JPWO2020046990A5 - - Google Patents
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- JPWO2020046990A5 JPWO2020046990A5 JP2021505925A JP2021505925A JPWO2020046990A5 JP WO2020046990 A5 JPWO2020046990 A5 JP WO2020046990A5 JP 2021505925 A JP2021505925 A JP 2021505925A JP 2021505925 A JP2021505925 A JP 2021505925A JP WO2020046990 A5 JPWO2020046990 A5 JP WO2020046990A5
- Authority
- JP
- Japan
- Prior art keywords
- power
- generators
- pulsed
- waveforms
- slave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000000034 method Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024084068A JP2024112933A (ja) | 2018-08-30 | 2024-05-23 | 乗数モードを用いる高周波（ｒｆ）パルスインピーダンス同調 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/117,457 | 2018-08-30 | ||
| US16/117,457 US10854427B2 (en) | 2018-08-30 | 2018-08-30 | Radio frequency (RF) pulsing impedance tuning with multiplier mode |
| PCT/US2019/048407 WO2020046990A1 (en) | 2018-08-30 | 2019-08-27 | Radio frequency (rf) pulsing impedance tuning with multiplier mode |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024084068A Division JP2024112933A (ja) | 2018-08-30 | 2024-05-23 | 乗数モードを用いる高周波（ｒｆ）パルスインピーダンス同調 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021535542A JP2021535542A (ja) | 2021-12-16 |
| JPWO2020046990A5 true JPWO2020046990A5 (https=) | 2022-08-09 |
| JP2021535542A5 JP2021535542A5 (https=) | 2022-08-09 |
Family
ID=69639075
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021505925A Pending JP2021535542A (ja) | 2018-08-30 | 2019-08-27 | 乗数モードを用いる高周波（ｒｆ）パルスインピーダンス同調 |
| JP2024084068A Pending JP2024112933A (ja) | 2018-08-30 | 2024-05-23 | 乗数モードを用いる高周波（ｒｆ）パルスインピーダンス同調 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024084068A Pending JP2024112933A (ja) | 2018-08-30 | 2024-05-23 | 乗数モードを用いる高周波（ｒｆ）パルスインピーダンス同調 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10854427B2 (https=) |
| JP (2) | JP2021535542A (https=) |
| KR (1) | KR20210040161A (https=) |
| CN (1) | CN112585716B (https=) |
| TW (1) | TWI856971B (https=) |
| WO (1) | WO2020046990A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12505980B2 (en) | 2009-05-01 | 2025-12-23 | Advanced Energy Industries, Inc. | Apparatus to produce a waveform |
| US10424467B2 (en) * | 2017-03-13 | 2019-09-24 | Applied Materials, Inc. | Smart RF pulsing tuning using variable frequency generators |
| US12505986B2 (en) | 2017-11-17 | 2025-12-23 | Advanced Energy Industries, Inc. | Synchronization of plasma processing components |
| WO2020068107A1 (en) * | 2018-09-28 | 2020-04-02 | Lam Research Corporation | Systems and methods for optimizing power delivery to an electrode of a plasma chamber |
| KR20220123284A (ko) * | 2020-05-01 | 2022-09-06 | 매슨 테크놀로지 인크 | 표면 트리트먼트 처리를 위한 펄스 유도 결합 플라즈마의 방법 및 장치 |
| US12609283B2 (en) | 2020-06-15 | 2026-04-21 | Lam Research Corporation | Control of pulsing frequencies and duty cycles of parameters of RF signals |
| KR20260048616A (ko) * | 2020-07-15 | 2026-04-10 | 램 리써치 코포레이션 | 플라즈마 챔버의 rf 코일들의 역 동기화된 펄싱 |
| JP7536540B2 (ja) * | 2020-07-16 | 2024-08-20 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| TWI906346B (zh) * | 2020-08-31 | 2025-12-01 | 日商東京威力科創股份有限公司 | 電漿處理裝置及電漿處理方法 |
| JP7575353B2 (ja) * | 2020-08-31 | 2024-10-29 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN114188204B (zh) * | 2020-09-14 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理方法、射频发生器以及装置 |
| CN116779407A (zh) * | 2020-10-13 | 2023-09-19 | 北京北方华创微电子装备有限公司 | 获取方法、阻抗匹配器及其方法和半导体工艺设备 |
| KR20230114184A (ko) | 2020-12-08 | 2023-08-01 | 램 리써치 코포레이션 | 저 주파수 RF 생성기 및 연관된 정전 척 (electrostatic chuck) |
| TW202243549A (zh) * | 2021-04-22 | 2022-11-01 | 大陸商北京屹唐半導體科技股份有限公司 | 用於感應耦合電漿（ｉｃｐ）負載的雙頻匹配電路 |
| US12451329B2 (en) | 2021-06-02 | 2025-10-21 | Tokyo Electron Limited | Plasma processing apparatus with tunable electrical characteristic |
| EP4105963A1 (en) * | 2021-06-17 | 2022-12-21 | Impedans Ltd | A controller for a matching unit of a plasma processing system |
| US11476090B1 (en) * | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
| US11694876B2 (en) * | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
