JPWO2020153079A1 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
- Publication number
- JPWO2020153079A1 JPWO2020153079A1 JP2020567435A JP2020567435A JPWO2020153079A1 JP WO2020153079 A1 JPWO2020153079 A1 JP WO2020153079A1 JP 2020567435 A JP2020567435 A JP 2020567435A JP 2020567435 A JP2020567435 A JP 2020567435A JP WO2020153079 A1 JPWO2020153079 A1 JP WO2020153079A1
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- resistance heating
- ceramic plate
- ceramic
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 100
- 238000010438 heat treatment Methods 0.000 claims abstract description 158
- 230000002093 peripheral effect Effects 0.000 description 39
- 239000003870 refractory metal Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
ウエハ載置面を有するセラミックプレートと、
前記セラミックプレートの内部で前記ウエハ載置面と平行な第1面内に設けられたコイル状の主抵抗発熱体と、
前記セラミックプレートの内部で前記第1面と平行な第2面に設けられ、前記主抵抗発熱体による加熱を補完する二次元形状の副抵抗発熱体と、
を備えたものである。
Claims (7)
- ウエハ載置面を有するセラミックプレートと、
前記セラミックプレートの内部で前記ウエハ載置面と平行な第1面内に設けられたコイル状の主抵抗発熱体と、
前記セラミックプレートの内部で前記第1面と平行な第2面に設けられ、前記主抵抗発熱体による加熱を補完する二次元形状の副抵抗発熱体と、
を備えたセラミックヒータ。 - 前記第2面は、前記第1面と前記ウエハ載置面との間にある、
請求項1に記載のセラミックヒータ。 - 前記副抵抗発熱体は、セラミックを含有している、
請求項1又は2に記載のセラミックヒータ。 - 前記主抵抗発熱体は、前記第1面内のm個(mは1以上の整数)のゾーンのそれぞれに設けられ、
前記副抵抗発熱体は、前記第2面内のn個(nはmより大きな整数)のゾーンのそれぞれに設けられている、
請求項1〜3のいずれか1項に記載のセラミックヒータ。 - 前記副抵抗発熱体は、扇形に分割されている
請求項1〜4のいずれか1項に記載のセラミックヒータ。 - 前記副抵抗発熱体が前記主抵抗発熱体より穴に近い
請求項1〜5のいずれか1項に記載のセラミックヒータ。 - 前記ウエハ載置面を平面視したときに前記主抵抗発熱体の端子と重なる位置に前記副抵抗発熱体が配置されている、
請求項1〜6のいずれか1項に記載のセラミックヒータ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019011302 | 2019-01-25 | ||
JP2019011302 | 2019-01-25 | ||
PCT/JP2019/050428 WO2020153079A1 (ja) | 2019-01-25 | 2019-12-23 | セラミックヒータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020153079A1 true JPWO2020153079A1 (ja) | 2021-11-04 |
JP7216746B2 JP7216746B2 (ja) | 2023-02-01 |
Family
ID=71735514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020567435A Active JP7216746B2 (ja) | 2019-01-25 | 2019-12-23 | セラミックヒータ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210243850A1 (ja) |
JP (1) | JP7216746B2 (ja) |
KR (1) | KR102604134B1 (ja) |
CN (1) | CN113170539B (ja) |
TW (1) | TWI816958B (ja) |
WO (1) | WO2020153079A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102159802B1 (ko) * | 2018-08-21 | 2020-09-25 | 엘지전자 주식회사 | 전기 히터 |
KR102111332B1 (ko) * | 2018-10-11 | 2020-05-15 | 엘지전자 주식회사 | 전기 히터 |
JP7411383B2 (ja) * | 2019-11-05 | 2024-01-11 | 日本特殊陶業株式会社 | 加熱装置 |
JP7321990B2 (ja) | 2020-11-30 | 2023-08-07 | 日本碍子株式会社 | セラミックヒータ |
KR102539719B1 (ko) | 2022-08-18 | 2023-06-13 | 주식회사 미코세라믹스 | 세라믹 서셉터 |
CN117248196A (zh) * | 2022-12-28 | 2023-12-19 | 无锡至辰科技有限公司 | 一种高均匀性晶圆加热器及其加工方法 |
JP7376753B1 (ja) | 2023-02-10 | 2023-11-08 | 日本碍子株式会社 | マルチゾーンヒータ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005063691A (ja) * | 2003-08-13 | 2005-03-10 | Ngk Insulators Ltd | 加熱装置 |
