JPWO2021016229A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2021016229A5
JPWO2021016229A5 JP2022504087A JP2022504087A JPWO2021016229A5 JP WO2021016229 A5 JPWO2021016229 A5 JP WO2021016229A5 JP 2022504087 A JP2022504087 A JP 2022504087A JP 2022504087 A JP2022504087 A JP 2022504087A JP WO2021016229 A5 JPWO2021016229 A5 JP WO2021016229A5
Authority
JP
Japan
Prior art keywords
radiation
layer
clusters
rsn
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022504087A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022541818A (ja
JP2022541818A5 (https=
JP7715703B2 (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2020/042857 external-priority patent/WO2021016229A1/en
Publication of JP2022541818A publication Critical patent/JP2022541818A/ja
Publication of JP2022541818A5 publication Critical patent/JP2022541818A5/ja
Publication of JPWO2021016229A5 publication Critical patent/JPWO2021016229A5/ja
Priority to JP2025043467A priority Critical patent/JP7837448B2/ja
Application granted granted Critical
Publication of JP7715703B2 publication Critical patent/JP7715703B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022504087A 2019-07-22 2020-07-21 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用 Active JP7715703B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025043467A JP7837448B2 (ja) 2019-07-22 2025-03-18 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962876842P 2019-07-22 2019-07-22
US62/876,842 2019-07-22
PCT/US2020/042857 WO2021016229A1 (en) 2019-07-22 2020-07-21 Organometallic metal chalcogenide clusters and application to lithography

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025043467A Division JP7837448B2 (ja) 2019-07-22 2025-03-18 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用

Publications (4)

Publication Number Publication Date
JP2022541818A JP2022541818A (ja) 2022-09-27
JP2022541818A5 JP2022541818A5 (https=) 2023-07-27
JPWO2021016229A5 true JPWO2021016229A5 (https=) 2023-07-27
JP7715703B2 JP7715703B2 (ja) 2025-07-30

Family

ID=74189783

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022504087A Active JP7715703B2 (ja) 2019-07-22 2020-07-21 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用
JP2025043467A Active JP7837448B2 (ja) 2019-07-22 2025-03-18 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025043467A Active JP7837448B2 (ja) 2019-07-22 2025-03-18 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用

Country Status (6)

Country Link
US (2) US20210026241A1 (https=)
EP (2) EP4647842A3 (https=)
JP (2) JP7715703B2 (https=)
KR (2) KR102841238B1 (https=)
TW (1) TWI856141B (https=)
WO (1) WO2021016229A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12416861B2 (en) 2019-04-12 2025-09-16 Inpria Corporation Organometallic photoresist developer compositions and processing methods
US11579531B2 (en) 2019-09-25 2023-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Organometallic cluster photoresists for EUV lithography
EP4115242A4 (en) * 2020-03-02 2024-03-13 Inpria Corporation PROCESSING ENVIRONMENT FOR THE FORMATION OF INORGANIC RESERVE PATTERNS
US20220365428A1 (en) * 2021-05-14 2022-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist materials and associated methods
US11906901B2 (en) 2021-06-07 2024-02-20 International Business Machines Corporation Alternating copolymer chain scission photoresists
CN114736236B (zh) * 2022-03-21 2023-09-29 中国科学院福建物质结构研究所 一种多核环状有机锡氧硫簇合物及其制备方法和应用
CN117148669B (zh) * 2022-05-24 2025-11-14 上海新阳半导体材料股份有限公司 一种euv光刻胶及其制备方法和应用
CN117417371A (zh) * 2022-07-11 2024-01-19 中国科学院福建物质结构研究所 一种p1型零维金属硫属簇合物以及制备方法和应用
KR102904140B1 (ko) * 2022-08-19 2025-12-23 삼성에스디아이 주식회사 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법
CN117659420A (zh) 2022-08-29 2024-03-08 清华大学 一种Zn基有机配位纳米颗粒、光刻胶组合物及其制备方法与应用
US20240168373A1 (en) * 2022-10-11 2024-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and formation method thereof
JPWO2024157904A1 (https=) 2023-01-23 2024-08-02
CN120641830A (zh) 2023-02-28 2025-09-12 日产化学株式会社 具有碳-碳双键的含硅抗蚀剂下层膜形成用组合物
CN116375762B (zh) * 2023-04-06 2024-10-01 中国科学院福建物质结构研究所 一种镧锡异金属氧硫簇合物及其制备方法和应用
CN116478205B (zh) * 2023-04-25 2024-10-01 中国科学院福建物质结构研究所 一种亚硒酸根配位的有机锡氧簇合物及其制备方法和应用
JPWO2024242120A1 (https=) * 2023-05-24 2024-11-28
KR20260012803A (ko) 2023-05-24 2026-01-27 도오꾜오까고오교 가부시끼가이샤 패턴 형성 방법 및 금속 화합물 함유막용 처리액
JP2026000111A (ja) 2024-06-17 2026-01-05 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2873288A (en) 1956-09-18 1959-02-10 Metal & Thermit Corp Process for the preparation of vinyl tin compounds
US4255320A (en) * 1978-06-08 1981-03-10 Argus Chemical Corporation Mixtures of alkyltin sulfides and alkyltin 2-acyloxyethlymecaptides as stabilizer compositons for polyvinyl chloride resin compositions
US4737425A (en) * 1986-06-10 1988-04-12 International Business Machines Corporation Patterned resist and process
JPH07133391A (ja) * 1993-11-11 1995-05-23 Kyodo Yakuhin Kk 熱安定性に優れる含ハロゲン樹脂組成物
TWI299527B (en) * 2006-04-11 2008-08-01 Taiwan Tft Lcd Ass A fabrication method of thin film for active layer by metal chalcogenide precursor solution
US9281207B2 (en) * 2011-02-28 2016-03-08 Inpria Corporation Solution processible hardmasks for high resolution lithography
US9310684B2 (en) 2013-08-22 2016-04-12 Inpria Corporation Organometallic solution based high resolution patterning compositions
KR102696070B1 (ko) 2014-10-23 2024-08-16 인프리아 코포레이션 유기 금속 용액 기반의 고해상도 패터닝 조성물 및 상응하는 방법
EP4273625A3 (en) * 2015-10-13 2024-02-28 Inpria Corporation Organotin oxide hydroxide patterning compositions, precursors, and patterning
PL3437710T3 (pl) * 2016-03-29 2022-02-21 Toray Industries, Inc. Laminowany, odporny na ciepło filtr z siarczku poliarylenu
JP2019524647A (ja) * 2016-06-10 2019-09-05 フィリップス−ウニヴェルシテート・マールブルク 分子白色光エミッター
KR102791311B1 (ko) 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
KR102918243B1 (ko) * 2017-11-20 2026-01-26 인프리아 코포레이션 유기주석 클러스터, 유기주석 클러스터의 용액, 및 고해상도 패턴화에 대한 적용