| KR102766926B1 (ko) * | 2021-12-23 | 2025-02-14 | 세메스 주식회사 | 기판 처리 장치, 기판 처리 방법 및 플라즈마 발생 방법 |
| KR20240140975A (ko) * | 2022-02-04 | 2024-09-24 | 램 리써치 코포레이션 | Hf rf 생성기와 연관된 반사 전력을 효율적으로 감소시키기 위한 시스템 및 방법 |
| US12046449B2 (en) * | 2022-04-22 | 2024-07-23 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| US20230361242A1 (en) * | 2022-05-04 | 2023-11-09 | Applied Materials, Inc. | Dry treatment for surface loss removal in micro-led structures |
| JP7577093B2 (ja) * | 2022-06-29 | 2024-11-01 | 東京エレクトロン株式会社 | プラズマ処理システムおよびプラズマ処理方法 |
| CN115015618B (zh) * | 2022-08-08 | 2022-10-14 | 深圳市恒运昌真空技术有限公司 | 一种射频电源信号采集方法及装置 |
| CN115015796B (zh) * | 2022-08-08 | 2022-10-14 | 深圳市恒运昌真空技术有限公司 | 一种射频电源信号采集方法及装置 |
| CN118588525A (zh) * | 2023-03-03 | 2024-09-03 | 北京北方华创微电子装备有限公司 | 阻抗匹配方法、等离子体设备、电子设备及存储介质 |
| CN119170473B (zh) * | 2023-06-19 | 2025-10-10 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其脉冲调节等离子体方法 |
| US20250191884A1 (en) * | 2023-12-11 | 2025-06-12 | Applied Materials, Inc. | Pulsed voltage waveform biasing of plasma |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080236490A1 (en) * | 2007-03-29 | 2008-10-02 | Alexander Paterson | Plasma reactor with an overhead inductive antenna and an overhead gas distribution showerhead |
| CN101287327B (zh) * | 2007-04-13 | 2011-07-20 | 中微半导体设备(上海)有限公司 | 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 |
| US8404598B2 (en) | 2009-08-07 | 2013-03-26 | Applied Materials, Inc. | Synchronized radio frequency pulsing for plasma etching |
| US10128090B2 (en) * | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
| TWI599272B (zh) * | 2012-09-14 | 2017-09-11 | 蘭姆研究公司 | 根據三個或更多狀態之功率及頻率調整 |
| WO2014164300A1 (en) * | 2013-03-13 | 2014-10-09 | Applied Materials, Inc | Pulsed pc plasma etching process and apparatus |
| JP6312405B2 (ja) * | 2013-11-05 | 2018-04-18 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| EP3162564B1 (en) * | 2014-06-24 | 2020-10-28 | Kyocera Document Solutions Inc. | Adjustment mechanism, image-forming apparatus provided with adjustment mechanism, and adjustment method using said adjustment mechanism |
| US9544987B2 (en) * | 2014-06-30 | 2017-01-10 | Advanced Energy Industries, Inc. | Frequency tuning for pulsed radio frequency plasma processing |
| JP6512962B2 (ja) * | 2014-09-17 | 2019-05-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR101677748B1 (ko) * | 2014-10-29 | 2016-11-29 | 삼성전자 주식회사 | 펄스 플라즈마 장치 및 펄스 플라즈마 장치 구동 방법 |
| US9536749B2 (en) * | 2014-12-15 | 2017-01-03 | Lam Research Corporation | Ion energy control by RF pulse shape |
| US9788405B2 (en) * | 2015-10-03 | 2017-10-10 | Applied Materials, Inc. | RF power delivery with approximated saw tooth wave pulsing |
| US9741539B2 (en) * | 2015-10-05 | 2017-08-22 | Applied Materials, Inc. | RF power delivery regulation for processing substrates |
| US9754767B2 (en) | 2015-10-13 | 2017-09-05 | Applied Materials, Inc. | RF pulse reflection reduction for processing substrates |
| US9614524B1 (en) | 2015-11-28 | 2017-04-04 | Applied Materials, Inc. | Automatic impedance tuning with RF dual level pulsing |
| JP6392266B2 (ja) * | 2016-03-22 | 2018-09-19 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US9872373B1 (en) | 2016-10-25 | 2018-01-16 | Applied Materials, Inc. | Smart multi-level RF pulsing methods |
| JP6770868B2 (ja) * | 2016-10-26 | 2020-10-21 | 東京エレクトロン株式会社 | プラズマ処理装置のインピーダンス整合のための方法 |
| US10424467B2 (en) | 2017-03-13 | 2019-09-24 | Applied Materials, Inc. | Smart RF pulsing tuning using variable frequency generators |
-
2018
- 2018-08-30 US US16/117,457 patent/US10854427B2/en active Active
-
2019
- 2019-08-27 JP JP2021505925A patent/JP2021535542A/ja active Pending
- 2019-08-27 WO PCT/US2019/048407 patent/WO2020046990A1/en not_active Ceased
- 2019-08-27 CN CN201980054968.3A patent/CN112585716B/zh active Active
- 2019-08-27 KR KR1020217009047A patent/KR20210040161A/ko not_active Ceased
- 2019-08-30 TW TW108131260A patent/TWI856971B/zh active
-
2024
- 2024-05-23 JP JP2024084068A patent/JP2024112933A/ja active Pending
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