SG11202107917SA - Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor - Google Patents
Composition for pressure bonding, and bonded structure of conductive bodies and production method thereforInfo
- Publication number
- SG11202107917SA SG11202107917SA SG11202107917SA SG11202107917SA SG11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA SG 11202107917S A SG11202107917S A SG 11202107917SA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- production method
- method therefor
- pressure bonding
- bonded structure
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0551—Flake form nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
- B22F1/147—Making a dispersion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
- B22F3/03—Press-moulding apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0466—Alloys based on noble metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019068288 | 2019-03-29 | ||
| PCT/JP2020/013254 WO2020203530A1 (en) | 2019-03-29 | 2020-03-25 | Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202107917SA true SG11202107917SA (en) | 2021-08-30 |
Family
ID=72668317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202107917SA SG11202107917SA (en) | 2019-03-29 | 2020-03-25 | Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20220118546A1 (en) |
| EP (1) | EP3950185B1 (en) |
| JP (1) | JP7150144B2 (en) |
| KR (1) | KR102523866B1 (en) |
| CN (1) | CN113412171B (en) |
| MY (1) | MY194637A (en) |
| SG (1) | SG11202107917SA (en) |
| TW (1) | TWI785319B (en) |
| WO (1) | WO2020203530A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7391678B2 (en) * | 2020-01-24 | 2023-12-05 | 大陽日酸株式会社 | Bonding material |
| JP7023302B2 (en) * | 2020-02-04 | 2022-02-21 | 田中貴金属工業株式会社 | Joining member and joining method provided with conductive joining material |
| CN116963856A (en) * | 2021-03-30 | 2023-10-27 | 三井金属矿业株式会社 | Joint structure |
| CN118742977A (en) | 2022-03-31 | 2024-10-01 | 三井金属矿业株式会社 | Copper paste for compression bonding, semiconductor device, method for producing copper paste for compression bonding, and method for producing semiconductor device |
| WO2024210466A1 (en) * | 2023-04-04 | 2024-10-10 | 대주전자재료 주식회사 | Bonding composition for low-temperature sintering |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2320661A1 (en) * | 2000-09-26 | 2002-03-26 | Hydro-Quebec | New process for synthesizing limpo4 materials with olivine structure |
| US9462698B2 (en) * | 2010-12-28 | 2016-10-04 | Tokuyama Corporation | Metallized substrate, metal paste composition, and method for manufacturing metallized substrate |
| JP2013053347A (en) | 2011-09-05 | 2013-03-21 | Mitsui Mining & Smelting Co Ltd | Dendritic copper powder |
| WO2014013899A1 (en) * | 2012-07-20 | 2014-01-23 | 東洋紡株式会社 | Conductive paste for laser etching, conductive thin film, and conductive laminate |
| JP2014029897A (en) | 2012-07-31 | 2014-02-13 | Hitachi Ltd | Conductive bonded body and semiconductor device using the same |
| CN103194635B (en) * | 2013-04-01 | 2015-08-05 | 四川大学 | Ti (C, N) based ceramic metal and steel without external pressure diffusion connection method |
| JP6232904B2 (en) * | 2013-10-08 | 2017-11-22 | 東洋紡株式会社 | Conductive paste, conductive thin film and electric circuit |
| JP6265688B2 (en) * | 2013-11-05 | 2018-01-24 | 古河電気工業株式会社 | Connection structure |
| JP5876971B2 (en) | 2014-01-29 | 2016-03-02 | 三井金属鉱業株式会社 | Copper powder |
| KR102018194B1 (en) * | 2014-08-29 | 2019-09-04 | 미쓰이금속광업주식회사 | Conductor connection structure, method for producing same, conductive composition, and electronic component module |
| JP6380792B2 (en) * | 2014-09-04 | 2018-08-29 | 日立化成株式会社 | Silver paste, semiconductor device using the same, and method for producing silver paste |
| KR102236786B1 (en) * | 2014-12-26 | 2021-04-05 | 헨켈 아게 운트 코. 카게아아 | Sinterable bonding material and semiconductor device using the same |
| JP6564282B2 (en) * | 2015-08-28 | 2019-08-21 | 国立大学法人大阪大学 | Method for producing dielectric substrate with metal-containing film |
| CN111230125A (en) | 2015-09-07 | 2020-06-05 | 日立化成株式会社 | Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device |
| JP6704322B2 (en) | 2015-09-30 | 2020-06-03 | 日東電工株式会社 | Sheets and composite sheets |
| EP3758048B1 (en) * | 2015-10-02 | 2022-11-09 | Mitsui Mining & Smelting Co., Ltd. | A bonding junction structure |
| CN108349008B (en) * | 2015-11-16 | 2021-01-22 | 阪东化学株式会社 | Composition for bonding and electronic component bonded body |
| JP6716809B2 (en) * | 2015-11-27 | 2020-07-01 | 協立化学産業株式会社 | Method for producing copper paste composition |
| JP6490781B2 (en) * | 2016-12-28 | 2019-03-27 | 株式会社タムラ製作所 | Anisotropic conductive paste and method for manufacturing electronic substrate |
| EP3569329B1 (en) * | 2017-01-11 | 2023-11-01 | Resonac Corporation | Copper paste for pressureless bonding, bonded body and semiconductor device |
| JP6381738B1 (en) * | 2017-05-31 | 2018-08-29 | ニホンハンダ株式会社 | Paste-like metal particle composition, bonding method, and electronic device manufacturing method |
| JP6884285B2 (en) * | 2018-08-08 | 2021-06-09 | 三井金属鉱業株式会社 | Bonding composition, bonding structure of conductor and method for manufacturing the same |
-
2020
- 2020-03-25 SG SG11202107917SA patent/SG11202107917SA/en unknown
- 2020-03-25 CN CN202080013702.7A patent/CN113412171B/en active Active
- 2020-03-25 WO PCT/JP2020/013254 patent/WO2020203530A1/en unknown
- 2020-03-25 US US17/424,350 patent/US20220118546A1/en active Pending
- 2020-03-25 EP EP20783733.7A patent/EP3950185B1/en active Active
- 2020-03-25 MY MYPI2021004055A patent/MY194637A/en unknown
- 2020-03-25 KR KR1020217022101A patent/KR102523866B1/en active IP Right Grant
- 2020-03-25 JP JP2021511529A patent/JP7150144B2/en active Active
- 2020-03-26 TW TW109110344A patent/TWI785319B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3950185B1 (en) | 2024-07-31 |
| WO2020203530A1 (en) | 2020-10-08 |
| EP3950185A4 (en) | 2022-02-09 |
| CN113412171A (en) | 2021-09-17 |
| US20220118546A1 (en) | 2022-04-21 |
| KR102523866B1 (en) | 2023-04-21 |
| TWI785319B (en) | 2022-12-01 |
| CN113412171B (en) | 2024-04-30 |
| MY194637A (en) | 2022-12-08 |
| EP3950185A1 (en) | 2022-02-09 |
| TW202110555A (en) | 2021-03-16 |
| KR20210125995A (en) | 2021-10-19 |
| JPWO2020203530A1 (en) | 2020-10-08 |
| JP7150144B2 (en) | 2022-10-07 |
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