JPWO2020196010A1 - - Google Patents

Info

Publication number
JPWO2020196010A1
JPWO2020196010A1 JP2021509081A JP2021509081A JPWO2020196010A1 JP WO2020196010 A1 JPWO2020196010 A1 JP WO2020196010A1 JP 2021509081 A JP2021509081 A JP 2021509081A JP 2021509081 A JP2021509081 A JP 2021509081A JP WO2020196010 A1 JPWO2020196010 A1 JP WO2020196010A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509081A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196010A1 publication Critical patent/JPWO2020196010A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
JP2021509081A 2019-03-28 2020-03-16 Pending JPWO2020196010A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019064406 2019-03-28
PCT/JP2020/011381 WO2020196010A1 (ja) 2019-03-28 2020-03-16 導電性基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020196010A1 true JPWO2020196010A1 (ja) 2020-10-01

Family

ID=72611487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509081A Pending JPWO2020196010A1 (ja) 2019-03-28 2020-03-16

Country Status (4)

Country Link
JP (1) JPWO2020196010A1 (ja)
CN (1) CN113677498A (ja)
TW (1) TW202105414A (ja)
WO (1) WO2020196010A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136185A1 (ja) * 2022-01-11 2023-07-20 富士フイルム株式会社 積層体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262452A (ja) * 2004-03-16 2005-09-29 Jujo Chemical Kk 樹脂成形品
JP2010267607A (ja) * 2009-04-15 2010-11-25 Shin Etsu Polymer Co Ltd 静電容量センサ及びその製造方法
JP5869709B1 (ja) * 2015-01-23 2016-02-24 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
WO2018012535A1 (ja) * 2016-07-15 2018-01-18 富士フイルム株式会社 配線基板の製造方法、配線基板
WO2018034291A1 (ja) * 2016-08-19 2018-02-22 富士フイルム株式会社 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
JP2018154036A (ja) * 2017-03-17 2018-10-04 コニカミノルタ株式会社 ディスプレイ装置用加飾フィルム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100443933C (zh) * 2004-05-18 2008-12-17 富士胶片株式会社 光学补偿起偏振板、图像显示单元和液晶显示单元
JP5570048B2 (ja) * 2009-09-29 2014-08-13 アキレス株式会社 三次元形状のめっき物の製造方法。
WO2016181824A1 (ja) * 2015-05-11 2016-11-17 富士フイルム株式会社 導電性積層体の製造方法、導電性積層体、被めっき層前駆体層付き基板、被めっき層付き基板、タッチセンサー

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262452A (ja) * 2004-03-16 2005-09-29 Jujo Chemical Kk 樹脂成形品
JP2010267607A (ja) * 2009-04-15 2010-11-25 Shin Etsu Polymer Co Ltd 静電容量センサ及びその製造方法
JP5869709B1 (ja) * 2015-01-23 2016-02-24 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
WO2018012535A1 (ja) * 2016-07-15 2018-01-18 富士フイルム株式会社 配線基板の製造方法、配線基板
WO2018034291A1 (ja) * 2016-08-19 2018-02-22 富士フイルム株式会社 被めっき層形成用組成物、被めっき層、被めっき層付き基板、導電性フィルム、タッチパネルセンサー、タッチパネル
JP2018154036A (ja) * 2017-03-17 2018-10-04 コニカミノルタ株式会社 ディスプレイ装置用加飾フィルム

Also Published As

Publication number Publication date
CN113677498A (zh) 2021-11-19
TW202105414A (zh) 2021-02-01
WO2020196010A1 (ja) 2020-10-01

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112021018450A2 (ja)
BR112019016141A2 (ja)
BR112021017939A2 (ja)
BR112021017738A2 (ja)
BR112021017892A2 (ja)
BR112021017782A2 (ja)
BR112021017637A2 (ja)
BR112021008711A2 (ja)
BR112019016142A2 (ja)
BR112019016138A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021018452A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017703A2 (ja)
BR112021017173A2 (ja)
BR112021018102A2 (ja)
BR112021018584A2 (ja)
BR112021017083A2 (ja)
BR112021015080A2 (ja)
BR112021012348A2 (ja)
BR112021018250A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210922

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220628

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230210

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230404