JPWO2020235644A1 - - Google Patents
Info
- Publication number
- JPWO2020235644A1 JPWO2020235644A1 JP2021520852A JP2021520852A JPWO2020235644A1 JP WO2020235644 A1 JPWO2020235644 A1 JP WO2020235644A1 JP 2021520852 A JP2021520852 A JP 2021520852A JP 2021520852 A JP2021520852 A JP 2021520852A JP WO2020235644 A1 JPWO2020235644 A1 JP WO2020235644A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019096800 | 2019-05-23 | ||
JP2019096800 | 2019-05-23 | ||
PCT/JP2020/020161 WO2020235644A1 (ja) | 2019-05-23 | 2020-05-21 | 電子機器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2020235644A1 true JPWO2020235644A1 (ja) | 2020-11-26 |
JPWO2020235644A5 JPWO2020235644A5 (ja) | 2022-03-07 |
JP7273149B2 JP7273149B2 (ja) | 2023-05-12 |
Family
ID=73458798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021520852A Active JP7273149B2 (ja) | 2019-05-23 | 2020-05-21 | 電子機器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220232693A1 (ja) |
JP (1) | JP7273149B2 (ja) |
WO (1) | WO2020235644A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338698U (ja) * | 1989-08-26 | 1991-04-15 | ||
JPH11250954A (ja) * | 1998-03-05 | 1999-09-17 | Alps Electric Co Ltd | 高周波電子機器 |
JP2011155056A (ja) * | 2010-01-26 | 2011-08-11 | Mitsubishi Electric Corp | シールド構造 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2612339B2 (ja) * | 1989-04-18 | 1997-05-21 | 三菱電機株式会社 | 電子機器筐体 |
US4926291A (en) * | 1989-07-31 | 1990-05-15 | Western Digital Corporation | Data storage mounting assembly |
JPH04205612A (ja) * | 1990-11-30 | 1992-07-27 | Toshiba Corp | 小型電子機器 |
JP2894325B2 (ja) * | 1997-06-25 | 1999-05-24 | 日本電気株式会社 | 電子回路のシールド構造 |
US6335861B1 (en) * | 1999-03-01 | 2002-01-01 | Cardiocommand, Inc. | Instrument platform using modular components |
US6599136B2 (en) * | 2001-01-16 | 2003-07-29 | Hewlett-Packard Development Company, L.P. | Socket apparatus for a plug-in module |
US6859698B2 (en) * | 2001-06-21 | 2005-02-22 | Snap-On Incorporated | Detachable cartridge unit and auxiliary unit for function expansion of a data processing system |
US6469912B1 (en) * | 2001-11-16 | 2002-10-22 | Compal Electronics, Inc. | Electrical apparatus having a cover member adapted to provide electromagnetic interference shielding to an electronic component |
JP2003229688A (ja) * | 2001-11-30 | 2003-08-15 | Sony Corp | 情報処理装置 |
JP4703308B2 (ja) * | 2005-07-29 | 2011-06-15 | 株式会社東芝 | 電子機器 |
TW200709776A (en) * | 2005-08-19 | 2007-03-01 | Quanta Comp Inc | Electromagnetic interfernece shielding structure and method thereof |
JP2008147285A (ja) * | 2006-12-07 | 2008-06-26 | Hitachi Kokusai Electric Inc | 電子機器 |
JP5185608B2 (ja) * | 2007-12-21 | 2013-04-17 | 矢崎総業株式会社 | ジャンクションブロック |
JP5618595B2 (ja) * | 2010-04-01 | 2014-11-05 | 日立オートモティブシステムズ株式会社 | パワーモジュール、およびパワーモジュールを備えた電力変換装置 |
JP5236771B2 (ja) * | 2011-04-18 | 2013-07-17 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器 |
JP6042094B2 (ja) * | 2012-05-08 | 2016-12-14 | 京セラ株式会社 | 電子機器 |
US9161434B2 (en) * | 2013-09-04 | 2015-10-13 | Apple Inc. | Methods for shielding electronic components from moisture |
US9967993B1 (en) * | 2016-11-07 | 2018-05-08 | Phoenix Contact Development and Manufacturing, Inc. | Printed circuit board enclosure assembly |
JP7275380B2 (ja) * | 2020-03-27 | 2023-05-17 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
WO2021193623A1 (ja) * | 2020-03-27 | 2021-09-30 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
US11943898B2 (en) * | 2020-03-27 | 2024-03-26 | Sony Interactive Entertainment Inc. | Electronic device |
JP7470732B2 (ja) * | 2022-04-11 | 2024-04-18 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
-
2020
- 2020-05-21 US US17/609,500 patent/US20220232693A1/en active Pending
- 2020-05-21 WO PCT/JP2020/020161 patent/WO2020235644A1/ja active Application Filing
- 2020-05-21 JP JP2021520852A patent/JP7273149B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0338698U (ja) * | 1989-08-26 | 1991-04-15 | ||
JPH11250954A (ja) * | 1998-03-05 | 1999-09-17 | Alps Electric Co Ltd | 高周波電子機器 |
JP2011155056A (ja) * | 2010-01-26 | 2011-08-11 | Mitsubishi Electric Corp | シールド構造 |
Also Published As
Publication number | Publication date |
---|---|
JP7273149B2 (ja) | 2023-05-12 |
US20220232693A1 (en) | 2022-07-21 |
WO2020235644A1 (ja) | 2020-11-26 |
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