JP2016132035A5 - - Google Patents

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Publication number
JP2016132035A5
JP2016132035A5 JP2016005742A JP2016005742A JP2016132035A5 JP 2016132035 A5 JP2016132035 A5 JP 2016132035A5 JP 2016005742 A JP2016005742 A JP 2016005742A JP 2016005742 A JP2016005742 A JP 2016005742A JP 2016132035 A5 JP2016132035 A5 JP 2016132035A5
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Japan
Prior art keywords
laser beam
workpiece
view
field
engaging
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JP2016005742A
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Japanese (ja)
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JP2016132035A (ja
JP6159428B2 (ja
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Priority claimed from US14/599,612 external-priority patent/US10357848B2/en
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JP2016005742A 2015-01-19 2016-01-15 レーザ加工システム及び方法 Active JP6159428B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/599,612 US10357848B2 (en) 2015-01-19 2015-01-19 Laser machining systems and methods
US14/599,612 2015-01-19

Publications (3)

Publication Number Publication Date
JP2016132035A JP2016132035A (ja) 2016-07-25
JP2016132035A5 true JP2016132035A5 (https=) 2017-06-15
JP6159428B2 JP6159428B2 (ja) 2017-07-05

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JP2016005742A Active JP6159428B2 (ja) 2015-01-19 2016-01-15 レーザ加工システム及び方法

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US (2) US10357848B2 (https=)
EP (1) EP3050664B1 (https=)
JP (1) JP6159428B2 (https=)
CN (1) CN105798455B (https=)
BR (1) BR102016001021A2 (https=)
CA (1) CA2917563C (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108700661A (zh) * 2016-03-17 2018-10-23 伊雷克托科学工业股份有限公司 在镭射加工系统中的像平面的定位
CN109530928B (zh) * 2018-12-27 2021-03-05 北京中科镭特电子有限公司 一种激光加工芯片的方法及装置
JP7299597B2 (ja) * 2018-12-27 2023-06-28 国立大学法人 東京大学 レーザ加工におけるレーザ光強度への依存性の判定方法及びレーザ加工装置
CN109530929B (zh) * 2018-12-27 2021-03-19 北京中科镭特电子有限公司 一种激光加工芯片的方法
CN110181172B (zh) * 2019-06-06 2024-08-20 武汉华工激光工程有限责任公司 一种激光加工陶瓷异形槽的装置及方法
DE102019125124A1 (de) * 2019-09-18 2021-03-18 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
DE102019134004A1 (de) 2019-12-11 2021-06-17 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
CN111098043B (zh) * 2020-01-19 2024-12-27 中国科学院宁波材料技术与工程研究所 水导激光加工装置和加工系统
JP7599776B2 (ja) 2020-10-02 2024-12-16 株式会社ディスコ 被加工物の加工方法
KR102921493B1 (ko) * 2021-01-27 2026-02-02 삼성디스플레이 주식회사 표시 장치의 제조장치
CN115301636A (zh) * 2022-08-12 2022-11-08 阳程科技股份有限公司 激光除胶方法及采用该方法的除胶设备

