JPWO2021070367A5 - - Google Patents
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- JPWO2021070367A5 JPWO2021070367A5 JP2021551078A JP2021551078A JPWO2021070367A5 JP WO2021070367 A5 JPWO2021070367 A5 JP WO2021070367A5 JP 2021551078 A JP2021551078 A JP 2021551078A JP 2021551078 A JP2021551078 A JP 2021551078A JP WO2021070367 A5 JPWO2021070367 A5 JP WO2021070367A5
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- JP
- Japan
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/040259 WO2021070367A1 (ja) | 2019-10-11 | 2019-10-11 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021070367A1 JPWO2021070367A1 (https=) | 2021-04-15 |
| JPWO2021070367A5 true JPWO2021070367A5 (https=) | 2022-12-07 |
| JP7315016B2 JP7315016B2 (ja) | 2023-07-26 |
Family
ID=75438139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021551078A Active JP7315016B2 (ja) | 2019-10-11 | 2019-10-11 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12154904B2 (https=) |
| JP (1) | JP7315016B2 (https=) |
| CN (1) | CN114514603B (https=) |
| WO (1) | WO2021070367A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023112682A1 (ja) * | 2021-12-17 | 2023-06-22 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| JPWO2023127385A1 (https=) * | 2021-12-27 | 2023-07-06 | ||
| WO2023166674A1 (ja) * | 2022-03-03 | 2023-09-07 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| US12402293B2 (en) | 2022-09-23 | 2025-08-26 | Apple Inc. | Stacked SRAM cell architecture |
| US12482750B2 (en) | 2022-10-17 | 2025-11-25 | International Business Machines Corporation | Power distribution network with backside power rail |
| WO2024162070A1 (ja) * | 2023-01-31 | 2024-08-08 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| WO2024166906A1 (ja) * | 2023-02-08 | 2024-08-15 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| JPWO2024252660A1 (https=) * | 2023-06-09 | 2024-12-12 | ||
| WO2025009171A1 (ja) * | 2023-07-06 | 2025-01-09 | 株式会社ソシオネクスト | 半導体集積回路装置 |
| WO2026033396A1 (ja) * | 2024-08-08 | 2026-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5326689A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Semiconductor integrated circuit unit |
| JP2972425B2 (ja) * | 1992-01-30 | 1999-11-08 | 日本電気アイシーマイコンシステム株式会社 | 半導体集積回路 |
| JPH11102910A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | 半導体集積回路 |
| JP2009177200A (ja) * | 1998-05-01 | 2009-08-06 | Sony Corp | 半導体記憶装置 |
| JP2009124667A (ja) * | 2007-01-25 | 2009-06-04 | Panasonic Corp | 双方向スイッチ及びその駆動方法 |
| JP2009302198A (ja) | 2008-06-11 | 2009-12-24 | Elpida Memory Inc | 半導体チップ、半導体チップ群および半導体装置 |
| JP2012044042A (ja) | 2010-08-20 | 2012-03-01 | Kawasaki Microelectronics Inc | 半導体集積回路および半導体集積回路装置 |
| US8530273B2 (en) | 2010-09-29 | 2013-09-10 | Guardian Industries Corp. | Method of making oxide thin film transistor array |
| DE102013207324A1 (de) | 2012-05-11 | 2013-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und elektronisches Gerät |
| JP2014165358A (ja) * | 2013-02-26 | 2014-09-08 | Panasonic Corp | 半導体装置及びその製造方法 |
| EP2884542A3 (en) | 2013-12-10 | 2015-09-02 | IMEC vzw | Integrated circuit device with power gating switch in back end of line |
| US9559040B2 (en) | 2013-12-30 | 2017-01-31 | International Business Machines Corporation | Double-sided segmented line architecture in 3D integration |
| US9754923B1 (en) | 2016-05-09 | 2017-09-05 | Qualcomm Incorporated | Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs) |
| EP3324436B1 (en) | 2016-11-21 | 2020-08-05 | IMEC vzw | An integrated circuit chip with power delivery network on the backside of the chip |
| US10950546B1 (en) | 2019-09-17 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device including back side power supply circuit |
| US11004789B2 (en) | 2019-09-30 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device including back side power supply circuit |
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2019
- 2019-10-11 JP JP2021551078A patent/JP7315016B2/ja active Active
- 2019-10-11 CN CN201980101203.0A patent/CN114514603B/zh active Active
- 2019-10-11 WO PCT/JP2019/040259 patent/WO2021070367A1/ja not_active Ceased
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2022
- 2022-04-06 US US17/714,683 patent/US12154904B2/en active Active
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2024
- 2024-10-28 US US18/929,016 patent/US20250056879A1/en active Pending