WO2021130962A1 - ビーム加工装置 - Google Patents

ビーム加工装置 Download PDF

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Publication number
WO2021130962A1
WO2021130962A1 PCT/JP2019/051135 JP2019051135W WO2021130962A1 WO 2021130962 A1 WO2021130962 A1 WO 2021130962A1 JP 2019051135 W JP2019051135 W JP 2019051135W WO 2021130962 A1 WO2021130962 A1 WO 2021130962A1
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WO
WIPO (PCT)
Prior art keywords
processing
work
unit
light
layered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/051135
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English (en)
French (fr)
Japanese (ja)
Inventor
宮川　智樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to EP19958060.6A priority Critical patent/EP4082713B1/en
Priority to US17/787,818 priority patent/US12594628B2/en
Priority to CN202410288952.1A priority patent/CN117943695A/zh
Priority to CN202410288953.6A priority patent/CN117943696A/zh
Priority to JP2021566684A priority patent/JP7435626B2/ja
Priority to CN201980103236.9A priority patent/CN114845833B/zh
Priority to PCT/JP2019/051135 priority patent/WO2021130962A1/ja
Publication of WO2021130962A1 publication Critical patent/WO2021130962A1/ja
Anticipated expiration legal-status Critical
Priority to JP2024017354A priority patent/JP7772114B2/ja
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Definitions

  • the present invention relates to, for example, the technical field of a beam processing apparatus that processes a workpiece using a processing beam.
  • Patent Document 1 describes a processing apparatus for processing a work by irradiating the work with a laser beam, which is a specific example of a processing beam. In the technical field related to the processing of such a work, it is desired to improve the performance related to the processing of the work.
  • an irradiation optical system that irradiates the processing beam and the processing beam arranged in the optical path of the processing beam and on the work.
  • a beam irradiation device including a beam irradiation position changing member for changing the irradiation position and a control device for controlling the beam irradiation device are provided, and the control device moves the irradiation position of the processed beam in the first direction.
  • the first surface of the work is irradiated with the processing beam to remove the first portion of the work, and the work is removed by removing the first portion while moving the irradiation position of the processing beam in the first direction.
  • the beam irradiation device is controlled so that the second surface formed in the above is irradiated with the processing beam to remove the second portion of the work, and the control device controls the processing to remove the first portion.
  • a beam processing device that controls the beam irradiation device so that the moving range of the processing beam in the removal processing of the second portion is smaller than the moving range of the processing beam.
  • FIG. 1 is a cross-sectional view showing the structure of the processing system of the present embodiment.
  • FIGS. 2 (a) to 2 (c) is a cross-sectional view showing a state of removal processing performed on the work.
  • FIG. 3 is a cross-sectional view showing the structure of the processing apparatus.
  • FIG. 4 is a perspective view showing the structure of the optical system included in the processing apparatus.
  • FIG. 5A is a plan view showing an example of the machined work
  • FIG. 5B is a cross-sectional view showing an example of the machined work.
  • FIG. 6A is a plan view showing an example of the positional relationship between the machining target area and the work
  • FIG. 6B is a cross-sectional view showing an example of the positional relationship between the machining target area and the work.
  • FIG. 7A is a plan view showing a machining shot area set on the first surface of the machining target portion
  • FIG. 7B shows a machining shot area set on the first surface of the machining target portion. It is sectional drawing which shows.
  • FIG. 8 is a plan view showing the movement locus of the irradiation region on the surface of the processing target portion.
  • FIG. 9A is a plan view showing a processing target portion where one scanning operation has been performed
  • FIG. 9B is a plan view showing a processing target portion where a plurality of scanning operations have been performed. is there.
  • FIG. 10 is a cross-sectional view showing a work in which a single layered portion has been removed.
  • FIG. 11 is a cross-sectional view showing a work from which a plurality of layered portions have been removed.
  • FIG. 12 is a plan view showing a moving range of the processing light in the processing shot region when the first unit processing target portion is removed.
  • FIG. 13 is a cross-sectional view showing a work from which the first unit processing target portion has been removed.
  • FIG. 14 is a cross-sectional view showing a machining shot region set for removing the second unit machining target portion.
  • FIG. 15 is a cross-sectional view showing a work from which a single layered portion constituting the second unit processing target portion has been removed.
  • FIG. 16 is a cross-sectional view showing a work from which a plurality of layered portions constituting the second unit processing target portion have been removed.
  • FIG. 17 is a plan view showing a moving range of the processing light in the processing shot region when the second unit processing target portion is removed.
  • FIG. 18 is a cross-sectional view showing a work from which the second unit processing target portion has been removed.
  • FIG. 19 is a cross-sectional view showing a machining shot region set for removing the third unit machining target portion.
  • FIG. 20 is a cross-sectional view showing a work in which a single layered portion constituting the third unit processing target portion has been removed.
  • FIG. 21 is a cross-sectional view showing a work from which a plurality of layered portions constituting the third unit processing target portion have been removed.
  • FIG. 22 is a plan view showing a moving range of the processing light in the processing shot region when the third unit processing target portion is removed.
  • FIG. 23 is a cross-sectional view showing a work from which the third unit processing target portion has been removed.
  • the processing system SYS may be referred to as a beam processing apparatus.
  • each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). Yes, it is assumed that it is substantially in the vertical direction or the gravity direction).
  • the rotation directions (in other words, the inclination direction) around the X-axis, the Y-axis, and the Z-axis are referred to as the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction, respectively.
  • the Z-axis direction may be the direction of gravity.
  • the XY plane may be horizontal.
  • FIG. 1 is a cross-sectional view showing the structure of the processing system SYS.
  • FIG. 1 does not show a cross section of some of the components of the processing system SYS.
  • the processing system SYS includes a processing device 1, a measuring device 2, a stage device 3, a housing 4, a drive system 5, a drive system 6, and a control device 7.
  • the processing device 1 can process the work W under the control of the control device 7.
  • the work W is an object processed by the processing apparatus 1.
  • the work W may be, for example, a metal, an alloy (for example, duralumin, etc.), a composite material such as CFRP (Carbon Fiber Reinforced Plastic), or any other material. It may be an object composed of the above materials.
  • the processing device 1 irradiates the work W with a processing light EL, which is a specific example of the processing beam, in order to process the work W. Therefore, the processing device 1 may be referred to as a beam irradiation device.
  • the processing light EL may be any kind of light as long as the work W can be processed by being irradiated with the work W. In the present embodiment, the description will be made using an example in which the processing light EL is a laser light, but the processing light EL may be a type of light different from the laser light.
  • the wavelength of the processing light EL may be any wavelength as long as the work W can be processed by irradiating the work W.
  • the processed light EL may be visible light or invisible light (for example, at least one of infrared light and ultraviolet light).
  • the processing apparatus 1 irradiates the work W with processing light EL to perform removal processing (typically, cutting processing or grinding processing) to remove a part of the work W.
  • removal processing typically, cutting processing or grinding processing
  • the processing apparatus 1 may perform processing different from the removal processing (for example, additional processing or marking processing).
  • the removal process forms a surface cutting process, a surface grinding process, a cylindrical cutting process, a cylindrical grinding process, a drilling cutting process, a drilling grinding process, a surface polishing process, a cutting process, and an arbitrary character or an arbitrary pattern (in other words).
  • Engraving It may include at least one of engraving (in other words, engraving).
  • FIGS. 2 (a) to 2 (c) are cross-sectional views showing a state of removal processing performed on the work W.
  • the processing apparatus 1 irradiates the processing light EL to the target irradiation region EA set on the surface of the work W as the region to which the processing light EL from the processing apparatus 1 is irradiated. ..
  • the energy of the processing light EL is applied to the energy transfer portion including at least one of the portion of the work W that overlaps the target irradiation region EA and the portion that is close to the target irradiation region EA. Be transmitted.
  • the material constituting the energy transfer portion of the work W is melted by the heat generated by the energy of the processing light EL.
  • the molten material becomes droplets and scatters.
  • the melted material evaporates due to the heat generated by the energy of the processing light EL.
  • the energy transfer portion of the work W is removed. That is, as shown in FIG.
  • a recess (in other words, a groove) is formed on the surface of the work W.
  • the processing apparatus 1 processes the work W by utilizing the so-called thermal processing principle.
