JPWO2020203154A1 - - Google Patents
Info
- Publication number
- JPWO2020203154A1 JPWO2020203154A1 JP2021511355A JP2021511355A JPWO2020203154A1 JP WO2020203154 A1 JPWO2020203154 A1 JP WO2020203154A1 JP 2021511355 A JP2021511355 A JP 2021511355A JP 2021511355 A JP2021511355 A JP 2021511355A JP WO2020203154 A1 JPWO2020203154 A1 JP WO2020203154A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019069272 | 2019-03-29 | ||
PCT/JP2020/010931 WO2020203154A1 (ja) | 2019-03-29 | 2020-03-12 | 接触端子、検査治具、および検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020203154A1 true JPWO2020203154A1 (ja) | 2020-10-08 |
Family
ID=72668360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021511355A Pending JPWO2020203154A1 (ja) | 2019-03-29 | 2020-03-12 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220155346A1 (ja) |
JP (1) | JPWO2020203154A1 (ja) |
CN (1) | CN113646643A (ja) |
TW (1) | TW202043781A (ja) |
WO (1) | WO2020203154A1 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5713559B2 (ja) * | 2007-04-27 | 2015-05-07 | 日本発條株式会社 | 導電性接触子 |
JP2010019797A (ja) * | 2008-07-14 | 2010-01-28 | Fujitsu Ltd | 両側プローブピン用ソケット、両側プローブピン、及びプローブユニット |
JP5643228B2 (ja) * | 2009-12-25 | 2014-12-17 | 日本発條株式会社 | 接続端子 |
WO2013061486A1 (ja) * | 2011-10-26 | 2013-05-02 | ユニテクノ株式会社 | コンタクトプローブおよびそれを備えた検査ソケット |
JP2014092539A (ja) * | 2012-10-31 | 2014-05-19 | Ucm Co Ltd | コンタクトプローブ |
TWI555987B (zh) * | 2014-01-28 | 2016-11-01 | Spring sleeve type probe and its manufacturing method | |
WO2016021723A1 (ja) * | 2014-08-08 | 2016-02-11 | 日本発條株式会社 | 接続端子 |
JP6740630B2 (ja) * | 2016-02-15 | 2020-08-19 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
JP7098886B2 (ja) * | 2017-07-04 | 2022-07-12 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
JP2021086788A (ja) * | 2019-11-29 | 2021-06-03 | 株式会社ヨコオ | スプリングコネクタ |
-
2020
- 2020-03-12 CN CN202080024930.4A patent/CN113646643A/zh active Pending
- 2020-03-12 JP JP2021511355A patent/JPWO2020203154A1/ja active Pending
- 2020-03-12 US US17/598,918 patent/US20220155346A1/en active Pending
- 2020-03-12 WO PCT/JP2020/010931 patent/WO2020203154A1/ja active Application Filing
- 2020-03-25 TW TW109109886A patent/TW202043781A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2020203154A1 (ja) | 2020-10-08 |
TW202043781A (zh) | 2020-12-01 |
US20220155346A1 (en) | 2022-05-19 |
CN113646643A (zh) | 2021-11-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220117 |
|
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|
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A521 | Request for written amendment filed |
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