JP2006500789A (ja) * | 2002-09-19 | 2006-01-05 | アプライド マテリアルズ インコーポレイテッド | マルチゾーン抵抗ヒータ |
JP3182120U (ja) * | 2012-12-26 | 2013-03-07 | 日本碍子株式会社 | セラミックヒーター |
JP2017152137A (ja) * | 2016-02-23 | 2017-08-31 | 日本碍子株式会社 | 静電チャックヒータ |
JP2017228360A (ja) * | 2016-06-20 | 2017-12-28 | 日本特殊陶業株式会社 | 加熱部材及び静電チャック |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW405121B (en) * | 1996-12-31 | 2000-09-11 | Hyundai Electronics Ind | Sub row decoder circuit for semiconductor memory device |
JP4028149B2 (ja) * | 2000-02-03 | 2007-12-26 | 日本碍子株式会社 | 加熱装置 |
JP3897563B2 (ja) | 2001-10-24 | 2007-03-28 | 日本碍子株式会社 | 加熱装置 |
JP3840990B2 (ja) * | 2002-03-05 | 2006-11-01 | 住友電気工業株式会社 | 半導体/液晶製造装置 |
US20050194374A1 (en) * | 2004-03-02 | 2005-09-08 | Applied Materials, Inc. | Heated ceramic substrate support with protective coating |
JP4761723B2 (ja) * | 2004-04-12 | 2011-08-31 | 日本碍子株式会社 | 基板加熱装置 |
TWI281833B (en) * | 2004-10-28 | 2007-05-21 | Kyocera Corp | Heater, wafer heating apparatus and method for manufacturing heater |
JP4640842B2 (ja) * | 2006-10-11 | 2011-03-02 | 日本碍子株式会社 | 加熱装置 |
US8481892B2 (en) * | 2009-03-30 | 2013-07-09 | Ngk Insulators, Ltd. | Ceramic heater and method for producing same |
JP6767833B2 (ja) * | 2016-09-29 | 2020-10-14 | 日本特殊陶業株式会社 | 加熱装置 |
US11043401B2 (en) * | 2017-04-19 | 2021-06-22 | Ngk Spark Plug Co., Ltd. | Ceramic member |
-
2019
- 2019-12-23 WO PCT/JP2019/050428 patent/WO2020153079A1/ja active Application Filing
- 2019-12-23 CN CN201980077623.XA patent/CN113170539B/zh active Active
- 2019-12-23 JP JP2020567435A patent/JP7216746B2/ja active Active
- 2019-12-23 KR KR1020217013827A patent/KR102604134B1/ko active IP Right Grant
- 2019-12-25 TW TW108147550A patent/TWI816958B/zh active
-
2021
- 2021-04-21 US US17/301,992 patent/US20210243850A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006500789A (ja) * | 2002-09-19 | 2006-01-05 | アプライド マテリアルズ インコーポレイテッド | マルチゾーン抵抗ヒータ |
JP2005063691A (ja) * | 2003-08-13 | 2005-03-10 | Ngk Insulators Ltd | 加熱装置 |
JP3182120U (ja) * | 2012-12-26 | 2013-03-07 | 日本碍子株式会社 | セラミックヒーター |
JP2017152137A (ja) * | 2016-02-23 | 2017-08-31 | 日本碍子株式会社 | 静電チャックヒータ |
JP2017228360A (ja) * | 2016-06-20 | 2017-12-28 | 日本特殊陶業株式会社 | 加熱部材及び静電チャック |
Also Published As
Publication number | Publication date |
---|---|
TW202103516A (zh) | 2021-01-16 |
US20210243850A1 (en) | 2021-08-05 |
JP7216746B2 (ja) | 2023-02-01 |
KR20210058993A (ko) | 2021-05-24 |
WO2020153079A1 (ja) | 2020-07-30 |
CN113170539A (zh) | 2021-07-23 |
CN113170539B (zh) | 2023-03-14 |
TWI816958B (zh) | 2023-10-01 |
KR102604134B1 (ko) | 2023-11-17 |
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