  • the galvanometer mirror 122 included in the processing apparatus 1 moves the target irradiation region EA on the surface of the work W so that the processing light EL scans the surface of the work W.
  • the surface of the work W is at least partially removed along the scanning locus of the processed light EL (that is, the moving locus of the target irradiation region EA).
  • the processing apparatus 1 appropriately removes the portion of the work W to be removed by causing the processing light EL to scan the surface of the work W along a desired scanning locus corresponding to the region to be removed. be able to.
  • the processing apparatus 1 may process the work W by utilizing the principle of non-thermal processing (for example, ablation processing). That is, the processing apparatus 1 may perform non-thermal processing (for example, ablation processing) on the work W.
  • non-thermal processing for example, ablation processing
  • the processing apparatus 1 may perform non-thermal processing (for example, ablation processing) on the work W.
  • pulsed light with a light emission time of picoseconds or less or, in some cases, nanoseconds or femtoseconds or less
  • the material constituting the energy transfer portion of the work W evaporates instantly and Scatter.
  • a recess in other words, a groove
  • the material constituting the energy transfer portion of the work W undergoes a molten state. It may sublimate without. Therefore, a recess (in other words, a groove) can be formed on the surface of the work W while suppressing the influence of heat caused by the energy of the processing light EL on the work W as much as possible.
  • the processing apparatus 1 includes a light source 11 and an optical system 12 as shown in FIG. 3, which is a cross-sectional view showing the structure of the processing apparatus 1.
  • the light source 11 can generate a processed light EL.
  • the processing light EL is a laser light
  • the light source 11 may be, for example, a laser diode.
  • the light source 11 may be a light source capable of pulse oscillation.
  • the light source 11 can generate pulsed light (for example, pulsed light having a light emission time of picoseconds or less) as processed light EL.
  • the light source 11 emits the generated processed light EL toward the optical system 12.
  • the light source 11 may emit processed light EL in a linearly polarized state.
  • the optical system 12 is an optical system in which the processed light EL emitted from the light source 11 is incident.
  • the optical system 12 is an optical system for emitting (that is, guiding) the processed light EL from the light source 11 toward the work W.
  • the optical system 12 includes a focus lens 121, a galvanometer mirror 122, and an f ⁇ lens 123 in order to emit the processed light EL toward the work W.
  • the focus lens 121 controls the degree of convergence or the degree of divergence of the processed light EL emitted from the optical system 12. As a result, the focus position (for example, the so-called best focus position) of the processed light EL is controlled.
  • the optical system 12 may include an optical element capable of controlling an arbitrary state of the processed light EL. Any state of the processing light EL can be added to or replaced with at least one of the focus position of the processing light EL, the beam diameter of the processing light EL, the degree of convergence or divergence of the processing light EL, and the intensity distribution of the processing light EL.
  • the pulse length of the processing light EL, the number of pulses of the processing light EL, the intensity of the processing light EL, the traveling direction of the processing light EL, and the polarization state of the processing light EL may be included.
  • the galvano mirror 122 is arranged in the optical path of the processed light EL from the focus lens 121.
  • the processed light EL is such that the processed light EL emitted from the f ⁇ lens 123 scans the work W (that is, the target irradiation region EA irradiated with the processed light EL moves on the surface of the work W).
  • the galvanometer mirror 122 functions as an optical element capable of changing the irradiation position of the processed light EL on the work W (that is, the position of the target irradiation region EA). Therefore, the galvanometer mirror 122 may be referred to as a beam irradiation position changing member.
  • the galvano mirror 122 includes, for example, an X scanning mirror 122X and a Y scanning mirror 122Y, as shown in FIG. 4, which is a perspective view showing a part of the structure of the optical system 12.
  • the X scanning mirror 122X reflects the processed light EL toward the Y scanning mirror 122Y.
  • the X scanning mirror 122X can swing or rotate about the ⁇ Y direction (that is, the rotation direction around the Y axis). Due to the swing or rotation of the X scanning mirror 122X, the processing light EL scans the surface of the work W along the X-axis direction.
  • the target irradiation region EA moves on the surface of the work W along the X-axis direction.
  • the position of the target irradiation region EA in the X-axis direction is changed by swinging or rotating the X scanning mirror 122X.
  • the Y scanning mirror 122Y reflects the processed light EL toward the f ⁇ lens 123.
  • the Y scanning mirror 122Y can swing or rotate about the ⁇ X direction (that is, the rotation direction around the X axis). By swinging or rotating the Y scanning mirror 122Y, the processing light EL scans the surface of the work W along the Y-axis direction.
  • the target irradiation region EA moves on the surface of the work W along the Y-axis direction.
  • the position of the target irradiation region EA in the Y-axis direction is changed by swinging or rotating the Y scanning mirror 122Y.
  • the f ⁇ lens 123 is an optical element for irradiating the work W with the processed light EL from the galvano mirror 122. Therefore, the f ⁇ lens 123 may be referred to as an irradiation optical system. In particular, the f ⁇ lens 123 is an optical element for condensing the processed light EL from the galvano mirror 122 on the work W.
  • the measuring device 2 can measure the work W under the control of the control device 7.
  • the measuring device 2 may be a device capable of measuring the state of the work W.
  • the state of the work W may include the position of the work W.
  • the position of the work W may include the position of the surface of the work W.
  • the position of the surface of the work W may include a position in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction of each surface portion obtained by subdividing the surface of the work W.
  • the state of the work W may include the shape of the work W (for example, a three-dimensional shape).
  • the shape of the work W may include the shape of the surface of the work W.
  • the shape of the surface of the work W includes, in addition to or in place of the position of the surface of the work W described above, the orientation of each surface portion of the surface of the work W subdivided (for example, the orientation of the normal of each surface portion). You may be.
  • the measurement information regarding the measurement result of the measuring device 2 is output from the measuring device 2 to the control device 7.
  • the measuring device 2 may measure the work W by using a predetermined measuring method.
  • a predetermined measuring method light cutting method, white interferometry, pattern projection method, time of flight method, moire topography method (specifically, lattice irradiation method or lattice projection method), holographic interferometry, autocollimation.
  • moire topography method specifically, lattice irradiation method or lattice projection method
  • holographic interferometry specifically, lattice irradiation method or lattice projection method
  • autocollimation At least one of a method, a stereo method, an astigmatism method, a critical angle method, a knife edge method, an interferometry method, and an autocollimation method can be mentioned.
  • the measuring device 2 includes a light source that emits measurement light (for example, slit light or white light) ML and light from the work W irradiated with the measurement light ML (for example, reflected light of the measurement light ML). And a receiver that receives at least one of the scattered light).
  • measurement light for example, slit light or white light
  • white light for example, reflected light of the measurement light ML
  • the stage device 3 is arranged below the processing device 1 and the measuring device 2 (that is, on the ⁇ Z side).
  • the stage device 3 includes a surface plate 31 and a stage 32.
  • the surface plate 31 is arranged on the bottom surface of the housing 4 (or on a supporting surface such as a floor on which the housing 4 is placed).
  • a stage 32 is arranged on the surface plate 31.
  • a support frame 8 for supporting the processing device 1 and the measuring device 2 may be arranged on the surface plate 31. That is, the processing device 1 and the measuring device 2 (further, the stage 32) may be supported by the same surface plate 31.
  • the stage 32 does not have to hold the mounted work W.
  • the stage 32 may hold the mounted work W.
  • the stage 32 may hold the work W by vacuum-adsorbing and / or electrostatically adsorbing the work W.
  • the stage 32 can move on the surface plate 31 with the work W mounted under the control of the control device 7.
  • the stage 32 is movable with respect to at least one of the surface plate 31, the processing device 1, and the measuring device 2.
  • the stage 32 can move along the X-axis direction and the Y-axis direction, respectively. In this case, the stage 32 can move along the stage running surface parallel to the XY plane.
  • the stage 32 may also be movable along at least one of the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • the stage device 3 includes a stage drive system 33.
  • the stage drive system 33 moves the stage 32 by using, for example, an arbitrary motor (for example, a linear motor or the like).
  • the stage device 3 includes a position measuring instrument 34 for measuring the position of the stage 32.
  • the position measuring instrument 34 may include, for example, at least one of an encoder and a laser interferometer.