Similar Documents

Publication Publication Date Title
JPWO2021016229A5 (https=)
JP2025094086A5 (https=)
JP7638944B2 (ja) スズ十二量体、及び強いeuv吸収を有する放射線パターニング可能なコーティング
JP7837448B2 (ja) 有機金属の金属カルコゲナイドクラスター及びリソグラフィへの応用
JP2519625B2 (ja) 基板表面からの金属含有汚染物の除去剤と洗浄法
CA1175279A (en) Solid state devices produced by plasma developing of resists
JP5189894B2 (ja) 表面修飾された炭素ナノチューブおよびこれを含む組成物
KR20220035149A (ko) 기판 상의 무기 방사선 패터닝 조성물의 안정화된 인터페이스
JP2659055B2 (ja) 高感度の乾式現像可能な深uv光用ホトレジスト
JPH08507870A (ja) 蒸着方法
JPH0379377B2 (https=)
US20230312619A1 (en) Organometallic tin compounds as euv photoresist
TW202343163A (zh) 用於洗淨金屬阻劑之洗淨液,及使用該洗淨液之洗淨方法
US20240134275A1 (en) Organometallic tin clusters as euv photoresist
JP7634650B2 (ja) 高エネルギー線用レジスト組成物、高エネルギー線用レジスト組成物の製造方法、レジストパターン形成方法、及び半導体装置の製造方法
CN116088270A (zh) 光刻胶组合物、近场表层成像的图案形成方法及沉积设备
JP7738469B2 (ja) 金属レジスト用現像液、現像方法及び金属レジストパターン形成方法
JPS6113245A (ja) スピンキヤスタブルレジスト組成物およびその使用方法
KR102448220B1 (ko) 포토레지스트 제거제 조성물
WO2023086682A1 (en) Lithography compositions and methods for forming resist patterns and/or making semiconductor devices
TW202035761A (zh) 抑制晶圓上的缺陷性、金屬微粒汙染、及膜成長的系統及方法
JP4669737B2 (ja) フォトレジスト除去用シンナー組成物及びそれを用いた半導体装置又は液晶表示装置の製造方法
JP4476492B2 (ja) 電子線レジスト
KR102918357B1 (ko) 포토리소그래피용 레지스트 조성물 및 이를 이용한 반도체 소자의 제조방법
CN118978546B (zh) 一类三核锡络合物、其制备方法及在极紫外光刻和电子束光刻中的应用