JPWO2021085078A1 - - Google Patents

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Publication number
JPWO2021085078A1
JPWO2021085078A1 JP2021554269A JP2021554269A JPWO2021085078A1 JP WO2021085078 A1 JPWO2021085078 A1 JP WO2021085078A1 JP 2021554269 A JP2021554269 A JP 2021554269A JP 2021554269 A JP2021554269 A JP 2021554269A JP WO2021085078 A1 JPWO2021085078 A1 JP WO2021085078A1
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JP
Japan
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JP2021554269A
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Japanese (ja)
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JPWO2021085078A5 (https=
JP7642947B2 (ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/63—Vertical IGFETs
    • H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/109—Reduced surface field [RESURF] PN junction structures
    • H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/125—Shapes of junctions between the regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156—Drain regions of DMOS transistors
    • H10D62/157—Impurity concentrations or distributions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156—Drain regions of DMOS transistors
    • H10D62/159—Shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393—Body regions of DMOS transistors or IGBTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50—Physical imperfections
    • H10D62/53—Physical imperfections the imperfections being within the semiconductor body 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
JP2021554269A 2019-10-29 2020-10-09 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 Active JP7642947B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025009115A JP7836051B2 (ja) 2019-10-29 2025-01-22 炭化珪素半導体装置および炭化珪素半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019196257 2019-10-29
JP2019196257 2019-10-29
PCT/JP2020/038231 WO2021085078A1 (ja) 2019-10-29 2020-10-09 炭化珪素半導体装置および炭化珪素半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025009115A Division JP7836051B2 (ja) 2019-10-29 2025-01-22 炭化珪素半導体装置および炭化珪素半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021085078A1 true JPWO2021085078A1 (https=) 2021-05-06
JPWO2021085078A5 JPWO2021085078A5 (https=) 2022-07-05
JP7642947B2 JP7642947B2 (ja) 2025-03-11

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JP2021554269A Active JP7642947B2 (ja) 2019-10-29 2020-10-09 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
JP2025009115A Active JP7836051B2 (ja) 2019-10-29 2025-01-22 炭化珪素半導体装置および炭化珪素半導体装置の製造方法

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Country Status (5)

Country Link
US (1) US12302621B2 (https=)
JP (2) JP7642947B2 (https=)
CN (1) CN114600250B (https=)
DE (1) DE112020005203T5 (https=)
WO (1) WO2021085078A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202100001922A1 (it) * 2021-01-29 2022-07-29 St Microelectronics Srl Struttura di contatto dal retro perfezionata per un dispositivo a semiconduttore e relativo procedimento di fabbricazione
JP2024093631A (ja) * 2022-12-27 2024-07-09 株式会社デンソー 半導体装置とその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014099483A (ja) * 2012-11-13 2014-05-29 Fuji Electric Co Ltd 炭化珪素半導体装置の製造方法
WO2015064256A1 (ja) * 2013-10-28 2015-05-07 富士電機株式会社 炭化シリコン半導体装置及びその製造方法
JP2016006900A (ja) * 2015-08-18 2016-01-14 住友電気工業株式会社 半導体装置の製造方法および半導体装置
JP2019520703A (ja) * 2016-05-31 2019-07-18 クリー インコーポレイテッドＣｒｅｅ Ｉｎｃ． イオン注入チャネリング技術により形成される超接合パワーシリコンカーバイド半導体デバイス及び関連方法
JP2019526963A (ja) * 2016-08-08 2019-09-19 パワー・インテグレーションズ・インコーポレーテッド 半導体スイッチングデバイスの高速温度検出のための集積回路

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119022A (ja) * 1999-10-20 2001-04-27 Fuji Electric Co Ltd 半導体装置及びその製造方法
US9209027B1 (en) * 2014-08-14 2015-12-08 Infineon Technologies Ag Adjusting the charge carrier lifetime in a bipolar semiconductor device
JP6584879B2 (ja) * 2015-09-11 2019-10-02 株式会社東芝 半導体装置
JP2017168666A (ja) * 2016-03-16 2017-09-21 株式会社東芝 半導体装置
WO2017179377A1 (ja) * 2016-04-14 2017-10-19 住友電気工業株式会社 炭化珪素半導体装置およびその製造方法
JP6950398B2 (ja) * 2017-09-21 2021-10-13 住友電気工業株式会社 炭化珪素半導体装置
JP2019196257A (ja) 2018-05-10 2019-11-14 キヤノンファインテックニスカ株式会社 シート処理装置
WO2022009549A1 (ja) * 2020-07-10 2022-01-13 住友電気工業株式会社 炭化珪素半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014099483A (ja) * 2012-11-13 2014-05-29 Fuji Electric Co Ltd 炭化珪素半導体装置の製造方法
WO2015064256A1 (ja) * 2013-10-28 2015-05-07 富士電機株式会社 炭化シリコン半導体装置及びその製造方法
JP2016006900A (ja) * 2015-08-18 2016-01-14 住友電気工業株式会社 半導体装置の製造方法および半導体装置
JP2019520703A (ja) * 2016-05-31 2019-07-18 クリー インコーポレイテッドＣｒｅｅ Ｉｎｃ． イオン注入チャネリング技術により形成される超接合パワーシリコンカーバイド半導体デバイス及び関連方法
JP2019526963A (ja) * 2016-08-08 2019-09-19 パワー・インテグレーションズ・インコーポレーテッド 半導体スイッチングデバイスの高速温度検出のための集積回路

Also Published As

Publication number Publication date
DE112020005203T5 (de) 2022-07-28
CN114600250A (zh) 2022-06-07
CN114600250B (zh) 2026-03-13
JP2025063267A (ja) 2025-04-15
JP7836051B2 (ja) 2026-03-26
WO2021085078A1 (ja) 2021-05-06
JP7642947B2 (ja) 2025-03-11
US12302621B2 (en) 2025-05-13
US20220376065A1 (en) 2022-11-24

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