  • the stage 32 moves, the positional relationship between the stage 32 (furthermore, the work W mounted on the stage 32), the processing device 1 (particularly, the f ⁇ lens 123), and the measuring device 2 changes. That is, when the stage 32 moves, the positions of the stage 32 and the work W with respect to the processing device 1 and the measuring device 2 change. Therefore, moving the stage 32 is equivalent to changing the positional relationship between the stage 32 and the work W, the processing device 1 (particularly, the f ⁇ lens 123), and the measuring device 2. Therefore, the stage device 3 (particularly, the stage drive system 33 that moves the stage 32) may be referred to as a position change device.
  • the stage 32 may be moved so that at least a part of the work W is located in the machining shot region PSA during at least a part of the machining period in which the machining apparatus 1 processes the work W.
  • the "machining shot region PSA" in the present embodiment indicates a region where machining is performed by the machining apparatus 1 in a state where the positional relationship between the machining apparatus 1 and the work W is fixed (that is, without changing).
  • the machining shot region PSA coincides with the scanning range of the machining light EL deflected by the galvanometer mirror 122 with the positional relationship between the machining apparatus 1 and the work W fixed.
  • the area is set to be narrower than the scanning range.
  • the machining shot region PSA is set so that the target irradiation region EA coincides with or is narrower than the settable range in a state where the positional relationship between the machining apparatus 1 and the work W is fixed. Therefore, the machining shot region PSA is a region determined with reference to the machining apparatus 1.
  • the machining apparatus 1 is a machine W of the work W located in the machined shot area PSA. At least a part of the processing light EL can be irradiated.
  • the processing optical EL is processed by the processing optical EL from the processing apparatus 1 in a state of being placed on the stage 32.
  • the stage 32 moves so that the other part of the work W, which is different from one part, is included in the machined shot area PSA (further, if necessary, machined by the drive system 5 described later).
  • the device 1 moves), after which the other part of the work W is machined. After that, the same operation is repeated until the machining of the work W is completed.
  • the stage 32 may be moved so that at least a part of the work W is located in the measurement shot area MSA during at least a part of the measurement period in which the measuring device 2 measures the work W.
  • the measurement shot area MSA is a range corresponding to the light receiving surface of the receiver that receives the light from the work W irradiated with the measurement light ML from the measuring device 2 in a state where the positional relationship between the measuring device 2 and the work W is fixed. It may be set to be. Therefore, the measurement shot area MSA becomes an area determined with reference to the measurement device 2.
  • the stage 32 may move between the machining shot area PSA and the measurement shot area MSA with the work W placed on the stage 32.
  • the stage 32 may be moved so that the work W moves between the machining shot area PSA and the measurement shot area MSA while the work W is placed on the stage 32. That is, in the work W, in addition to the processing period in which the processing device 1 processes the work W and the measurement period in which the measuring device 2 measures the work W, the work W moves between the processing shot area PSA and the measurement shot area MSA. It may also remain mounted on the stage 32 during the moving period.
  • the housing 4 accommodates the processing device 1, the measuring device 2, and the stage device 3 in the internal storage space SP separated from the space outside the housing 4. That is, in the present embodiment, the processing device 1, the measuring device 2, and the stage device 3 are arranged in the same housing 4.
  • the processing device 1, the measuring device 2, and the stage device 3 are arranged in the same accommodation space SP.
  • the housing 4 accommodates the work W in the accommodation space SP inside the work W. That is, the processing device 1, the measuring device 2, and the work W are arranged in the same accommodation space SP.
  • at least a part of the processing device 1, the measuring device 2, and the stage device 3 may not be arranged in the accommodation space SP.
  • the drive system 5 moves the processing device 1 under the control of the control device 7.
  • the drive system 5 moves the processing device 1 with respect to at least one of the surface plate 31, the stage 32, and the work W mounted on the stage 32.
  • the drive system 5 may move the processing device 1 with respect to the measuring device 2.
  • the drive system 5 moves the processing device 1 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • the drive system 5 includes, for example, a motor and the like.
  • the processing system SYS includes a position measuring instrument 51 capable of measuring the position of the processing device 1 moved by the drive system 5.
  • the position measuring instrument 51 may include, for example, at least one of an encoder and a laser interferometer.
  • the drive system 5 moves the processing device 1
  • the target irradiation area EA and the processing shot area PSA move on the work W. Therefore, the drive system 5 can change the positional relationship between the work W, the target irradiation region EA, and the machining shot region PSA by moving the machining apparatus 1.
  • the drive system 5 moves the processing device 1
  • the positional relationship between the stage 32 and the work W and the processing device 1 changes. Therefore, the drive system 5 may be referred to as a position changing device, like the stage drive system 33.
  • the drive system 6 moves the measuring device 2 under the control of the control device 7.
  • the drive system 6 moves the measuring device 2 with respect to at least one of the surface plate 31, the stage 32, and the work W mounted on the stage 32.
  • the drive system 6 may move the measuring device 2 with respect to the processing device 1.
  • the drive system 6 moves the measuring device 2 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction.
  • the drive system 6 includes, for example, a motor and the like.
  • the processing system SYS includes a position measuring instrument 61 capable of measuring the position of the measuring device 2 moved by the drive system 6.
  • the position measuring instrument 61 may include, for example, at least one of an encoder and a laser interferometer.
  • the drive system 6 moves the measuring device 2
  • the measurement shot area MSA moves on the work W. Therefore, the drive system 6 can change the positional relationship between the work W and the measurement shot area MSA by moving the measuring device 2.
  • the control device 7 controls the operation of the processing system SYS. Specifically, the control device 7 operates the processing system SYS (for example, the processing device 1, the measuring device 2, the stage device 3, the drive system 5, and the drive system) so that the processing device 1 appropriately processes the work W. At least one operation of 6) is controlled.
  • the processing system SYS for example, the processing device 1, the measuring device 2, the stage device 3, the drive system 5, and the drive system
  • the control device 7 may include, for example, an arithmetic unit and a storage device.
  • the arithmetic unit may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).
  • the control device 7 functions as a device that controls the operation of the processing system SYS by executing a computer program by the arithmetic unit.
  • This computer program is a computer program for causing the control device 7 (for example, an arithmetic unit) to perform (that is, execute) an operation described later to be performed by the control device 7. That is, this computer program is a computer program for causing the control device 7 to function so that the processing system SYS performs the operation described later.
  • the computer program executed by the arithmetic unit may be recorded in a storage device (that is, a recording medium) included in the control device 7, or any storage built in the control device 7 or externally attached to the control device 7. It may be recorded on a medium (for example, a hard disk or a semiconductor memory). Alternatively, the arithmetic unit may download the computer program to be executed from an external device of the control device 7 via the network interface.
  • a storage device that is, a recording medium included in the control device 7, or any storage built in the control device 7 or externally attached to the control device 7. It may be recorded on a medium (for example, a hard disk or a semiconductor memory).
  • the arithmetic unit may download the computer program to be executed from an external device of the control device 7 via the network interface.
  • the control device 7 does not have to be provided inside the processing system SYS, and may be provided as a server or the like outside the processing system SYS, for example.
  • the control device 7 and the processing system SYS may be connected by a wired and / or wireless network (or a data bus and / or a communication line).
  • the control device 7 and the processing system SYS may be configured so that various types of information can be transmitted and received via the network.
  • the control device 7 may be able to transmit information such as commands and control parameters to the processing system SYS via the network.
  • the processing system SYS may include a receiving device that receives information such as commands and control parameters from the control device 7 via the network.
  • the first control device that performs a part of the processing performed by the control device 7 is provided inside the processing system SYS
  • the second control device that performs the other part of the processing performed by the control device 7 is provided.
  • the control device may be provided outside the processing system SYS.
  • the recording medium for recording the computer program executed by the arithmetic unit, at least one of an optical disk, a magnetic medium, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing the program is used. You may.
  • the recording medium may include a device capable of recording a computer program.
  • each process or function included in the computer program may be realized by a logical processing block realized in the control device 7 by the control device 7 (that is, a computer) executing the computer program. It may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 7, or a logical processing block and a partial hardware module that realizes a part of the hardware are mixed. It may be realized in the form of.
  • FPGA predetermined gate array
  • FIG. 5 (a) which is a plan view showing an example of the processed work W
  • FIG. 5 (b) which is a cross-sectional view showing an example of the processed work W.
