JPWO2021001995A1 - - Google Patents

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Publication number
JPWO2021001995A1
JPWO2021001995A1 JP2021529657A JP2021529657A JPWO2021001995A1 JP WO2021001995 A1 JPWO2021001995 A1 JP WO2021001995A1 JP 2021529657 A JP2021529657 A JP 2021529657A JP 2021529657 A JP2021529657 A JP 2021529657A JP WO2021001995 A1 JPWO2021001995 A1 JP WO2021001995A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021529657A
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JP7394852B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021001995A1 publication Critical patent/JPWO2021001995A1/ja
Application granted granted Critical
Publication of JP7394852B2 publication Critical patent/JP7394852B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021529657A 2019-07-04 2019-07-04 部品実装システム Active JP7394852B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026654 WO2021001995A1 (ja) 2019-07-04 2019-07-04 部品実装システム

Publications (2)

Publication Number Publication Date
JPWO2021001995A1 true JPWO2021001995A1 (ja) 2021-01-07
JP7394852B2 JP7394852B2 (ja) 2023-12-08

Family

ID=74100773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021529657A Active JP7394852B2 (ja) 2019-07-04 2019-07-04 部品実装システム

Country Status (5)

Country Link
US (1) US20220408622A1 (ja)
EP (1) EP3996482B1 (ja)
JP (1) JP7394852B2 (ja)
CN (1) CN114073175B (ja)
WO (1) WO2021001995A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024201568A1 (ja) * 2023-03-24 2024-10-03 株式会社Fuji 電子部品装着システム、電子部品装着検査方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041700A (ja) * 1996-07-25 1998-02-13 Sanyo Electric Co Ltd 電子部品装着装置の装着経路設定方法およびその装置
JP2017033979A (ja) * 2015-07-29 2017-02-09 ファナック株式会社 実装タクトおよび消費電力を低減する部品マウンタ及び機械学習器
JP2018025481A (ja) * 2016-08-10 2018-02-15 オムロン株式会社 表面実装ラインの検査装置及び品質管理システム
JP2018097731A (ja) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ 画像処理システム及び画像処理方法
WO2018216075A1 (ja) * 2017-05-22 2018-11-29 株式会社Ｆｕｊｉ 画像処理装置、多重通信システム及び画像処理方法

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
JP2570239B2 (ja) * 1991-07-30 1997-01-08 オムロン株式会社 実装部品検査用データ生成方法およびその方法の実施に用いられる実装部品検査装置
US6621566B1 (en) * 2000-10-02 2003-09-16 Teradyne, Inc. Optical inspection system having integrated component learning
US6603882B2 (en) * 2001-04-12 2003-08-05 Seho Oh Automatic template generation and searching method
US20100027873A1 (en) * 2006-08-28 2010-02-04 I-Pulse Kabushiki Kaisha Board appearance inspection method and device
JP4674220B2 (ja) * 2007-03-05 2011-04-20 ヤマハ発動機株式会社 部品移載装置、表面実装機、及び電子部品検査装置
JP5077322B2 (ja) * 2009-10-22 2012-11-21 パナソニック株式会社 部品実装システムおよび実装状態検査方法
JP5615076B2 (ja) * 2010-07-21 2014-10-29 富士機械製造株式会社 部品有無判定装置及び部品有無判定方法
CN105706545B (zh) * 2013-11-11 2018-12-25 株式会社富士 元件安装装置
JP6411028B2 (ja) * 2014-01-17 2018-10-24 株式会社Ｆｕｊｉ 管理装置
JP6310058B2 (ja) * 2014-03-13 2018-04-11 富士機械製造株式会社 画像処理装置および基板生産システム
JP6375512B2 (ja) * 2014-05-27 2018-08-22 パナソニックＩｐマネジメント株式会社 部品実装ライン及び基板検査方法
JP6218094B1 (ja) * 2016-04-15 2017-10-25 Ｊｅインターナショナル株式会社 検査方法、検査装置、検査プログラム、および記録媒体
JP2017211259A (ja) * 2016-05-25 2017-11-30 株式会社シーイーシー 検査装置、検査方法、及びプログラム
KR101893831B1 (ko) * 2016-10-20 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판 검사방법
WO2018087932A1 (ja) * 2016-11-14 2018-05-17 株式会社Ｆｕｊｉ 保存画像の再分類システム及び再分類方法
JP7122524B2 (ja) * 2017-12-05 2022-08-22 パナソニックＩｐマネジメント株式会社 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム
KR20190084167A (ko) * 2017-12-21 2019-07-16 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
KR102106349B1 (ko) * 2017-12-21 2020-05-04 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 솔더 페이스트 이상 감지 방법 및 컴퓨터 판독 가능한 기록 매체
JP6537008B1 (ja) * 2018-02-14 2019-07-03 株式会社イシダ 検査装置
EP3761013A4 (en) * 2018-02-26 2021-05-12 Koh Young Technology Inc COMPONENT MOUNT STATUS INSPECTION PROCESS, PRINTED CIRCUIT BOARD INSPECTION APPARATUS AND COMPUTER READABLE RECORDING MEDIA
CN111340879B (zh) * 2018-12-17 2023-09-01 台达电子工业股份有限公司 基于上采样的影像定位系统及其方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041700A (ja) * 1996-07-25 1998-02-13 Sanyo Electric Co Ltd 電子部品装着装置の装着経路設定方法およびその装置
JP2017033979A (ja) * 2015-07-29 2017-02-09 ファナック株式会社 実装タクトおよび消費電力を低減する部品マウンタ及び機械学習器
JP2018025481A (ja) * 2016-08-10 2018-02-15 オムロン株式会社 表面実装ラインの検査装置及び品質管理システム
JP2018097731A (ja) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ 画像処理システム及び画像処理方法
WO2018216075A1 (ja) * 2017-05-22 2018-11-29 株式会社Ｆｕｊｉ 画像処理装置、多重通信システム及び画像処理方法

Also Published As

Publication number Publication date
JP7394852B2 (ja) 2023-12-08
EP3996482A4 (en) 2022-12-07
CN114073175A (zh) 2022-02-18
EP3996482A1 (en) 2022-05-11
US20220408622A1 (en) 2022-12-22
CN114073175B (zh) 2023-09-22
EP3996482B1 (en) 2024-08-07
WO2021001995A1 (ja) 2021-01-07

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