JPWO2020203530A1 - - Google Patents

Info

Publication number
JPWO2020203530A1
JPWO2020203530A1 JP2021511529A JP2021511529A JPWO2020203530A1 JP WO2020203530 A1 JPWO2020203530 A1 JP WO2020203530A1 JP 2021511529 A JP2021511529 A JP 2021511529A JP 2021511529 A JP2021511529 A JP 2021511529A JP WO2020203530 A1 JPWO2020203530 A1 JP WO2020203530A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021511529A
Other versions
JP7150144B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203530A1 publication Critical patent/JPWO2020203530A1/ja
Application granted granted Critical
Publication of JP7150144B2 publication Critical patent/JP7150144B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0551—Flake form nanoparticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B22F1/147—Making a dispersion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B22F3/03—Press-moulding apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Insulated Conductors (AREA)
JP2021511529A 2019-03-29 2020-03-25 加圧接合用組成物、並びに導電体の接合構造及びその製造方法 Active JP7150144B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019068288 2019-03-29
JP2019068288 2019-03-29
PCT/JP2020/013254 WO2020203530A1 (ja) 2019-03-29 2020-03-25 加圧接合用組成物、並びに導電体の接合構造及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2020203530A1 true JPWO2020203530A1 (ja) 2020-10-08
JP7150144B2 JP7150144B2 (ja) 2022-10-07

Family

ID=72668317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021511529A Active JP7150144B2 (ja) 2019-03-29 2020-03-25 加圧接合用組成物、並びに導電体の接合構造及びその製造方法

Country Status (9)

Country Link
US (1) US20220118546A1 (ja)
EP (1) EP3950185A4 (ja)
JP (1) JP7150144B2 (ja)
KR (1) KR102523866B1 (ja)
CN (1) CN113412171B (ja)
MY (1) MY194637A (ja)
SG (1) SG11202107917SA (ja)
TW (1) TWI785319B (ja)
WO (1) WO2020203530A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023302B2 (ja) * 2020-02-04 2022-02-21 田中貴金属工業株式会社 導電性接合材料を備える接合部材及び接合方法
WO2023189120A1 (ja) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 加圧接合用銅ペースト、半導体装置、加圧接合用銅ペーストの製造方法及び半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029897A (ja) * 2012-07-31 2014-02-13 Hitachi Ltd 導電性接合体およびそれを用いた半導体装置
JP2015076232A (ja) * 2013-10-08 2015-04-20 東洋紡株式会社 導電性ペースト、導電性薄膜及び電気回路
JP2015090900A (ja) * 2013-11-05 2015-05-11 古河電気工業株式会社 加熱接合材料を用いた電子部品の接合方法および接続構造体
WO2015115139A1 (ja) * 2014-01-29 2015-08-06 三井金属鉱業株式会社 銅粉
JP2018501657A (ja) * 2014-12-26 2018-01-18 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 焼結性接合材料およびそれを用いた半導体装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2320661A1 (fr) * 2000-09-26 2002-03-26 Hydro-Quebec Nouveau procede de synthese de materiaux limpo4 a structure olivine
EP2661160A1 (en) * 2010-12-28 2013-11-06 Tokuyama Corporation Metallized substrate, metal paste composition, and method for producing metallized substrate
JP2013053347A (ja) 2011-09-05 2013-03-21 Mitsui Mining & Smelting Co Ltd デンドライト状銅粉
KR102007129B1 (ko) * 2012-07-20 2019-08-02 도요보 가부시키가이샤 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체
CN103194635B (zh) * 2013-04-01 2015-08-05 四川大学 Ti(C,N)基金属陶瓷与钢的无外压扩散连接方法
KR102097368B1 (ko) * 2014-08-29 2020-04-06 미쓰이금속광업주식회사 도전체의 접속 구조 및 그 제조 방법, 도전성 조성물 그리고 전자부품 모듈
JP6380792B2 (ja) * 2014-09-04 2018-08-29 日立化成株式会社 銀ペースト及びそれを用いた半導体装置、並びに銀ペーストの製造方法
JP6564282B2 (ja) * 2015-08-28 2019-08-21 国立大学法人大阪大学 金属含有膜付き誘電体基材の製造方法
CN107921540B (zh) 2015-09-07 2020-03-03 日立化成株式会社 接合用铜糊料、接合体的制造方法及半导体装置的制造方法
JP6704322B2 (ja) 2015-09-30 2020-06-03 日東電工株式会社 シートおよび複合シート
CN108028206B (zh) * 2015-10-02 2021-08-24 三井金属矿业株式会社 粘结接合结构
CN108349008B (zh) * 2015-11-16 2021-01-22 阪东化学株式会社 接合用组合物及电子零件接合体
JP6716809B2 (ja) * 2015-11-27 2020-07-01 協立化学産業株式会社 銅ペースト組成物の製造方法
JP6490781B2 (ja) * 2016-12-28 2019-03-27 株式会社タムラ製作所 異方性導電ペーストおよび電子基板の製造方法
MY195254A (en) * 2017-01-11 2023-01-11 Hitachi Chemical Co Ltd Copper Paste for Pressureless Bonding, Bonded Body And Semiconductor Device
JP6381738B1 (ja) * 2017-05-31 2018-08-29 ニホンハンダ株式会社 ペースト状金属粒子組成物、接合方法および電子装置の製造方法
EP3834965A4 (en) * 2018-08-08 2021-08-18 Mitsui Mining & Smelting Co., Ltd. CONNECTION COMPOSITION, CONNECTION STRUCTURE FOR ELECTRICAL CONDUCTORS AND METHOD FOR MAKING IT