  • the processing operation for forming the concave portion PH recessed from the surface of the work W into the flat plate-shaped work W will be described.
  • FIGS. 5A and 5B a machining operation for forming a square hole-shaped concave portion PH into a flat plate-shaped work W will be described.
  • the processing system SYS may perform a processing operation different from the processing operation for forming the concave PH.
  • the processing system SYS may perform a processing operation for forming a shape or structure different from that of the recess PH.
  • the work W is first mounted on the stage 32. After that, the measuring device 2 measures the work W. At this time, the measurement shot region MSA of the measuring device 2 may be set to a relatively wide region (for example, a region wider than the measurement shot region MSA in the fine measurement described later). Therefore, in the following, for convenience of explanation, the measurement performed by the measuring device 2 after the work W is mounted on the stage 32 is referred to as wide area measurement.
  • the control device 7 After that, the control device 7 generates three-dimensional model data of the work W based on the wide area measurement information indicating the result of the wide area measurement of the work W by the measuring device 2.
  • the three-dimensional model data based on the wide area measurement information will be referred to as "wide area 3D model data".
  • the measuring device 2 does not have to perform the wide area measurement.
  • the subsequent operation may be performed using the wide area 3D data already generated (for example, the data generated by using 3D-CAD).
  • the control device 7 specifies the position of the work W in the coordinate system (hereinafter, “stage coordinate system”) used when the stage 32 moves, based on the wide area measurement information.
  • stage coordinate system the coordinate system used when the stage 32 moves.
  • the measuring device 2 measures a reference mark formed in advance on the surface of the stage 32 (or other member such as a surface plate 31) when performing wide area measurement.
  • the information regarding the measurement result of the reference mark includes the information regarding the position of the reference mark. Therefore, the control device 7 can specify the positional relationship between the reference mark and the work W based on the wide area measurement information including the measurement result of the reference mark. Further, since the reference mark is formed on the stage 32 (that is, the positional relationship between the reference mark and the stage 32 is fixed), the control device 7 is the position of the stage 32 measured by the position measuring instrument 34.
  • the position of the reference mark in the stage coordinate system can be specified based on the information regarding (that is, the position in the stage coordinate system) and the information regarding the positional relationship between the reference mark and the stage 32.
  • the control device 7 in the stage coordinate system is based on the information regarding the position of the reference mark in the stage coordinate system and the information regarding the positional relationship between the reference mark and the work W measured by the wide area measurement.
  • the position of the work W can be specified.
  • the measuring device 2 may measure the feature points of the stage 32 instead of measuring the reference mark of the stage 32.
  • the control device 7 sets the machining target area TA to be actually machined by the machining device 1 in the work W.
  • the control device 7 is based on the instruction of the user of the processing system SYS that has confirmed the three-dimensional model of the work W based on the wide area 3D model data (for example, the instruction to set the processing target area TA on the three-dimensional model).
  • the processing target area TA may be set.
  • the control device 7 may specify a portion of the work W that satisfies a predetermined condition, and may set a machining target area TA including the specified portion.
  • FIG. 6A is a plan view showing an example of the positional relationship between the machining target area TA and the work W, and FIG.
  • FIG. 6A is a cross-sectional view showing an example of the positional relationship between the machining target area TA and the work W. As shown in FIG. 6B, the description will proceed with reference to an example in which the machining target area TA is set in the central portion of the work W.
  • the measuring device 2 measures the machining target portion W_target, which is a portion of the work W included in the machining target region TA.
  • the processing target portion W_target corresponds to the portion of the work W that should be removed in order to form the recess PH.
  • the measurement resolution when measuring the processing target portion W_target may be higher than the measurement resolution in the wide area measurement described above. Therefore, in the present embodiment, for convenience of explanation, the measurement of the processing target portion W_target is referred to as "fine measurement". However, fine measurement does not have to be performed.
  • the control device 7 After the fine measurement of the work W is performed, the control device 7 generates three-dimensional model data of the processing target portion W_target based on the fine measurement information indicating the result of the fine measurement.
  • the three-dimensional model data based on the fine measurement information will be referred to as "fine 3D model data".
  • the measuring device 2 does not have to perform fine measurement.
  • the subsequent operations may be performed using the fine 3D data that has already been generated (for example, the data generated by using 3D-CAD).
  • the three-dimensional model data of the processing target portion W_target may be generated based on the above-mentioned wide area measurement information.
  • control device 7 removes the work W and forms the recess PH based on the fine 3D model data (or, if fine measurement is not performed, the wide area 3D model data). 1. Control the stage drive system 33 and the drive system 5.
  • the work W removal processing performed for forming the concave portion PH will be specifically described with reference to FIGS. 7 to 23.
  • the control device 7 is the first surface WS of the surface WS of the processing target portion W_stage whose position and shape are specified by the fine 3D model data.
  • the stage 32 and / or the drive system 5 is controlled to move the stage 32 and / or the processing apparatus 1 so that the processing shot region PSA is set in # 1.
  • the first surface WS # 1 has the same size as the processed shot region PSA or is smaller than the processed shot region PSA in a plan view.
  • the first surface WS # 1 is typically in contact with the outer edge of the surface WS of the processing target portion W_target.
  • the first surface WS # 1 is a part of the surface WS of the processing target portion W_target.
  • the surface WS of the processing target portion W_target is larger than the processing shot region PSA.
  • the machining target portion W_target is divided into a plurality of unit machining target portions W_unit according to the size of the machining shot region PSA, and the plurality of unit machining target portions W_unit are sequentially removed. To do. Therefore, in a state where the machining shot region PSA is set on the first surface WS # 1, the first unit machining target portion W_unit # 1 is first removed from the machining target portion W_target.
  • the control device 7 controls the machining device 1 so that the first surface WS # 1 in which the machining shot region PSA is set is scanned by the machining light EL. Specifically, the control device 7 irradiates the target irradiation region EA with the processing light EL as shown in FIG. 8 which is a plan view showing the movement locus of the target irradiation region EA on the surface WS of the processing target portion W_taget.
  • the focus position (that is, the condensing position) of the processed light EL may be set in the vicinity of the first surface WS # 1 or the first surface WS # 1.
  • FIG. 9 (a) is a plan view showing the processing target portion W_taget in which one scanning operation is performed.
  • the unit removing portion URP extending along the Y-axis direction and having a predetermined thickness along the Z-axis direction is removed from the processing target portion W_target.
  • FIG. 9B which is a plan view showing the processing target portion W_target in which the scanning operation has been performed a plurality of times, the processing target portion W_target is along the X-axis direction.
  • a plurality of unit removal portions URP arranged side by side are removed in order.
  • the layered portion (that is, the layered structure) SL corresponding to the aggregate of the plurality of unit-removed portions URP removed by one scanning of the processed shot region PSA by the processing light EL is formed. , It is removed from the processing target portion W_target. Specifically, as shown in FIG. 10, the layered portion SL # 1_1 whose surface is the first surface WS # 1 is removed.
  • the processing apparatus 1 scans the first surface WS # 1 with the processing light EL to remove at least the exposed surface WS # 1-11 as in the case of removing the layered portion SL # 1_1.
  • the processing apparatus 1 newly removes the layered portion SL # 1_2 by scanning the surface of the layered portion SL # 1_2 including at least a part of the exposed surface WS # 1_1 with the processing light EL.
  • the focus position of the processed optical EL set in the vicinity of the first surface WS # 1 or the first surface WS # 1 is set to the exposed surface WS # 1-11 or the exposed surface WS #.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to be set in the vicinity of 1-11. That is, the control device 7 sets the focus position of the processing light EL when removing the layered portion SL # 1_2 to the focus position of the processing light EL when removing the layered portion SL # 1_1 on the surface of the processing target portion W_target, rather than the focus position of the processing light EL when removing the layered portion SL # 1_1.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to move away from the WS.
  • the processing apparatus 1 performs a scanning operation of moving the target irradiation region EA along the Y-axis direction on the exposed surface WS # 1-11 while irradiating the target irradiation region EA with the processing light EL, and target irradiation of the processing light EL.
  • the layered portion SL # 1-2 is formed by alternately repeating the step operation of moving the target irradiation region EA by a predetermined step movement amount along the X-axis direction on the exposed surface WS # 1-11 without irradiating the region EA. Remove.
