JPWO2020226049A1 - - Google Patents

Info

Publication number
JPWO2020226049A1
JPWO2020226049A1 JP2021518337A JP2021518337A JPWO2020226049A1 JP WO2020226049 A1 JPWO2020226049 A1 JP WO2020226049A1 JP 2021518337 A JP2021518337 A JP 2021518337A JP 2021518337 A JP2021518337 A JP 2021518337A JP WO2020226049 A1 JPWO2020226049 A1 JP WO2020226049A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021518337A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020226049A1 publication Critical patent/JPWO2020226049A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
JP2021518337A 2019-05-07 2020-04-21 Pending JPWO2020226049A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019087631 2019-05-07
JP2019087676 2019-05-07
PCT/JP2020/017139 WO2020226049A1 (ja) 2019-05-07 2020-04-21 配線基板および配線基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020226049A1 true JPWO2020226049A1 (ja) 2020-11-12

Family

ID=73051483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021518337A Pending JPWO2020226049A1 (ja) 2019-05-07 2020-04-21

Country Status (7)

Country Link
US (1) US20220201838A1 (ja)
EP (1) EP3968459A4 (ja)
JP (1) JPWO2020226049A1 (ja)
KR (1) KR20220003007A (ja)
CN (1) CN113812040A (ja)
TW (1) TW202102072A (ja)
WO (1) WO2020226049A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210052792A (ko) 2019-10-31 2021-05-11 삼성디스플레이 주식회사 무선 주파수 소자 및 이를 포함하는 전자 장치
JP2022091297A (ja) * 2020-12-09 2022-06-21 日本航空電子工業株式会社 配線基板の生産方法及び配線基板
JPWO2022138003A1 (ja) * 2020-12-25 2022-06-30
JPWO2023286505A1 (ja) * 2021-07-13 2023-01-19
TW202327172A (zh) * 2021-11-08 2023-07-01 日商大日本印刷股份有限公司 模組、圖像顯示裝置用積層體、圖像顯示裝置、模組之製造方法及配線基板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392930A (en) 1977-01-26 1978-08-15 Agency Of Ind Science & Technol Combustion system
JP2005142984A (ja) * 2003-11-10 2005-06-02 Shin Etsu Polymer Co Ltd 透光性アンテナ
JP2006295430A (ja) * 2005-04-08 2006-10-26 Toppan Forms Co Ltd アンテナ部材、並びにこれを用いた非接触型情報記録媒体及びそのインピーダンス調整方法
JP4775301B2 (ja) * 2007-04-10 2011-09-21 日立電線株式会社 透明アンテナ
JP2009170474A (ja) * 2008-01-10 2009-07-30 Seiko Instruments Inc 回路基板とその製造方法および電子機器
JP5447813B2 (ja) 2009-09-16 2014-03-19 大日本印刷株式会社 透明アンテナ
JP5636735B2 (ja) 2009-09-24 2014-12-10 大日本印刷株式会社 透明アンテナ用エレメント及び透明アンテナ
JP5414451B2 (ja) * 2009-10-21 2014-02-12 パナソニック株式会社 アンテナ装置
FR2955430A1 (fr) * 2010-01-21 2011-07-22 Bouygues Telecom Sa Antenne imprimee optiquement transparente a plan de masse maille
US8570225B2 (en) 2010-03-25 2013-10-29 Sony Corporation Antenna device and mobile device
JPWO2013157420A1 (ja) * 2012-04-18 2015-12-21 コニカミノルタ株式会社 透光性導電パターン部材及びこれを用いた透光性電磁遮蔽・アンテナ部材
CN103515709A (zh) * 2013-10-23 2014-01-15 哈尔滨工业大学 一种基于随机网栅及透红外半导体的透红外辐射微带天线
WO2016098761A1 (ja) * 2014-12-18 2016-06-23 シャープ株式会社 透明アンテナ及び透明アンテナ付き表示装置
JP6421077B2 (ja) * 2015-05-19 2018-11-07 富士フイルム株式会社 アンテナの製造方法およびタッチセンサ
US10588218B2 (en) * 2017-04-11 2020-03-10 Intel Corporation Antenna on transparent substrate
KR101971490B1 (ko) * 2018-10-16 2019-04-23 동우 화인켐 주식회사 필름 안테나 및 이를 포함하는 디스플레이 장치

Also Published As

Publication number Publication date
WO2020226049A1 (ja) 2020-11-12
KR20220003007A (ko) 2022-01-07
EP3968459A4 (en) 2023-03-29
EP3968459A1 (en) 2022-03-16
US20220201838A1 (en) 2022-06-23
CN113812040A (zh) 2021-12-17
TW202102072A (zh) 2021-01-01

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