SG11202107917SA - Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor - Google Patents

Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor

Info

Publication number
SG11202107917SA
SG11202107917SA SG11202107917SA SG11202107917SA SG11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA
Authority
SG
Singapore
Prior art keywords
composition
production method
method therefor
pressure bonding
bonded structure
Prior art date
Application number
SG11202107917SA
Inventor
Kei Anai
Shinichi Yamauchi
Jung-Lae Jo
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of SG11202107917SA publication Critical patent/SG11202107917SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0551—Flake form nanoparticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B22F1/147—Making a dispersion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/02—Compacting only
    • B22F3/03—Press-moulding apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Insulated Conductors (AREA)
SG11202107917SA 2019-03-29 2020-03-25 Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor SG11202107917SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019068288 2019-03-29
PCT/JP2020/013254 WO2020203530A1 (en) 2019-03-29 2020-03-25 Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor

Publications (1)

Publication Number Publication Date
SG11202107917SA true SG11202107917SA (en) 2021-08-30

Family

ID=72668317

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202107917SA SG11202107917SA (en) 2019-03-29 2020-03-25 Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor

Country Status (9)

Country Link
US (1) US20220118546A1 (en)
EP (1) EP3950185A4 (en)
JP (1) JP7150144B2 (en)
KR (1) KR102523866B1 (en)
CN (1) CN113412171B (en)
MY (1) MY194637A (en)
SG (1) SG11202107917SA (en)
TW (1) TWI785319B (en)
WO (1) WO2020203530A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023302B2 (en) * 2020-02-04 2022-02-21 田中貴金属工業株式会社 Joining member and joining method provided with conductive joining material
WO2023189120A1 (en) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 Copper paste for pressure bonding, semiconductor device, method for preparing copper paste for pressure bonding, and method for manufacturing semiconductor device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2320661A1 (en) * 2000-09-26 2002-03-26 Hydro-Quebec New process for synthesizing limpo4 materials with olivine structure
CN103238380B (en) * 2010-12-28 2016-08-10 株式会社德山 The manufacture method of metallized substrate, metal paste composition and metallized substrate
JP2013053347A (en) 2011-09-05 2013-03-21 Mitsui Mining & Smelting Co Ltd Dendritic copper powder
JP5773292B2 (en) * 2012-07-20 2015-09-02 東洋紡株式会社 Conductive paste, conductive thin film and conductive laminate for laser etching
JP2014029897A (en) * 2012-07-31 2014-02-13 Hitachi Ltd Conductive bonded body and semiconductor device using the same
CN103194635B (en) * 2013-04-01 2015-08-05 四川大学 Ti (C, N) based ceramic metal and steel without external pressure diffusion connection method
JP6232904B2 (en) * 2013-10-08 2017-11-22 東洋紡株式会社 Conductive paste, conductive thin film and electric circuit
JP6265688B2 (en) * 2013-11-05 2018-01-24 古河電気工業株式会社 Connection structure
WO2015115139A1 (en) * 2014-01-29 2015-08-06 三井金属鉱業株式会社 Copper powder
WO2016031619A1 (en) * 2014-08-29 2016-03-03 三井金属鉱業株式会社 Conductor connection structure, method for producing same, conductive composition, and electronic component module
JP6380792B2 (en) * 2014-09-04 2018-08-29 日立化成株式会社 Silver paste, semiconductor device using the same, and method for producing silver paste
CN107112246B (en) * 2014-12-26 2020-11-10 汉高股份有限及两合公司 Sinterable bonding material and semiconductor device using same
JP6564282B2 (en) * 2015-08-28 2019-08-21 国立大学法人大阪大学 Method for producing dielectric substrate with metal-containing film
CN111230125A (en) 2015-09-07 2020-06-05 日立化成株式会社 Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device
JP6704322B2 (en) 2015-09-30 2020-06-03 日東電工株式会社 Sheets and composite sheets
EP3758048B1 (en) * 2015-10-02 2022-11-09 Mitsui Mining & Smelting Co., Ltd. A bonding junction structure
CN108349008B (en) * 2015-11-16 2021-01-22 阪东化学株式会社 Composition for bonding and electronic component bonded body
JP6716809B2 (en) * 2015-11-27 2020-07-01 協立化学産業株式会社 Method for producing copper paste composition
JP6490781B2 (en) * 2016-12-28 2019-03-27 株式会社タムラ製作所 Anisotropic conductive paste and method for manufacturing electronic substrate
SG11201906411TA (en) * 2017-01-11 2019-08-27 Hitachi Chemical Co Ltd Copper paste for pressureless bonding, bonded body and semiconductor device
JP6381738B1 (en) * 2017-05-31 2018-08-29 ニホンハンダ株式会社 Paste-like metal particle composition, bonding method, and electronic device manufacturing method
JP6884285B2 (en) * 2018-08-08 2021-06-09 三井金属鉱業株式会社 Bonding composition, bonding structure of conductor and method for manufacturing the same

