JPWO2021111243A1 - - Google Patents

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Publication number
JPWO2021111243A1
JPWO2021111243A1 JP2021562199A JP2021562199A JPWO2021111243A1 JP WO2021111243 A1 JPWO2021111243 A1 JP WO2021111243A1 JP 2021562199 A JP2021562199 A JP 2021562199A JP 2021562199 A JP2021562199 A JP 2021562199A JP WO2021111243 A1 JPWO2021111243 A1 JP WO2021111243A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021562199A
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Japanese (ja)
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JPWO2021111243A5 (https=
JP7714471B2 (ja
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Publication of JPWO2021111243A1 publication Critical patent/JPWO2021111243A1/ja
Publication of JPWO2021111243A5 publication Critical patent/JPWO2021111243A5/ja
Priority to JP2025119962A priority Critical patent/JP2025157403A/ja
Application granted granted Critical
Publication of JP7714471B2 publication Critical patent/JP7714471B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/405—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
    • H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/10—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional [3D] arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/693—Vertical IGFETs having charge trapping gate insulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
JP2021562199A 2019-12-06 2020-11-24 半導体装置および電子機器 Active JP7714471B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025119962A JP2025157403A (ja) 2019-12-06 2025-07-16 半導体装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019220945 2019-12-06
JP2019220945 2019-12-06
JP2020069023 2020-04-07
JP2020069023 2020-04-07
PCT/IB2020/061059 WO2021111243A1 (ja) 2019-12-06 2020-11-24 半導体装置および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025119962A Division JP2025157403A (ja) 2019-12-06 2025-07-16 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2021111243A1 true JPWO2021111243A1 (https=) 2021-06-10
JPWO2021111243A5 JPWO2021111243A5 (https=) 2023-11-27
JP7714471B2 JP7714471B2 (ja) 2025-07-29

Family

ID=76221085

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021562199A Active JP7714471B2 (ja) 2019-12-06 2020-11-24 半導体装置および電子機器
JP2025119962A Pending JP2025157403A (ja) 2019-12-06 2025-07-16 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025119962A Pending JP2025157403A (ja) 2019-12-06 2025-07-16 半導体装置

Country Status (5)

Country Link
US (1) US12207462B2 (https=)
JP (2) JP7714471B2 (https=)
KR (1) KR20220110201A (https=)
CN (1) CN114787998A (https=)
WO (1) WO2021111243A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12444466B2 (en) * 2020-01-16 2025-10-14 Semiconductor Energy Laboratory Co., Ltd. Memory device and method for manufacturing the same
CN116368602A (zh) 2020-10-02 2023-06-30 株式会社半导体能源研究所 半导体装置
KR102910882B1 (ko) * 2021-06-21 2026-01-14 삼성전자주식회사 반도체 장치 및 이를 포함하는 데이터 저장 시스템
US20230354578A1 (en) * 2022-04-28 2023-11-02 Yangtze Memory Technologies Co., Ltd. Dynamic flash memory (dfm) with channel first scheme

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018207039A (ja) * 2017-06-08 2018-12-27 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
WO2019003060A1 (ja) * 2017-06-27 2019-01-03 株式会社半導体エネルギー研究所 半導体装置、半導体ウェハ、記憶装置、及び電子機器
JP2019009259A (ja) * 2017-06-23 2019-01-17 株式会社半導体エネルギー研究所 半導体装置
JP2019024087A (ja) * 2017-07-21 2019-02-14 株式会社半導体エネルギー研究所 半導体装置、半導体ウェハ、記憶装置、及び電子機器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6756631B2 (en) * 2002-11-14 2004-06-29 Intelligent Sources Development Corp. Stacked-gate cell structure and its NAND-type flash memory array
KR100880338B1 (ko) * 2006-12-04 2009-01-28 주식회사 하이닉스반도체 플래시 메모리 소자의 제조방법
US9076824B2 (en) * 2012-11-02 2015-07-07 Micron Technology, Inc. Memory arrays with a memory cell adjacent to a smaller size of a pillar having a greater channel length than a memory cell adjacent to a larger size of the pillar and methods
KR20160094186A (ko) * 2015-01-30 2016-08-09 에스케이하이닉스 주식회사 반도체 장치 및 이의 제조방법
JP2016225614A (ja) 2015-05-26 2016-12-28 株式会社半導体エネルギー研究所 半導体装置
JP6693907B2 (ja) 2017-06-08 2020-05-13 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
JP7195068B2 (ja) 2017-06-26 2022-12-23 株式会社半導体エネルギー研究所 半導体装置、電子機器
TWI882001B (zh) * 2019-10-31 2025-05-01 日商半導體能源研究所股份有限公司 半導體裝置及電子裝置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018207039A (ja) * 2017-06-08 2018-12-27 株式会社半導体エネルギー研究所 半導体装置、記憶装置、及び電子機器
JP2019009259A (ja) * 2017-06-23 2019-01-17 株式会社半導体エネルギー研究所 半導体装置
WO2019003060A1 (ja) * 2017-06-27 2019-01-03 株式会社半導体エネルギー研究所 半導体装置、半導体ウェハ、記憶装置、及び電子機器
JP2019024087A (ja) * 2017-07-21 2019-02-14 株式会社半導体エネルギー研究所 半導体装置、半導体ウェハ、記憶装置、及び電子機器

Also Published As

Publication number Publication date
US12207462B2 (en) 2025-01-21
CN114787998A (zh) 2022-07-22
JP7714471B2 (ja) 2025-07-29
US20220399355A1 (en) 2022-12-15
WO2021111243A1 (ja) 2021-06-10
JP2025157403A (ja) 2025-10-15
KR20220110201A (ko) 2022-08-05

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