JPWO2020054146A1 - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- JPWO2020054146A1 JPWO2020054146A1 JP2020546693A JP2020546693A JPWO2020054146A1 JP WO2020054146 A1 JPWO2020054146 A1 JP WO2020054146A1 JP 2020546693 A JP2020546693 A JP 2020546693A JP 2020546693 A JP2020546693 A JP 2020546693A JP WO2020054146 A1 JPWO2020054146 A1 JP WO2020054146A1
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive layer
- resin
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018168735 | 2018-09-10 | ||
JP2018168735 | 2018-09-10 | ||
PCT/JP2019/022107 WO2020054146A1 (fr) | 2018-09-10 | 2019-06-04 | Feuille adhésive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020054146A1 true JPWO2020054146A1 (ja) | 2021-08-30 |
Family
ID=69778509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020546693A Pending JPWO2020054146A1 (ja) | 2018-09-10 | 2019-06-04 | 粘着シート |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2020054146A1 (fr) |
KR (1) | KR20210021063A (fr) |
CN (1) | CN112424308A (fr) |
TW (1) | TW202022073A (fr) |
WO (1) | WO2020054146A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114846098A (zh) * | 2019-12-20 | 2022-08-02 | 日东电工株式会社 | 粘合片 |
KR20220116448A (ko) * | 2019-12-20 | 2022-08-23 | 닛토덴코 가부시키가이샤 | 점착 시트 |
US20240091126A1 (en) * | 2021-02-04 | 2024-03-21 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition for cosmetic, resin composition for nail, base coat agent for gel nail, and adhesive for eyelash extension |
TWI834405B (zh) * | 2022-12-01 | 2024-03-01 | 財團法人工業技術研究院 | 雙面膠及多層結構體 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3915512B2 (ja) * | 2000-04-25 | 2007-05-16 | 日立化成工業株式会社 | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
WO2003014242A1 (fr) * | 2001-08-03 | 2003-02-20 | Sekisui Chemical Co., Ltd. | Bande recouverte d'un double adhesif et procede de fabrication de puce pour circuit integre utilisant cette bande |
JP2003171623A (ja) | 2001-12-04 | 2003-06-20 | Sekisui Chem Co Ltd | 接着構造体及び接着構造体の剥離方法 |
JP2006152141A (ja) * | 2004-11-30 | 2006-06-15 | Furukawa Electric Co Ltd:The | 粘着テープ |
JP5519971B2 (ja) * | 2008-11-26 | 2014-06-11 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010202833A (ja) * | 2009-03-05 | 2010-09-16 | Sekisui Chem Co Ltd | 電子部品加工用粘着テープ |
JP2012142189A (ja) * | 2010-12-28 | 2012-07-26 | Nitto Denko Corp | 有機el装置の製造方法および有機el装置製造用基板 |
JP2012146448A (ja) * | 2011-01-11 | 2012-08-02 | Nitto Denko Corp | 有機el装置の製造方法および有機el装置製造用基板 |
JP5749076B2 (ja) * | 2011-05-19 | 2015-07-15 | 藤森工業株式会社 | 表面保護フィルム、及びそれが貼着された光学部品 |
CN104520974B (zh) * | 2012-08-10 | 2016-02-10 | 积水化学工业株式会社 | 晶片的处理方法 |
JP6546378B2 (ja) * | 2013-11-19 | 2019-07-17 | 日東電工株式会社 | 樹脂シート |
JP7088736B2 (ja) * | 2017-10-06 | 2022-06-21 | 積水化学工業株式会社 | 表面保護フィルム |
JP6539383B2 (ja) * | 2018-06-18 | 2019-07-03 | 積水化学工業株式会社 | 粘着テープ |
-
2019
- 2019-06-04 JP JP2020546693A patent/JPWO2020054146A1/ja active Pending
- 2019-06-04 WO PCT/JP2019/022107 patent/WO2020054146A1/fr active Application Filing
- 2019-06-04 CN CN201980044971.7A patent/CN112424308A/zh active Pending
- 2019-06-04 KR KR1020217001506A patent/KR20210021063A/ko not_active Application Discontinuation
- 2019-06-10 TW TW108119878A patent/TW202022073A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN112424308A (zh) | 2021-02-26 |
WO2020054146A1 (fr) | 2020-03-19 |
TW202022073A (zh) | 2020-06-16 |
KR20210021063A (ko) | 2021-02-24 |
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