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3792928A (en) * 1972-02-28 1974-02-19 Schlumberger Compteurs Fiber optics distance converting technique
JPS57175089A (en) * 1981-04-20 1982-10-27 Inoue Japax Res Inc Beam working device
US4638800A (en) * 1985-02-08 1987-01-27 Research Physics, Inc Laser beam surgical system
JP2790851B2 (ja) 1989-05-09 1998-08-27 株式会社リコー 光走査装置
US5151389A (en) * 1990-09-10 1992-09-29 Rockwell International Corporation Method for dicing semiconductor substrates using an excimer laser beam
GB9202434D0 (en) * 1992-02-05 1992-03-18 Xaar Ltd Method of and apparatus for forming nozzles
US5367399A (en) * 1992-02-13 1994-11-22 Holotek Ltd. Rotationally symmetric dual reflection optical beam scanner and system using same
JP3207619B2 (ja) 1993-06-29 2001-09-10 ホーヤ株式会社 レーザ配線方法及びその装置
US5685636A (en) * 1995-08-23 1997-11-11 Science And Engineering Associates, Inc. Eye safe laser security device
US5744780A (en) 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
US5638176A (en) * 1996-06-25 1997-06-10 International Business Machines Corporation Inexpensive interferometric eye tracking system
US6294778B1 (en) * 1999-04-22 2001-09-25 Ecrm, Inc. Method and apparatus for recording a flat field image
US6285002B1 (en) * 1999-05-10 2001-09-04 Bryan Kok Ann Ngoi Three dimensional micro machining with a modulated ultra-short laser pulse
JP3201394B2 (ja) * 1999-08-10 2001-08-20 住友電気工業株式会社 ｆθレンズ
US6501045B1 (en) * 2000-04-06 2002-12-31 Resonetics, Inc. Method and apparatus for controlling the taper angle of the walls of laser machined features
US6455807B1 (en) * 2000-06-26 2002-09-24 W.A. Whitney Co. Method and apparatus for controlling a laser-equipped machine tool to prevent self-burning
JP2004512690A (ja) 2000-10-26 2004-04-22 エグシル　テクノロジー　リミテッド レーザ加工の制御
GB0029038D0 (en) * 2000-11-29 2001-01-10 Owen Geoffrey D Refractive optical deflector
WO2002076666A2 (en) * 2001-03-22 2002-10-03 Xsil Technology Limited A laser machining system and method
US7357486B2 (en) * 2001-12-20 2008-04-15 Hewlett-Packard Development Company, L.P. Method of laser machining a fluid slot
US6951995B2 (en) * 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US20040188401A1 (en) 2003-03-28 2004-09-30 Sadao Mori Laser processing apparatus
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
CN101501243A (zh) * 2006-02-17 2009-08-05 康乃尔研究基金会有限公司 膜生长期间的特性改变
JP2007307599A (ja) * 2006-05-20 2007-11-29 Sumitomo Electric Ind Ltd スルーホール成形体およびレーザー加工方法
WO2008091380A2 (en) 2006-08-22 2008-07-31 Gsi Group Corporation System and method for employing a resonant scanner in an x-y high speed drilling system
US20090323739A1 (en) * 2006-12-22 2009-12-31 Uv Tech Systems Laser optical system
US7742212B2 (en) * 2007-02-14 2010-06-22 Michael J. Scaggs Precision laser machining apparatus
US7489429B2 (en) 2007-02-14 2009-02-10 Michael J. Scaggs Precision laser machining apparatus
US20090057282A1 (en) 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
JP2009072789A (ja) 2007-09-18 2009-04-09 Hamamatsu Photonics Kk レーザ加工装置
JP4386137B2 (ja) 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP5826027B2 (ja) * 2008-03-21 2015-12-02 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
US8237080B2 (en) 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
JP2009297781A (ja) 2008-06-17 2009-12-24 Kataoka Seisakusho:Kk レーザ加工装置
EP2393625A1 (en) 2009-02-03 2011-12-14 Abbott Cardiovascular Systems Inc. Improved laser cutting process for forming stents
US8340485B2 (en) * 2009-05-29 2012-12-25 Corning Cable Systems Llc Laser-shaped optical fibers along with optical assemblies and methods therefor
CN101856772A (zh) 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
JP2012071314A (ja) 2010-09-27 2012-04-12 Mitsubishi Heavy Ind Ltd 複合材の加工方法及び複合材の加工装置
CN110039173B (zh) * 2010-10-22 2021-03-23 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法
US20120132629A1 (en) 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
US8462439B2 (en) * 2011-08-22 2013-06-11 Bae Systems Information And Electronic Systems Integration Inc. Athermal apochromatic telecentric F-theta lens with low F-number
JP5953198B2 (ja) 2011-09-28 2016-07-20 株式会社リプス・ワークス 極短パルスレーザによる多次元パターン形成装置及び形成方法
US9931712B2 (en) 2012-01-11 2018-04-03 Pim Snow Leopard Inc. Laser drilling and trepanning device
US20140104413A1 (en) * 2012-10-16 2014-04-17 Hand Held Products, Inc. Integrated dimensioning and weighing system
JP2016516584A (ja) * 2013-03-15 2016-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド テーパ制御のためのビーム角度とワークピース移動の連係方法
JP6064228B2 (ja) 2013-05-24 2017-01-25 パナソニックＩｐマネジメント株式会社 レーザ切断装置およびレーザ切断方法

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