  • the processing apparatus 1 processes when removing the layered portion SL # 1-2 rather than the moving range (that is, the scanning range) of the processing light EL when removing the layered portion SL # 1_1.
  • the processed light EL is irradiated on the exposed surface WS # 1-11 so that the moving range of the light EL becomes small. That is, the processing apparatus 1 makes the moving range of the target irradiation region EA when removing the layered portion SL # 1_2 smaller than the moving range of the target irradiation region EA when removing the layered portion SL # 1_1.
  • the exposed surface WS # 1-1-1 is irradiated with the processing light EL.
  • the processing apparatus 1 removes the layered portion SL # 1-2 from the moving range in the scanning direction (or any desired direction, the same applies hereinafter) of the processing light EL when removing the layered portion SL # 1_1.
  • the exposed surface WS # 1-1-1 is irradiated with the processing light EL so that the moving range of the processing light EL in the scanning direction becomes smaller. That is, the processing apparatus 1 has a movement range in the scan direction of the target irradiation region EA when removing the layered portion SL # 1_2, rather than a movement range in the scan direction of the target irradiation region EA when removing the layered portion SL # 1_1.
  • the exposed surface WS # 1-1-1 is irradiated with the processing light EL so that
  • the scanning direction means the scanning direction of the processed light EL by the scanning operation (that is, the moving direction of the target irradiation region EA).
  • the scanning direction is the Y-axis direction. Therefore, the processing apparatus 1 moves the processing light EL in the Y-axis direction when removing the layered portion SL # 1-2 rather than the movement range in the Y-axis direction of the processing light EL when removing the layered portion SL # 1_1.
  • the exposed surface WS # 1-1-1 is irradiated with the processing light EL so that the range becomes small.
  • the size of the layered portion SL # 1_2 to be removed is smaller than the size of the layered portion SL # 1_1 to be removed. That is, the size of the layered portion SL # 1_1 to be removed is larger than the size of the layered portion SL # 1-2 to be removed. Specifically, the size of the layered portion SL # 1_1 in the scanning direction (in the example shown in FIG. 11 in the Y-axis direction) is larger than the size of the layered portion SL # 1-2 in the scanning direction.
  • the ⁇ Y side that is, the rear side in the scanning direction of the processing light EL due to the scanning operation
  • the position of the end portion of the light may be the same as the position of the end portion on the ⁇ Y side of the moving range of the processing light EL when the layered portion SL # 1_1 is removed.
  • the position of the end portion on the + Y side (that is, the front side in the scanning direction of the processed light EL by the scanning operation) of the moving range of the processed light EL when the layered portion SL # 1-22 is removed is set. It may be located on the ⁇ Y side of the position of the end portion on the + Y axis side of the moving range of the processing light EL when the layered portion SL # 1_1 is removed.
  • the moving range of the processed light EL in the scanning direction when removing the layered portion SL # 1_2 is smaller than the moving range in the scanning direction of the processed light EL when removing the layered portion SL # 1_1. In this case, as shown in FIG.
  • the position of the end portion ES # 1-22 on the ⁇ Y side of the layered portion SL # 1_2 is located on the ⁇ Y side of the layered portion SL # 1-1. It will be the same as the position of the end ES # 1_1.
  • the position of the + Y-side end EE # 1-2 of the layered portion SL # 1-22 is located on the ⁇ Y side of the + Y-side end EE # 1-11 of the layered portion SL # 1_1. ing. That is, the size of the layered portion SL # 1_1 in the scanning direction (in the example shown in FIG.
  • the same operation (that is, the operation of removing the layered portion SL) is repeated until a groove having the same depth as the depth of the concave PH is formed. That is, each time the processing apparatus 1 removes the layered portion SL # 1_k (where k is an integer of 1 or more), the exposed surface WS # 1_k or the exposed surface newly formed by removing the layered portion SL # 1_k is removed.
  • the focus position of the processing light EL is set in the vicinity of WS # 1_k, and the scanning operation and the step operation are alternately repeated for at least a part of the exposed surface WS # 1_k.
  • the processing apparatus 1 newly removes the layered portion SL # 1_k + 1 by scanning the surface of the layered portion SL # 1_k + 1 including at least a part of the exposed surface WS # 1_k with the processing light EL.
  • the moving range of the processing light EL when removing the layered portion SL # 1_k + 1 is smaller than the moving range of the processing light EL when removing the layered portion SL # 1_k.
  • the processing light EL is irradiated to the first unit processing target portion W_unit # 1 so as to be. That is, as shown in FIG. 12, which shows the moving range of the processing light EL in the processing shot region PSA when the first unit processing target portion W_unit # 1 is removed, the processing apparatus 1 sets the layered portion SL # 1_k.
  • the processing light EL is irradiated to the first unit processing target portion W_unit # 1 so that the moving range of the processing light EL in the scanning direction becomes smaller.
  • the processing apparatus 1 processes the exposed surface WS # 1_k so that the + Y side end of the moving range of the processing light EL in the scanning direction moves to the ⁇ Y side each time the layered portion SL # 1_k is removed. Irradiate light EL. Since the removal processing is performed in the region irradiated with the processing light EL, it can be said that FIG. 12 shows the range in which the removal processing is performed in the processing shot region PSA.
  • the first unit processing target portion W_unit # 1 composed of a plurality of layered portions SL (in the example shown in FIG. 13, layered portions SL # 1_1 to layered portions SL # 1_6) , Removed from the processing target portion W_target. That is, the first unit processing target portion W_unit # 1 located below at least a part of the first surface WS # 1 of the processing target portion W_target is removed.
  • the processing apparatus 1 removes the second unit processing target portion W_unit # 2 adjacent to the first unit processing target portion W_unit # 1 in the processing target portion W_target.
  • the second unit processing target portion W_unit # 2 is typically adjacent to the first unit processing target portion W_unit # 1 along the scanning direction.
  • the second unit processing target portion W_unit # 2 is composed of a plurality of layered portion SLs adjacent to the plurality of layered portion SLs constituting the first unit processing target portion W_unit # 1.
  • the second unit processing target portion W_unit # 1 is formed from the plurality of layered portions SL adjacent to the plurality of layered portions SL constituting the first unit processing target portion W_unit # 1 in the scanning direction. It is composed.
  • the second unit processing target portion W_unit # 2 is a layered portion SL # 2_1 adjacent to the layered portion SL # 1_1 in the scanning direction and a layered portion adjacent to the layered portion SL # 1-22 in the scanning direction.
  • SL # 2_2 layered portion SL # 2_3 adjacent to layered portion SL # 1_3 in the scanning direction, layered portion SL # 2_4 adjacent to layered portion SL # 1_4 in the scanning direction, and layered portion SL # 1_5 in the scanning direction. It is composed of an adjacent layered portion SL # 2_5 and a layered portion SL # 2_6 adjacent to the layered portion SL # 1_6 in the scanning direction. Therefore, the processing apparatus 1 sequentially removes the layered portions SL # 2_1 to SL # 2_6 in order to remove the second unit processing target portion W_unit # 2.
  • the sizes (particularly, the sizes in the scanning direction) of the plurality of layered portions SL constituting the second unit processing target portion W_unit # 2 may be the same.
  • the third unit processing target portion W_unit # 3 is removed, if the second unit processing target portion W_unit # 2 is removed, the entire processing target portion W_target can be removed.
  • the sizes (particularly, the sizes in the scanning direction) of the plurality of layered portions SL constituting the second unit processing target portion W_unit # 2 may be different from each other.
  • the control device 7 drives the stage drive system 33 and / or drives the second unit processing target portion W_unit # 2 so that the processing light EL is irradiated to the second unit processing target portion W_unit # 2.
  • the system 5 is controlled to move the stage 32 and / or the processing apparatus 1.
  • the control device 7 typically sets the stage drive system so that the second surface WS # 2 of the surface WS of the machining target portion W_target is included in the machining shot region PSA.
  • the stage 32 and / or the processing apparatus 1 is moved by controlling the 33 and / or the drive system 5.
  • the second surface WS # 2 is a part of the surface WS of the processing target portion W_target and is adjacent to the first surface WS # 1.
  • the second surface WS # 2 is typically adjacent to the first surface WS # 1 along the scanning direction.
