JPWO2020245697A5 - - Google Patents

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Publication number
JPWO2020245697A5
JPWO2020245697A5 JP2021524493A JP2021524493A JPWO2020245697A5 JP WO2020245697 A5 JPWO2020245697 A5 JP WO2020245697A5 JP 2021524493 A JP2021524493 A JP 2021524493A JP 2021524493 A JP2021524493 A JP 2021524493A JP WO2020245697 A5 JPWO2020245697 A5 JP WO2020245697A5
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JP
Japan
Prior art keywords
wiring
circuit
semiconductor device
layer
transistor
Prior art date
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Application number
JP2021524493A
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English (en)
Japanese (ja)
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JPWO2020245697A1 (https=
JP7524175B2 (ja
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Priority claimed from PCT/IB2020/054928 external-priority patent/WO2020245697A1/ja
Publication of JPWO2020245697A1 publication Critical patent/JPWO2020245697A1/ja
Publication of JPWO2020245697A5 publication Critical patent/JPWO2020245697A5/ja
Priority to JP2024113749A priority Critical patent/JP7711279B2/ja
Application granted granted Critical
Publication of JP7524175B2 publication Critical patent/JP7524175B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021524493A 2019-06-07 2020-05-25 半導体装置 Active JP7524175B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024113749A JP7711279B2 (ja) 2019-06-07 2024-07-17 半導体装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019107512 2019-06-07
JP2019107512 2019-06-07
JP2019124885 2019-07-04
JP2019124885 2019-07-04
PCT/IB2020/054928 WO2020245697A1 (ja) 2019-06-07 2020-05-25 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024113749A Division JP7711279B2 (ja) 2019-06-07 2024-07-17 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2020245697A1 JPWO2020245697A1 (https=) 2020-12-10
JPWO2020245697A5 true JPWO2020245697A5 (https=) 2023-05-29
JP7524175B2 JP7524175B2 (ja) 2024-07-29

Family

ID=73652437

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021524493A Active JP7524175B2 (ja) 2019-06-07 2020-05-25 半導体装置
JP2024113749A Active JP7711279B2 (ja) 2019-06-07 2024-07-17 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024113749A Active JP7711279B2 (ja) 2019-06-07 2024-07-17 半導体装置

Country Status (3)

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US (2) US12015012B2 (https=)
JP (2) JP7524175B2 (https=)
WO (1) WO2020245697A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11974422B2 (en) * 2021-11-04 2024-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device
TWI910401B (zh) * 2022-01-27 2026-01-01 新加坡商發明與合作實驗室有限公司 伺服處理器和機架伺服器單元的機體電路微縮和拉伸平台
WO2026009118A1 (ja) * 2024-07-05 2026-01-08 株式会社半導体エネルギー研究所 記憶装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002186A1 (en) 2010-07-02 2012-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012256821A (ja) 2010-09-13 2012-12-27 Semiconductor Energy Lab Co Ltd 記憶装置
TWI574259B (zh) 2010-09-29 2017-03-11 半導體能源研究所股份有限公司 半導體記憶體裝置和其驅動方法
JP6607681B2 (ja) * 2014-03-07 2019-11-20 株式会社半導体エネルギー研究所 半導体装置
JP6635670B2 (ja) 2014-04-11 2020-01-29 株式会社半導体エネルギー研究所 半導体装置
US9728243B2 (en) 2015-05-11 2017-08-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device or electronic component including the same
WO2017158465A1 (ja) * 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 記憶装置
JP2018201003A (ja) 2017-05-26 2018-12-20 株式会社半導体エネルギー研究所 半導体装置及び電子機器
JP2018206456A (ja) 2017-06-07 2018-12-27 株式会社半導体エネルギー研究所 記憶装置
US11205461B2 (en) 2017-06-27 2021-12-21 Semiconductor Energy Laboratory Co., Ltd. Memory device comprising first through fourth transistors
US11004477B2 (en) * 2018-07-31 2021-05-11 Micron Technology, Inc. Bank and channel structure of stacked semiconductor device

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