962A5 publication Critical patent/JPWO2021130962A5/ja
Priority to JP2024017354A priority Critical patent/JP7772114B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2021566684A 2019-12-26 2019-12-26 ビーム加工装置 Active JP7435626B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024017354A JP7772114B2 (ja) 2019-12-26 2024-02-07 ビーム加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/051135 WO2021130962A1 (ja) 2019-12-26 2019-12-26 ビーム加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024017354A Division JP7772114B2 (ja) 2019-12-26 2024-02-07 ビーム加工装置

Publications (3)

Publication Number Publication Date
JPWO2021130962A1 JPWO2021130962A1 (https=) 2021-07-01
JPWO2021130962A5 JPWO2021130962A5 (https=) 2022-11-28
JP7435626B2 true JP7435626B2 (ja) 2024-02-21

Family

ID=76575835

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021566684A Active JP7435626B2 (ja) 2019-12-26 2019-12-26 ビーム加工装置
JP2024017354A Active JP7772114B2 (ja) 2019-12-26 2024-02-07 ビーム加工装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024017354A Active JP7772114B2 (ja) 2019-12-26 2024-02-07 ビーム加工装置

Country Status (5)

Country Link
US (1) US12594628B2 (https=)
EP (1) EP4082713B1 (https=)
JP (2) JP7435626B2 (https=)
CN (3) CN117943695A (https=)
WO (1) WO2021130962A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117943695A (zh) 2019-12-26 2024-04-30 株式会社尼康 加工装置以及加工方法
US20240416449A1 (en) * 2021-10-27 2024-12-19 Nikon Corporation Data generation method, cloud system, processing apparatus, computer program, and recording medium
CN119300948A (zh) * 2022-05-31 2025-01-10 株式会社 尼康 加工系统
EP4512567A1 (en) * 2023-08-24 2025-02-26 Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras A system for forming a three-dimensional cavity and a method for forming a three-dimensional cavity
JP7585451B1 (ja) 2023-12-27 2024-11-18 株式会社ソディック 三次元除去加工システム、加工プログラムの生成装置、三次元造形物の製造方法、および、プログラム
JP2026027896A (ja) * 2024-08-06 2026-02-19 浜松ホトニクス株式会社 レーザ加工方法、及び、レーザ加工装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005533172A (ja) 2001-11-26 2005-11-04 コンセプト レーザー ゲーエムベーハー レーザ材料加工ユニット又は光造形ユニットにおいて三次元成形品を製造する方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071086A (ja) 1998-08-31 2000-03-07 Yasuoka:Kk レーザ光による形状加工方法及び装置
JP3842769B2 (ja) 2003-09-01 2006-11-08 株式会社東芝 レーザ加工装置、レーザ加工方法、及び半導体装置の製造方法
US20050100578A1 (en) * 2003-11-06 2005-05-12 Schmid Steven R. Bone and tissue scaffolding and method for producing same
DE102007012816B4 (de) 2007-03-16 2009-12-03 Sauer Gmbh Lasertec Verfahren und Vorrichtung zur Werkstückbearbeitung
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
JP2012071314A (ja) * 2010-09-27 2012-04-12 Mitsubishi Heavy Ind Ltd 複合材の加工方法及び複合材の加工装置
US20210331273A1 (en) * 2016-09-22 2021-10-28 Electro Scientific Industries, Inc. Laser processing apparatus and methods of laser-processing workpieces
RU2742207C1 (ru) * 2017-10-20 2021-02-03 Арселормиттал Способ производства листовой стали с предварительно нанесенным покрытием и соответствующий лист
BR112020006289A2 (pt) * 2017-11-30 2020-10-06 Saint-Gobain Glass France painel laminado com parte de anexação elétrica integrada
KR102631904B1 (ko) * 2018-09-28 2024-01-31 주식회사 엘지화학 이종 소재 접합체의 제조방법 및 이종 소재 접합체
DE112018008110T5 (de) * 2018-12-03 2021-08-19 Mitsubishi Electric Corporation Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung
WO2020194603A1 (ja) * 2019-03-27 2020-10-01 三菱重工業株式会社 レーザ加工システム及びレーザ加工方法
CN117943695A (zh) 2019-12-26 2024-04-30 株式会社尼康 加工装置以及加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005533172A (ja) 2001-11-26 2005-11-04 コンセプト レーザー ゲーエムベーハー レーザ材料加工ユニット又は光造形ユニットにおいて三次元成形品を製造する方法

Also Published As

Publication number Publication date
WO2021130962A1 (ja) 2021-07-01
CN117943695A (zh) 2024-04-30
US20230029429A1 (en) 2023-01-26
EP4082713B1 (en) 2025-12-03
EP4082713A4 (en) 2023-10-04
JP2024040305A (ja) 2024-03-25
CN114845833B (zh) 2024-04-05
US12594628B2 (en) 2026-04-07
EP4082713A1 (en) 2022-11-02
CN117943696A (zh) 2024-04-30
CN114845833A (zh) 2022-08-02
JP7772114B2 (ja) 2025-11-18
JPWO2021130962A1 (https=) 2021-07-01

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