  • the position of the end portion E_PSA of the machining shot region PSA on the ⁇ Y side (that is, the first unit machining target portion W_unit # 1 side) is set to the second position in the scanning direction.
  • the stage 32 and / so that the unit W_unit # 2 of 2 is located at the same position as the end E # 2 on the ⁇ Y side or on the ⁇ Y side of the end E # 2.
  • the processing device 1 is moved.
  • the position of the end portion E # 2 on the ⁇ Y side of the second unit processing target portion W_unit # 2 is the same as the position of the end portion on the ⁇ Y side of the layered portion SL # 2_6. is there.
  • control device 7 controls the processing device 1 so as to remove the second unit processing target portion W_unit # 2. Specifically, the control device 7 controls the processing device 1 so as to remove the second unit processing target portion W_unit # 2 by sequentially removing the layered portions # 2_1 to # 2_6.
  • the focus position of the processing light EL is the surface of the second surface WS # 2 (that is, the surface of the second unit processing target portion W_unit # 2, and the layered portion SL # 2_1.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to be set in the vicinity of the surface) or the second surface WS # 2.
  • the processing apparatus 1 targets the processing light EL and the scanning operation of moving the target irradiation area EA along the Y-axis direction on the second surface WS # 2 while irradiating the target irradiation area EA.
  • the step operation of moving the target irradiation region EA along the X-axis direction by a predetermined step movement amount on the second surface WS # 2 is alternately repeated.
  • the layered portion SL # 2_1 is removed.
  • an exposed surface WS # 2_1 newly exposed to the outside is formed on the machining target portion W_target so as to face the machining apparatus 1.
  • the processing apparatus 1 scans at least a part of the exposed surface WS # 2_1 with the processing light EL as in the case of removing the first unit processing target portion W_unit # 1.
  • the layered portion SL # 2_2 adjacent to the ⁇ Z side of the layered portion SL # 2_1 is newly removed.
  • the processing apparatus 1 newly removes the layered portion SL # 2_2 by scanning the surface of the layered portion SL # 2_2 including at least a part of the exposed surface WS # 2_1 with the processing light EL.
  • the focus position of the processed optical EL set in the vicinity of the second surface WS # 2 or the second surface WS # 2 is set to the exposed surface WS # 2_1 or the exposed surface WS #.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to be set in the vicinity of 2_1.
  • the control device 7 sets the focus position of the processing light EL when removing the layered portion SL # 2_1 to the focus position of the processing light EL when removing the layered portion SL # 2_1 on the surface of the processing target portion W_target, rather than the focus position of the processing light EL when removing the layered portion SL # 2_1.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to move away from the WS. After that, the processing apparatus 1 removes the layered portion SL # 2_2 by alternately repeating the scanning operation and the step operation on at least a part of the exposed surface WS # 2_1.
  • the processing apparatus 1 removes the size of the moving range of the processing light EL when removing the layered portion SL # 2_1 (particularly, the size in the scanning direction, the same applies hereinafter) and when removing the layered portion SL # 2_2.
  • the processing light EL is irradiated to the second unit processing target portion W_unit # 2 so that the size of the moving range of the processing light EL of the above is the same.
  • the size of the moving range of the target irradiation area EA when removing the layered portion SL # 2_1 is the same as the size of the moving range of the target irradiation area EA when removing the layered portion SL # 2_1.
  • the processing light EL is applied to the second unit processing target portion W_unit # 2.
  • the position of the + Y-side end EE # 1-22 of the layered portion SL # 1-22 adjacent to the layered portion SL # 2_2 is the + Y-side end of the layered portion SL # 1_1 adjacent to the layered portion SL # 2_1.
  • the portion EE # 1-11 is located on the ⁇ Y side of the position.
  • the position of the end portion ES # 2_2 on the ⁇ Y side of the layered portion SL # 2_2 is the position of the end portion ES # 2_1 on the ⁇ Y side of the layered portion SL # 2_1 in the scanning direction. It will be located on the -Y side.
  • the processing apparatus 1 sets the moving range of the processing light EL when removing (i) the layered portion SL # 2_2 in the Y-axis direction (that is, the scanning direction).
  • the position of the end portion on the ⁇ Y side is located on the ⁇ Y side of the position of the end portion on the ⁇ Y side of the moving range of the processing light EL when the layered portion SL # 2_1 is removed, and (ii) layered.
  • the position of the + Y-side end of the moving range of the processing light EL when removing the partial SL # 2_1 is the position of the + Y-axis side of the moving range of the processing light EL when removing the layered portion SL # 2_1.
  • the processing light EL is applied to the second unit processing target portion W_unit # 2 so as to be located on the ⁇ Y side.
  • the same operation (that is, the operation of removing the layered portion SL) is repeated until a groove having the same depth as the depth of the concave PH is formed. That is, each time the processing apparatus 1 removes the layered portion SL # 2_k, the processing light EL is formed in the vicinity of the exposed surface WS # 2_k or the exposed surface WS # 2_k newly formed by removing the layered portion SL # 2_k.
  • the focus position is set, and the scanning operation and the step operation are alternately repeated for at least a part of the exposed surface WS # 2_k.
  • the layered portion SL # 2_k + 1 adjacent to the ⁇ Z side of the layered portion SL # 2_k is removed. That is, the processing apparatus 1 newly removes the layered portion SL # 2_k + 1 by scanning the surface of the layered portion SL # 2_k + 1 including at least a part of the exposed surface WS # 2_k with the processing light EL.
  • the processing apparatus 1 determines the size of the moving range of the processing light EL when removing the layered portion SL # 2_k in the Y-axis direction (that is, the scanning direction) and the layered portion SL # 2_k + 1.
  • the second unit processing target portion W_unit # 2 is irradiated with the processing light EL so that the size of the moving range of the processing light EL at the time of removal is the same.
  • the processing apparatus 1 removes the layered portion SL # 2_k at the position of the end portion on the ⁇ Y side of the moving range of the processing light EL when (i) removing the layered portion SL # 2_k + 1 in the Y-axis direction.
  • the processing apparatus 1 has the processing light EL in the scanning direction.
  • the size of the moving range of the light EL is kept constant, while the moving range of the processing light EL moves (typically, moves along the scanning direction) each time the layered portion SL # 2_k is removed. , Irradiate the processing light EL.
  • the second unit processing target portion W_unit # 2 composed of a plurality of layered portions SL (in the example shown in FIG. 18, layered portions SL # 2_1 to layered portions SL # 2_6) , Removed from the processing target portion W_target.
  • the processing apparatus 1 removes the third unit processing target portion W_unit # 3 adjacent to the second unit processing target portion W_unit # 2 in the processing target portion W_target.
  • the third unit processing target portion W_unit # 3 is typically adjacent to the second unit processing target portion W_unit # 2 along the scanning direction.
  • the third unit processing target portion W_unit # 3 is composed of a plurality of layered portion SLs adjacent to the plurality of layered portion SLs constituting the second unit processing target portion W_unit # 2.
  • the third unit processing target portion W_unit # 3 is formed from the plurality of layered portion SLs adjacent to the plurality of layered portions SL constituting the second unit processing target portion W_unit # 2, respectively, along the scanning direction. It is composed.
  • the third unit processing target portion W_unit # 3 is a layered portion SL # 3_1 adjacent to the layered portion SL # 2_1 in the scanning direction and a layered portion adjacent to the layered portion SL # 2_2 in the scanning direction.
  • SL # 3_2 layered portion SL # 3_3 adjacent to layered portion SL # 2_3 in the scanning direction, layered portion SL # 3_4 adjacent to layered portion SL # 2_4 in the scanning direction, and layered portion SL # 2_5 in the scanning direction. It is composed of an adjacent layered portion SL # 3_5 and a layered portion SL # 3_6 adjacent to the layered portion SL # 2_6 in the scanning direction. Therefore, the processing apparatus 1 sequentially removes the layered portions SL # 3_1 to SL # 3_6 in order to remove the third unit processing target portion W_unit # 3.
  • the third unit processing target portion W_unit # 3 when the third unit processing target portion W_unit # 3 is removed, the entire removal of the processing target portion W_target is completed.
  • the sizes (particularly, the sizes in the scanning direction) of the plurality of layered portions SL constituting the third unit processing target portion W_unit # 3 may be different from each other.
