JPWO2020115869A1 - 半導体装置用基板 - Google Patents
半導体装置用基板 Download PDFInfo
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- JPWO2020115869A1 JPWO2020115869A1 JP2020558757A JP2020558757A JPWO2020115869A1 JP WO2020115869 A1 JPWO2020115869 A1 JP WO2020115869A1 JP 2020558757 A JP2020558757 A JP 2020558757A JP 2020558757 A JP2020558757 A JP 2020558757A JP WO2020115869 A1 JPWO2020115869 A1 JP WO2020115869A1
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- Prior art keywords
- sintered body
- ceramic sintered
- circuit board
- semiconductor device
- substrate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims abstract description 104
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 18
- 239000011777 magnesium Substances 0.000 description 11
- 230000001629 suppression Effects 0.000 description 10
- 239000000395 magnesium oxide Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000012071 phase Substances 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011575 calcium Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910002480 Cu-O Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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Abstract
Description
1.7<(T1+T2)/T3<3.5・・・(2)
T1≧T2・・・(3)
T3≧0.25・・・(4)
図1は、実施形態に係る半導体装置1の断面図である。図2は、図1のA−A断面図である。
セラミックス焼結体3は、Al(アルミニウム)と、Zr(ジルコニウム)と、Y(イットリウム)と、Mg(マグネシウム)とを含む。
次に、セラミックス焼結体3の組成と、セラミックス焼結体3、第1回路板4及び第2回路板4’それぞれの厚みとの組み合わせについて説明する。
T1≧T2・・・(3)
T3≧0.25・・・(4)
図2を参照しながらセラミックス焼結体3の製造方法について説明する。図2は、セラミックス焼結体3の製造方法を示すフローチャートである。
まず、Al2O3、ZrO2、Y2O3及びMgOの粉体材料を調合して、ボールミルで粉砕混合した。この際、ZrO2の含有量S2とMgOの含有量S1とを表1に示すようにサンプルごとに変更し、残りはAl2O3とした。
サンプルNo.1〜72について、Si半導体チップ6に通電して発熱させることによって、下記の式(8)から半導体装置1の熱抵抗RJ−a(℃/W)を測定した。ただし、式(8)において、TjはSi半導体チップ6の素子温度(℃)であり、TaはSi半導体チップ6の周囲温度(℃)であり、QはSi半導体チップ6に供給した電力(W)である。
サンプルNo.1〜72について、セラミックス焼結体3にクラックが発生するまで、「−40℃×30分→25℃×5分→125℃×30分→25℃×5分」のサイクルを繰り返した。
2…半導体装置用基板
3…セラミックス焼結体
4,4’…回路板
6…半導体チップ
7…ボンディングワイヤ
8…ヒートシンク
9…放熱部
Claims (4)
- 板状に形成され、第1主面と第2主面とを有するセラミックス焼結体と、
前記第1主面上に配置され、銅又はアルミニウムによって構成される第1回路板と、
前記第2主面上に配置され、銅又はアルミニウムによって構成される第2回路板と、
を備え、
前記セラミックス焼結体は、Al、Zr、Y及びMgを含み、
セラミックス焼結体におけるMgのMgO換算での含有量をS1質量%とし、ZrのZrO2換算での含有量をS2質量%とした場合、下記の式(1)が成立し、
第1回路板の厚さをT1mmとし、第2回路板の厚さをT2mmとし、前記セラミックス焼結体の厚さをT3mmとした場合、下記の式(2)、(3)、(4)が成立する、
半導体装置用基板。
−0.004×S2+0.171<S1<−0.032×S2+1.427・・・(1)
1.7<(T1+T2)/T3<3.5・・・(2)
T1≧T2・・・(3)
T3≧0.25・・・(4) - 前記セラミックス焼結体において、下記の式(5)が成立する、
請求項1に記載の半導体装置用基板。
7.5≦S2≦25・・・(5) - 前記セラミックス焼結体において、下記の式(6)が成立する、
請求項1に記載の半導体装置用基板。
17.5≦S2≦23.5・・・(6) - 前記セラミックス焼結体において、下記の式(7)が成立する、
請求項1乃至3のいずれかに記載の半導体装置用基板。
0.08<S1<1.18・・・(7)
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JPH08195450A (ja) * | 1995-01-19 | 1996-07-30 | Fuji Electric Co Ltd | 半導体装置用基板 |
JP2015138830A (ja) * | 2014-01-21 | 2015-07-30 | Ngkエレクトロデバイス株式会社 | 電子部品実装用基板 |
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DE3376829D1 (en) * | 1982-06-29 | 1988-07-07 | Toshiba Kk | Method for directly bonding ceramic and metal members and laminated body of the same |
JP5172738B2 (ja) * | 2000-10-27 | 2013-03-27 | 株式会社東芝 | 半導体モジュールおよびそれを用いた電子機器 |
US6677059B2 (en) * | 2000-12-12 | 2004-01-13 | Tdk Corporation | EL device and making method |
JP4081299B2 (ja) * | 2002-05-23 | 2008-04-23 | 京セラ株式会社 | ガラスセラミック焼結体および配線基板 |
JP4965287B2 (ja) * | 2007-03-14 | 2012-07-04 | 東京エレクトロン株式会社 | 載置台 |
JP4717960B2 (ja) | 2009-04-03 | 2011-07-06 | 株式会社住友金属エレクトロデバイス | セラミックス焼結体およびそれを用いた半導体装置用基板 |
JP5841329B2 (ja) * | 2009-12-25 | 2016-01-13 | 株式会社日本セラテック | セラミックス接合体の製造方法 |
JP5937012B2 (ja) * | 2010-11-01 | 2016-06-22 | Ngkエレクトロデバイス株式会社 | 電子部品素子収納用パッケージ |
JP5836862B2 (ja) * | 2012-03-26 | 2015-12-24 | 京セラ株式会社 | 電子部品実装用基板および電子装置 |
DE102012110322B4 (de) | 2012-10-29 | 2014-09-11 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
EP3186077A4 (en) * | 2014-08-28 | 2018-04-18 | BYD Company Limited | Ceramic substrate, manufacturing method thereof, and power module |
EP3210956B1 (de) * | 2016-02-26 | 2018-04-11 | Heraeus Deutschland GmbH & Co. KG | Kupfer-keramik-verbund |
EP3210951B9 (de) * | 2016-02-26 | 2021-05-19 | Heraeus Deutschland GmbH & Co. KG | Kupfer-keramik-verbund |
WO2019167942A1 (ja) * | 2018-02-27 | 2019-09-06 | 三菱マテリアル株式会社 | 絶縁回路基板 |
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JPH08195450A (ja) * | 1995-01-19 | 1996-07-30 | Fuji Electric Co Ltd | 半導体装置用基板 |
JP2015138830A (ja) * | 2014-01-21 | 2015-07-30 | Ngkエレクトロデバイス株式会社 | 電子部品実装用基板 |
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