JPWO2021084994A1 - - Google Patents

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Publication number
JPWO2021084994A1
JPWO2021084994A1 JP2021554193A JP2021554193A JPWO2021084994A1 JP WO2021084994 A1 JPWO2021084994 A1 JP WO2021084994A1 JP 2021554193 A JP2021554193 A JP 2021554193A JP 2021554193 A JP2021554193 A JP 2021554193A JP WO2021084994 A1 JPWO2021084994 A1 JP WO2021084994A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021554193A
Other languages
Japanese (ja)
Other versions
JPWO2021084994A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021084994A1 publication Critical patent/JPWO2021084994A1/ja
Publication of JPWO2021084994A5 publication Critical patent/JPWO2021084994A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/131—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements including elements passing infrared wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/135—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on four or more different wavelength filter elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021554193A 2019-10-30 2020-09-28 Pending JPWO2021084994A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019197384 2019-10-30
PCT/JP2020/036495 WO2021084994A1 (ja) 2019-10-30 2020-09-28 撮像素子

Publications (2)

Publication Number Publication Date
JPWO2021084994A1 true JPWO2021084994A1 (https=) 2021-05-06
JPWO2021084994A5 JPWO2021084994A5 (https=) 2022-07-06

Family

ID=75715079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554193A Pending JPWO2021084994A1 (https=) 2019-10-30 2020-09-28

Country Status (4)

Country Link
US (1) US20220217294A1 (https=)
JP (1) JPWO2021084994A1 (https=)
CN (1) CN114556572A (https=)
WO (1) WO2021084994A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022197379A2 (en) * 2021-02-01 2022-09-22 Northwestern University Wavelength converting natural vision system
WO2025088923A1 (ja) * 2023-10-26 2025-05-01 パナソニックＩｐマネジメント株式会社 撮像装置およびカメラシステム
WO2025197482A1 (ja) * 2024-03-19 2025-09-25 パナソニックＩｐマネジメント株式会社 撮像装置及びカメラシステム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148175A (ja) * 1989-11-02 1991-06-24 Fujitsu Ltd 赤外線検知装置
JPH0513741A (ja) * 1991-06-28 1993-01-22 Yokogawa Electric Corp 半導体光検出装置
JP2015073070A (ja) * 2013-10-02 2015-04-16 采▲ぎょく▼科技股▲ふん▼有限公司ＶｉｓＥｒａ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｍｐａｎｙ Ｌｉｍｉｔｅｄ 光電変換層の隔壁を有する撮像装置
KR20180040556A (ko) * 2018-04-13 2018-04-20 삼성전자주식회사 유기 광전 변환부를 채용한 이미지 센서

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353626A (ja) * 2004-06-08 2005-12-22 Fuji Photo Film Co Ltd 光電変換膜積層型固体撮像素子及びその製造方法
JP2007066962A (ja) * 2005-08-29 2007-03-15 Fujifilm Corp カラー固体撮像装置及びデジタルカメラ
JP5180538B2 (ja) * 2007-08-27 2013-04-10 キヤノン株式会社 撮像素子及び撮像装置
WO2011055638A1 (en) * 2009-11-06 2011-05-12 Semiconductor Energy Laboratory Co., Ltd. Display device
JP5117523B2 (ja) * 2010-03-09 2013-01-16 株式会社東芝 固体撮像装置
JP5724309B2 (ja) * 2010-11-12 2015-05-27 富士通株式会社 赤外線イメージセンサ及び赤外線撮像装置
JP6079502B2 (ja) * 2013-08-19 2017-02-15 ソニー株式会社 固体撮像素子および電子機器
TWI505455B (zh) * 2013-09-27 2015-10-21 Maxchip Electronics Corp 光感測器
KR20150123088A (ko) * 2014-04-24 2015-11-03 삼성전자주식회사 스큐드 픽셀 구조를 갖는 이미지 센서를 포함하는 이미지 데이터 처리 장치
JP2016012642A (ja) * 2014-06-27 2016-01-21 パナソニックＩｐマネジメント株式会社 固体撮像装置及びその制御方法
WO2016002576A1 (ja) * 2014-07-03 2016-01-07 ソニー株式会社 固体撮像素子、および電子装置
US9967501B2 (en) * 2014-10-08 2018-05-08 Panasonic Intellectual Property Management Co., Ltd. Imaging device
CN111968998B (zh) * 2014-12-26 2024-12-13 松下知识产权经营株式会社 摄像装置
KR20160100569A (ko) * 2015-02-16 2016-08-24 삼성전자주식회사 이미지 센서 및 이미지 센서를 포함하는 촬상 장치
KR102701853B1 (ko) * 2015-12-14 2024-09-02 삼성전자주식회사 이미지 센서
DE102015225797B3 (de) * 2015-12-17 2017-05-04 Robert Bosch Gmbh Optischer Detektor
KR102560758B1 (ko) * 2017-01-03 2023-07-28 삼성전자주식회사 이미지 센서
JP6860390B2 (ja) * 2017-03-22 2021-04-14 キヤノン株式会社 撮像素子及びその制御方法、撮像装置、焦点検出装置及び方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148175A (ja) * 1989-11-02 1991-06-24 Fujitsu Ltd 赤外線検知装置
JPH0513741A (ja) * 1991-06-28 1993-01-22 Yokogawa Electric Corp 半導体光検出装置
JP2015073070A (ja) * 2013-10-02 2015-04-16 采▲ぎょく▼科技股▲ふん▼有限公司ＶｉｓＥｒａ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏｍｐａｎｙ Ｌｉｍｉｔｅｄ 光電変換層の隔壁を有する撮像装置
KR20180040556A (ko) * 2018-04-13 2018-04-20 삼성전자주식회사 유기 광전 변환부를 채용한 이미지 센서

Also Published As

Publication number Publication date
US20220217294A1 (en) 2022-07-07
WO2021084994A1 (ja) 2021-05-06
CN114556572A (zh) 2022-05-27

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