  • the entire removal of the processing target portion W_target is not completed (for example, adjacent to the third unit processing target portion W_unit # 3 in the scanning direction).
  • the size (particularly, the size in the scanning direction) of the plurality of layered portions SL constituting the third unit processing target portion W_unit # 3 is determined. It may be the same. That is, in the present embodiment, when a plurality of unit processing target portions W_unit arranged along the scanning direction are sequentially removed, (i) the unit processing target portion W_unit to be removed first is the first unit described above. The unit to be processed W_unit is removed in the same removal mode as the processing target portion W_unit # 1, and (ii) the unit to be processed W_unit to be removed last is removed in the same removal mode as the third unit processing target portion W_unit # 3 (ii).
  • the other unit processing target portion W_unit is removed in the same removal mode as the second unit processing target portion W_unit # 2 described above. That is, (i) in order to remove the unit processing target portion W_unit to be removed first, the processing light EL is controlled so that the size of the layered portion SL in the scanning direction becomes smaller each time the layered portion SL is removed. (Ii) In order to remove the unit processing target portion W_unit that is finally removed, the processing light EL is controlled so that the size of the layered portion SL in the scanning direction increases each time the layered portion SL is removed.
  • the size of the layered portion SL in the scanning direction is kept constant, while the layered portion SL is removed each time the layered portion SL is removed.
  • the processing light EL is controlled so that the area to be removed moves along the scanning direction.
  • the control device 7 drives the stage drive system 33 and / or drives the third unit processing target portion W_unit # 3 so that the processing light EL is irradiated to the third unit processing target portion W_unit # 3.
  • the system 5 is controlled to move the stage 32 and / or the processing apparatus 1.
  • the control device 7 typically sets the stage drive system so that the third surface WS # 3 of the surface WS of the machining target portion W_target is included in the machining shot region PSA.
  • the stage 32 and / or the processing apparatus 1 is moved by controlling the 33 and / or the drive system 5.
  • the third surface WS # 3 is a part of the surface WS of the processing target portion W_target and is adjacent to the second surface WS # 2.
  • the third surface WS # 3 is typically adjacent to the second surface WS # 2 along the scanning direction.
  • the position of the end portion E_PSA of the machining shot region PSA on the ⁇ Y side (that is, the second unit machining target portion W_unit # 2 side) is set to the second position in the scanning direction.
  • the stage 32 and / so that the unit processing target portion W_unit # 3 of 3 is located at the same position as the end portion E # 3 on the ⁇ Y side or on the ⁇ Y side of the position of the end portion E # 3.
  • the processing device 1 is moved.
  • the position of the ⁇ Y end E # 3 of the third unit processing target portion W_unit # 3 is the same as the position of the ⁇ Y end portion of the layered portion SL # 3_6. ..
  • control device 7 controls the processing device 1 so as to remove the third unit processing target portion W_unit # 3. Specifically, the control device 7 controls the processing device 1 so as to remove the third unit processing target portion W_unit # 3 by sequentially removing the layered portions # 3_1 to # 3_6.
  • the focus position of the processing light EL is the surface of the third surface WS # 3 (that is, the surface of the third unit processing target portion W_unit # 3, and the layered portion SL # 3_1.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to be set in the vicinity of the surface) or the third surface WS # 3.
  • the processing apparatus 1 targets the processing light EL and the scanning operation of moving the target irradiation area EA along the Y-axis direction on the third surface WS # 3 while irradiating the target irradiation area EA.
  • the step operation of moving the target irradiation region EA along the X-axis direction by a predetermined step movement amount on the third surface WS # 3 is alternately repeated.
  • the layered portion SL # 3_1 is removed.
  • the processing apparatus 1 removes the first unit processing target portion W_unit # 1 and the second unit processing target portion W_unit # 2, as in the case of removing the exposed surface WS # 3_1.
  • the layered portion SL # 3_2 adjacent to the ⁇ Z side of the layered portion SL # 3_1 is newly removed.
  • the processing apparatus 1 newly removes the layered portion SL # 3_2 by scanning the surface of the layered portion SL # 3_2 including at least a part of the exposed surface WS # 3_1 with the processing light EL.
  • the focus position of the processed optical EL set in the vicinity of the third surface WS # 3 or the third surface WS # 3 is the exposed surface WS # 3_1 or the exposed surface WS #.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to be set in the vicinity of 3_1.
  • the control device 7 sets the focus position of the processing light EL when removing the layered portion SL # 3_2 to the focus position of the processing light EL when removing the layered portion SL # 3_1 on the surface of the processing target portion W_target, rather than the focus position of the processing light EL when removing the layered portion SL # 3_1.
  • the optical system 12 (particularly, the focus lens 121) is controlled so as to move away from the WS. After that, the processing apparatus 1 removes the layered portion SL # 3_2 by alternately repeating the scanning operation and the step operation on at least a part of the exposed surface WS # 3_1.
  • the third unit processing target portion W_unit # 3 is configured.
  • the sizes of the plurality of layered portions SL are different.
  • the position of the + Y side end portion EE # 2_2 of the layered portion SL # 2_2 adjacent to the layered portion SL # 3_2 is the + Y side end portion of the layered portion SL # 2_1 adjacent to the layered portion SL # 3_1. As described above, it is located on the ⁇ Y side of the position of EE # 2_1. As a result, as shown in FIG.
  • the position of the end portion ES # 3_2 on the ⁇ Y side of the layered portion SL # 3_2 is the position of the end portion ES # 3_1 on the ⁇ Y side of the layered portion SL # 3_1 in the scanning direction. It will be located on the -Y side.
  • the position of the + Y side end EE # 3_2 of the layered portion SL # 3_2 in the scanning direction is the + Y side end EE # of the layered portion SL # 3_1. It will be the same as the position of 3_1.
  • the size of the layered portion SL # 3-2 becomes larger than the size of the layered portion SL # 3-1 in the scanning direction.
  • the processing apparatus 1 has a size (particularly, a size in the scanning direction) of the processing light EL when removing the layered portion SL # 3_1.
  • the exposed surface WS # 3_1 is irradiated with the processing light EL so that the moving range of the processing light EL when removing the layered portion SL # 3_2 is increased.
  • the processing apparatus 1 has an exposed surface so that the moving range of the target irradiation region EA when removing the layered portion SL # 3_2 is larger than the moving range of the target irradiation region EA when removing the layered portion SL # 3_1. Irradiate WS # 3_1 with the processing light EL.
  • the processing apparatus 1 in the Y-axis direction (that is, the scanning direction), (i) the position of the end portion on the ⁇ Y side of the moving range of the processing light EL when removing the layered portion SL # 3_2 is located. , When removing the layered portion SL # 3_1, which is located on the ⁇ Y side of the position of the end on the ⁇ Y side of the moving range of the light EL, and (ii) when removing the layered portion SL # 3_2.
  • the exposed surface so that the position of the end on the + Y side of the moving range of the processing light EL is the same as the position of the end on the + Y axis side of the moving range of the processing light EL when the layered portion SL # 3_1 is removed.
  • the WS # 3_1 is irradiated with the processing light EL.
  • the same operation (that is, the operation of removing the layered portion SL) is repeated until a groove having the same depth as the depth of the concave PH is formed. That is, each time the layered portion SL # 3_k is removed, the processing apparatus 1 removes the layered portion SL # 3_k to form a newly formed exposed surface WS # 3_k or a processing light EL in the vicinity of the exposed surface WS # 3_k.
  • the focus position is set, and the scanning operation and the step operation are alternately repeated for at least a part of the exposed surface WS # 3_k.
  • the layered portion SL # 3_k + 1 adjacent to the ⁇ Z side of the layered portion SL # 3_k is removed. That is, the processing apparatus 1 newly removes the layered portion SL # 3_k + 1 by scanning the surface of the layered portion SL # 3_k + 1 including at least a part of the exposed surface WS # 3_k with the processing light EL.
  • the processing apparatus 1 has a larger moving range of the processing light EL when removing the layered portion SL # 3_k + 1 than the moving range of the processing light EL when removing the layered portion SL # 3_k.
  • the exposed surface WS # 3_k is irradiated with the processing light EL so as to be.
  • the processing apparatus 1 in the Y-axis direction (that is, the scanning direction), the position of the end portion on the ⁇ Y side of the moving range of the processing light EL when (i) the layered portion SL # 3_k + 1 is removed is the layered portion.