Also Published As

Publication number Publication date
MY194637A (en) 2022-12-08
KR102523866B1 (en) 2023-04-21
EP3950185A1 (en) 2022-02-09
US20220118546A1 (en) 2022-04-21
EP3950185A4 (en) 2022-02-09
JP7150144B2 (en) 2022-10-07
TWI785319B (en) 2022-12-01
KR20210125995A (en) 2021-10-19
CN113412171A (en) 2021-09-17
TW202110555A (en) 2021-03-16
WO2020203530A1 (en) 2020-10-08
CN113412171B (en) 2024-04-30
JPWO2020203530A1 (en) 2020-10-08

Similar Documents

Publication Publication Date Title
SG11202105806TA (en) Adhesive composition, film-like adhesive and production method thereof, and semiconductorpackage using film-like adhesive and production method thereof
EP3498416A4 (en) Bonded structure of heterogeneous materials and method for manufacturing same
EP3257690A4 (en) Structure for bonding press-molded article, structural article for automobile having said bonding structure, and method for manufacturing bonded article
SG11202100308YA (en) Bonding composition, conductor bonding structure, and method for producing same
EP3617424A4 (en) Structure-frp material bond construction and bonding method
EP3718968C0 (en) Method of manufacturing composite anode material
SG11202107917SA (en) Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor
EP3928977A4 (en) Method for manufacturing laminate of two-dimensional material, and laminate
EP3778069A4 (en) Copper paste, bonding method, and method for producing bonded body
EP3738583A4 (en) Drug-layered silicate composite for enhancement of oral bioavailability, oral pharmaceutical composition comprising same, and method for manufacturing composite
EP3578619A4 (en) Adhesive composition, method for producing adhesive composition, bonding method using adhesive composition, and structure having adhesive composition attached thereto
EP3984683A4 (en) Bonded joint, and method for manufacturing bonded joint
EP3993010A4 (en) Layered body and layered body production method
EP3878644A4 (en) Porous layer constituent and production method therefor
EP3862404A4 (en) Method for producing bonded object, and bonded object
EP3705271A4 (en) Method for bonding composite material and composite material
EP3238921A4 (en) Method for modifying surface of composite material, method for bonding composite material, composite material, and bonded structure
SG11202007881SA (en) Laminate, composition, production method of laminate, and production method of member
EP3943215A4 (en) Metal paste, bonding method and method for producing bonded body
EP4023362A4 (en) Copper paste for forming sintered copper pillar and method for producing bonded body
EP4071126A4 (en) Bonded substrate and method for manufacturing bonded substrate
EP3989910A4 (en) Method for the production of pullulan soft capsules
EP3991936A4 (en) Pellet production method
EP3962460A4 (en) Method for the production of pullulan capsules
EP3780917A4 (en) Ceramics-metal bonded body and method of manufacturing same, and multi-piece ceramics-metal bonded body and method of manufacturing same