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029897A (ja) * 2012-07-31 2014-02-13 Hitachi Ltd 導電性接合体およびそれを用いた半導体装置
JP2015076232A (ja) * 2013-10-08 2015-04-20 東洋紡株式会社 導電性ペースト、導電性薄膜及び電気回路
JP2015090900A (ja) * 2013-11-05 2015-05-11 古河電気工業株式会社 加熱接合材料を用いた電子部品の接合方法および接続構造体
WO2015115139A1 (ja) * 2014-01-29 2015-08-06 三井金属鉱業株式会社 銅粉
JP2018501657A (ja) * 2014-12-26 2018-01-18 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 焼結性接合材料およびそれを用いた半導体装置

Also Published As

Publication number Publication date
EP3950185A1 (en) 2022-02-09
TW202110555A (zh) 2021-03-16
MY194637A (en) 2022-12-08
KR20210125995A (ko) 2021-10-19
CN113412171A (zh) 2021-09-17
CN113412171B (zh) 2024-04-30
US20220118546A1 (en) 2022-04-21
EP3950185A4 (en) 2022-02-09
KR102523866B1 (ko) 2023-04-21
SG11202107917SA (en) 2021-08-30
WO2020203530A1 (ja) 2020-10-08
JP7150144B2 (ja) 2022-10-07
TWI785319B (zh) 2022-12-01

Similar Documents

Publication Publication Date Title
BR112021017339A2 (ja)
BR112021013854A2 (ja)
BR112021018450A2 (ja)
BR112021017892A2 (ja)
BR112019016141A2 (ja)
AU2020104490A4 (ja)
BR112021017939A2 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112019016142A2 (ja)
BR112019016138A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021017355A2 (ja)
BR112021018102A2 (ja)
JPWO2020202971A1 (ja)
BR112021017637A2 (ja)
BR112021018452A2 (ja)
BR112021018250A2 (ja)
JPWO2020203530A1 (ja)
BR112021018093A2 (ja)
BR112021018084A2 (ja)
BR112021017703A2 (ja)
BR112021013944A2 (ja)
BR112021013128A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210617

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220628

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220819

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220913

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220927

R150 Certificate of patent or registration of utility model

Ref document number: 7150144

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150