  • Processing light EL when removing SL # 3_k + 1 is located on the -Y side of the position of the end on the -Y side of the moving range of the processing light EL, and (ii) layered portion SL # 3_k + 1 is removed.
  • the exposed surface WS # 3_k so that the position of the end on the + Y side of the moving range of is the same as the position of the end on the + Y axis side of the moving range of the processing light EL when the layered portion SL # 3_k is removed. Is irradiated with processing light EL. That is, as shown in FIG.
  • the processing apparatus 1 sets the layered portion SL # 3_k. Each time it is removed, the processing light EL is irradiated to the third unit processing target portion W_unit # 3 so that the moving range of the processing light EL in the scanning direction becomes large.
  • the third unit processing target portion W_unit # 3 composed of a plurality of layered portions SL (in the example shown in FIG. 23, the layered portions SL # 3_1 to the layered portions SL # 3_6) , Removed from the processing target portion W_target. As a result, the removal of the processing target portion W_target is completed, and the concave portion PH is formed.
  • the work W can be appropriately processed.
  • the processing system SYS can appropriately process the boundary of a plurality of unit processing target portions W_unit constituting the processing target portion W_target. The reason will be described below.
  • the processing system SYS may process one unit processing target portion W_unit at once (that is, without dividing into a plurality of layered portions SL) in order to form a concave portion PH in the work W. It is supposed to be good. However, in the present embodiment, since the processing light EL is emitted from the processing apparatus 1 along the vertical direction (that is, the Z-axis direction), the work W is processed so as to form a vertical surface by irradiation with the processing light EL. It is not easy for the processing system SYS. Therefore, the wall surface remaining after one unit processing target portion W_unit is removed all at once (specifically, the side surface of the other unit processing target portion W_unit to be removed next) is relative to the vertical surface. It may tilt.
  • a wall surface inclined with respect to the vertical surface may remain.
  • the wall portion defined by such a wall surface may remain between one unit processing target portion W_unit and another unit processing target portion W_unit.
  • the processing system SYS removes a plurality of relatively thin layered portions SL constituting each processing target portion W_unit in order to remove each unit processing target portion W_unit. Therefore, the wall surface remaining after removing each unit processing target portion W_unit becomes an aggregate of a plurality of minute wall surfaces formed by sequentially removing the plurality of layered portions SL. Therefore, even if the minute wall surface itself is inclined with respect to the vertical surface, the inclination of the entire wall surface, which is an aggregate of a plurality of minute wall surfaces, is sufficiently small.
  • the boundary surface of the plurality of unit processing target portions W_unit becomes a vertical surface.
  • the boundary of the plurality of unit processing target portions W_unit is intentionally processed so as to have a substantially inclined stepped shape. Therefore, the processing system SYS can appropriately process such an intentionally formed stepped boundary surface so that no wall portion remains. This is because the shape and size of the boundary surface that the processing system SYS intentionally forms to have a stepped shape is known to the processing system SYS, so that the processing system SYS has the known shape and size.
  • the processing system SYS can appropriately process the boundary of the plurality of unit processing target portions W_unit. Specifically, the processing system SYS can process the work W so that the structure (for example, a wall-shaped structure) that cannot be completely removed does not remain between the plurality of unit processing target portions W_unit. ..
  • the machining system SYS sequentially removes the plurality of unit machining target portions W_unit arranged along the step direction in the same manner as in the case of sequentially removing the plurality of unit machining target portions W_unit arranged along the scanning direction. May be good. Specifically, when removing a plurality of unit machining target portions W_unit arranged along the step direction in order, the machining system SYS (i) removes the unit machining target portion W_unit to be removed first. The processing light EL is controlled so that the moving range of the processing light EL in the step direction becomes smaller each time the layered portion SL is removed, and (ii) the layered portion W_unit is removed in order to remove the unit processing target portion W_unit to be removed last.
  • the step direction In order to control the processing light EL so that the moving range of the processing light EL in the step direction becomes larger each time the partial SL is removed, and (iii) to remove the other unit processing target portion W_unit, the step direction. While the size of the moving range of the processing light EL is kept constant, the processing light EL is controlled so that the moving range of the processing light EL moves along the step direction each time the layered portion SL is removed. You may. In order to remove (i) the unit processing target portion W_unit to be removed first, the processing system SYS reduces the size of the layered portion SL in the step direction each time the layered portion SL is removed.
  • the processing light EL is set so that the size of the layered portion SL in the step direction increases each time the layered portion SL is removed. While the size of the layered portion SL in the step direction is kept constant in order to control and remove the other unit processing target portion W_unit (iii), the layered portion SL is removed each time the layered portion SL is removed.
  • the processing light EL may be controlled so that the region from which SL is removed moves along the step direction.
  • the processing apparatus 1 irradiates the work W with the processing light EL to perform removal processing for removing a part of the work W.
  • the processing apparatus 1 may irradiate the work W with the processing light EL to perform processing different from the removal processing.
  • the processing apparatus 1 may irradiate the work W with the processing light EL to perform additional processing on the work W.
  • the processing apparatus 1 may perform marking processing to form a desired pattern on the surface of the work W by changing at least a part of the characteristics of the surface of the work W by irradiation with the processing light EL.
  • the stage device 3 includes a stage drive system 33. However, the stage device 3 does not have to include the stage drive system 33. That is, the stage 32 does not have to move. If the stage 32 does not move, the stage device 3 may not include the position measuring instrument 34.
  • the machining system SYS includes drive systems 5 and 6. However, the processing system SYS may not include at least one of the drive systems 5 and 6. That is, at least one of the processing device 1 and the measuring device 2 does not have to move. In this case, the machining system SYS may not include at least one of the position measuring instruments 51 and 61.
  • the processing system SYS includes the measuring device 2. However, the processing system SYS does not have to include the measuring device 2. In this case, the processing system SYS does not have to include the drive system 6 and the position measuring instrument 61, which are the components related to the measuring device 2.
  • the processing apparatus 1 processes the work W by irradiating the work W with the processing light EL.
  • the processing apparatus 1 may process the work W by irradiating the work W with an arbitrary energy beam different from light (this energy beam may be referred to as a “processing beam”).
  • the processing device 1 may include a beam irradiating device capable of irradiating an arbitrary energy beam in addition to or in place of the light source 11.
  • An example of an arbitrary energy beam is a charged particle beam such as an electron beam and an ion beam.
  • Another example of an arbitrary energy beam is an electromagnetic wave.
  • the present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of claims and within a range not contrary to the gist or idea of the invention that can be read from the entire specification, and a beam processing apparatus accompanied by such a modification. Is also included in the technical scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2019/051135 2019-12-26 2019-12-26 ビーム加工装置 Ceased WO2021130962A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
EP19958060.6A EP4082713B1 (en) 2019-12-26 2019-12-26 Beam processing device
US17/787,818 US12594628B2 (en) 2019-12-26 2019-12-26 Beam processing apparatus
CN202410288952.1A CN117943695A (zh) 2019-12-26 2019-12-26 加工装置以及加工方法
CN202410288953.6A CN117943696A (zh) 2019-12-26 2019-12-26 加工装置以及加工方法
JP2021566684A JP7435626B2 (ja) 2019-12-26 2019-12-26 ビーム加工装置
CN201980103236.9A CN114845833B (zh) 2019-12-26 2019-12-26 射束加工装置以及射束加工方法
PCT/JP2019/051135 WO2021130962A1 (ja) 2019-12-26 2019-12-26 ビーム加工装置
JP2024017354A JP7772114B2 (ja) 2019-12-26 2024-02-07 ビーム加工装置

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JP7585451B1 (ja) 2023-12-27 2024-11-18 株式会社ソディック 三次元除去加工システム、加工プログラムの生成装置、三次元造形物の製造方法、および、プログラム
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EP4082713A4 (en) 2023-10-04
JP2024040305A (ja) 2024-03-25
CN114845833B (zh) 2024-04-05
US12594628B2 (en) 2026-04-07
EP4082713A1 (en) 2022-11-02
CN117943696A (zh) 2024-04-30
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JP7772114B2 (ja) 2025-11-18
JPWO2021130962A1 (https=) 2021-07-01

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