EP3778069A4 - Copper paste, bonding method, and method for producing bonded body - Google Patents

Copper paste, bonding method, and method for producing bonded body Download PDF

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Publication number
EP3778069A4
EP3778069A4 EP19775134.0A EP19775134A EP3778069A4 EP 3778069 A4 EP3778069 A4 EP 3778069A4 EP 19775134 A EP19775134 A EP 19775134A EP 3778069 A4 EP3778069 A4 EP 3778069A4
Authority
EP
European Patent Office
Prior art keywords
bonded body
copper paste
producing bonded
bonding method
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19775134.0A
Other languages
German (de)
French (fr)
Other versions
EP3778069A1 (en
Inventor
Haruyuki NAKAJO
Takayuki Ogawa
Ya ZHANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Chemical Inc
Original Assignee
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemical Inc filed Critical Harima Chemical Inc
Publication of EP3778069A1 publication Critical patent/EP3778069A1/en
Publication of EP3778069A4 publication Critical patent/EP3778069A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
    • B22F2007/047—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method non-pressurised baking of the paste or slurry containing metal powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
EP19775134.0A 2018-03-29 2019-03-18 Copper paste, bonding method, and method for producing bonded body Pending EP3778069A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018065201 2018-03-29
PCT/JP2019/011213 WO2019188511A1 (en) 2018-03-29 2019-03-18 Copper paste, bonding method, and method for producing bonded body

Publications (2)

Publication Number Publication Date
EP3778069A1 EP3778069A1 (en) 2021-02-17
EP3778069A4 true EP3778069A4 (en) 2022-04-06

Family

ID=68061545

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19775134.0A Pending EP3778069A4 (en) 2018-03-29 2019-03-18 Copper paste, bonding method, and method for producing bonded body

Country Status (4)

Country Link
EP (1) EP3778069A4 (en)
JP (2) JPWO2019188511A1 (en)
TW (1) TWI798404B (en)
WO (1) WO2019188511A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7391678B2 (en) * 2020-01-24 2023-12-05 大陽日酸株式会社 Bonding material
JP7026739B2 (en) * 2020-08-04 2022-02-28 石原ケミカル株式会社 Joining method, copper sintered body and copper paste
WO2023190450A1 (en) * 2022-03-30 2023-10-05 三井金属鉱業株式会社 Bonded body manufacturing method
KR102674086B1 (en) * 2022-04-01 2024-06-14 (주)호전에이블 Copper sintering paste composition and its manufacturing method
EP4306234A1 (en) 2022-07-15 2024-01-17 Technische Hochschule Ingolstadt Sintering paste and method for producing a sintering paste
KR20240080255A (en) 2022-11-29 2024-06-07 (주)창성 Copper paste composition for ceramic chip components
WO2024142582A1 (en) * 2022-12-28 2024-07-04 三井金属鉱業株式会社 Joining composition and method for producing joined structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005298903A (en) * 2004-04-12 2005-10-27 Dowa Mining Co Ltd Method for manufacturing copper powder, copper powder and conductive paste
US7368070B2 (en) * 2004-03-30 2008-05-06 Shoei Chemical Inc. Conductive paste for terminal electrode of multilayer ceramic electronic part
JP2011094236A (en) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd Copper powder for low temperature firing, or copper powder for conductive paste
JP2017103180A (en) * 2015-12-04 2017-06-08 日立化成株式会社 Copper paste non-pressure conjugation, conjugation, and semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1021744A (en) * 1996-06-28 1998-01-23 Mitsuboshi Belting Ltd Copper conductor paste and substrate printed therewith
US20120201759A1 (en) * 2011-02-03 2012-08-09 Massachusetts Institute Of Technology Tunable multiscale structures comprising bristly, hollow metal/metal oxide particles, methods of making and articles incorporating the structures
JP2014152338A (en) * 2013-02-05 2014-08-25 Murata Mfg Co Ltd Nano-wire-provided fine particle and production method thereof
JP6199048B2 (en) 2013-02-28 2017-09-20 国立大学法人大阪大学 Bonding material
CN107949447B (en) * 2015-09-07 2020-03-03 日立化成株式会社 Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device
JP6659026B2 (en) 2015-10-14 2020-03-04 国立大学法人大阪大学 Low temperature joining method using copper particles

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7368070B2 (en) * 2004-03-30 2008-05-06 Shoei Chemical Inc. Conductive paste for terminal electrode of multilayer ceramic electronic part
JP2005298903A (en) * 2004-04-12 2005-10-27 Dowa Mining Co Ltd Method for manufacturing copper powder, copper powder and conductive paste
JP2011094236A (en) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd Copper powder for low temperature firing, or copper powder for conductive paste
JP2017103180A (en) * 2015-12-04 2017-06-08 日立化成株式会社 Copper paste non-pressure conjugation, conjugation, and semiconductor device

Also Published As

Publication number Publication date
TWI798404B (en) 2023-04-11
JPWO2019188511A1 (en) 2020-12-03
EP3778069A1 (en) 2021-02-17
WO2019188511A1 (en) 2019-10-03
TW201942372A (en) 2019-11-01
JP7220310B2 (en) 2023-02-09
JP2022046765A (en) 2022-03-23

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