CN101287327B - 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 - Google Patents
射频功率源系统及使用该射频功率源系统的等离子体反应腔室 Download PDFInfo
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- CN101287327B CN101287327B CN2007100394535A CN200710039453A CN101287327B CN 101287327 B CN101287327 B CN 101287327B CN 2007100394535 A CN2007100394535 A CN 2007100394535A CN 200710039453 A CN200710039453 A CN 200710039453A CN 101287327 B CN101287327 B CN 101287327B
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 74
- 238000000034 method Methods 0.000 claims description 20
- 230000003321 amplification Effects 0.000 claims description 12
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 12
- 230000005284 excitation Effects 0.000 claims description 6
- 238000001308 synthesis method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
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- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010494 dissociation reaction Methods 0.000 description 3
- 230000005593 dissociations Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
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- 238000001914 filtration Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 238000010849 ion bombardment Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/34—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (21)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100394535A CN101287327B (zh) | 2007-04-13 | 2007-04-13 | 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 |
US11/739,785 US7503996B2 (en) | 2007-04-13 | 2007-04-25 | Multiple frequency plasma chamber, switchable RF system, and processes using same |
KR1020070138711A KR100982374B1 (ko) | 2007-04-13 | 2007-12-27 | 다중 주파수 플라즈마 챔버, rf 시스템, 및 이를 이용한공정 |
JP2008004244A JP2008263587A (ja) | 2007-04-13 | 2008-01-11 | Rfパワーソースシステムと該rfパワーソースシステムを使用するプラズマチェンバー |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100394535A CN101287327B (zh) | 2007-04-13 | 2007-04-13 | 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102300125A Division CN101896034A (zh) | 2007-04-13 | 2007-04-13 | 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101287327A CN101287327A (zh) | 2008-10-15 |
CN101287327B true CN101287327B (zh) | 2011-07-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100394535A Active CN101287327B (zh) | 2007-04-13 | 2007-04-13 | 射频功率源系统及使用该射频功率源系统的等离子体反应腔室 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7503996B2 (zh) |
JP (1) | JP2008263587A (zh) |
KR (1) | KR100982374B1 (zh) |
CN (1) | CN101287327B (zh) |
Families Citing this family (41)
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US7811410B2 (en) * | 2008-06-19 | 2010-10-12 | Lam Research Corporation | Matching circuit for a complex radio frequency (RF) waveform |
US8044594B2 (en) | 2008-07-31 | 2011-10-25 | Advanced Energy Industries, Inc. | Power supply ignition system and method |
CN101736326B (zh) * | 2008-11-26 | 2011-08-10 | 中微半导体设备(上海)有限公司 | 电容耦合型等离子体处理反应器 |
US8395078B2 (en) * | 2008-12-05 | 2013-03-12 | Advanced Energy Industries, Inc | Arc recovery with over-voltage protection for plasma-chamber power supplies |
EP2219205B1 (en) | 2009-02-17 | 2014-06-04 | Solvix GmbH | A power supply device for plasma processing |
KR101124419B1 (ko) * | 2009-02-18 | 2012-03-20 | 포항공과대학교 산학협력단 | 마이크로파 플라즈마 생성을 위한 휴대용 전력 공급 장치 |
JP5496568B2 (ja) * | 2009-08-04 | 2014-05-21 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
CN101989525A (zh) * | 2009-08-05 | 2011-03-23 | 中微半导体设备(上海)有限公司 | 具备可切换偏置频率的等离子体处理腔及可切换匹配网络 |
TWI416995B (zh) * | 2009-08-17 | 2013-11-21 | Advanced Micro Fab Equip Inc | A plasma processing chamber having a switchable bias frequency, and a switchable matching network |
CN102202454A (zh) * | 2010-03-23 | 2011-09-28 | 中微半导体设备(上海)有限公司 | 可切换的射频功率源系统 |
CN103648230A (zh) * | 2010-03-23 | 2014-03-19 | 中微半导体设备(上海)有限公司 | 可切换的射频功率源系统 |
US8552665B2 (en) | 2010-08-20 | 2013-10-08 | Advanced Energy Industries, Inc. | Proactive arc management of a plasma load |
CN102438389B (zh) * | 2010-09-29 | 2013-06-05 | 中微半导体设备(上海)有限公司 | 单一匹配网络、其构建方法和该匹配网络射频功率源系统 |
CN102983051B (zh) * | 2011-09-05 | 2015-06-24 | 中微半导体设备(上海)有限公司 | 可调节等离子体浓度分布的等离子处理装置及其处理方法 |
TW201316375A (zh) | 2011-10-05 | 2013-04-16 | Intevac Inc | 電感/電容複合式電漿供應源及具有其腔室之系統 |
JP5935116B2 (ja) * | 2011-12-16 | 2016-06-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP2013143432A (ja) * | 2012-01-10 | 2013-07-22 | Tokyo Electron Ltd | プラズマ処理装置 |
CN103311082B (zh) * | 2012-03-13 | 2016-04-27 | 中微半导体设备(上海)有限公司 | 一种射频匹配网络及其所应用的等离子体处理腔 |
JP6207880B2 (ja) * | 2012-09-26 | 2017-10-04 | 東芝メモリ株式会社 | プラズマ処理装置およびプラズマ処理方法 |
WO2014094737A2 (de) * | 2012-12-18 | 2014-06-26 | TRUMPF Hüttinger GmbH + Co. KG | Verfahren zur erzeugung einer hochfrequenzleistung und leistungsversorgungssystem mit einem leistungswandler zur versorgung einer last mit leistung |
DE202013012714U1 (de) | 2012-12-18 | 2018-10-15 | TRUMPF Hüttinger GmbH + Co. KG | Leistungsversorgungssystem mit einem Leistungswandler |
JP6126905B2 (ja) * | 2013-05-14 | 2017-05-10 | 東京エレクトロン株式会社 | プラズマ処理装置 |
KR102278074B1 (ko) * | 2014-06-30 | 2021-07-19 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
KR20160028612A (ko) * | 2014-09-03 | 2016-03-14 | 삼성전자주식회사 | 반도체 제조 장치 및 이를 이용한 반도체 소자의 제조 방법 |
US10008366B2 (en) | 2015-09-08 | 2018-06-26 | Applied Materials, Inc. | Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processing |
US10373794B2 (en) | 2015-10-29 | 2019-08-06 | Lam Research Corporation | Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber |
US9824896B2 (en) * | 2015-11-04 | 2017-11-21 | Lam Research Corporation | Methods and systems for advanced ion control for etching processes |
US10043636B2 (en) | 2015-12-10 | 2018-08-07 | Lam Research Corporation | Apparatuses and methods for avoiding electrical breakdown from RF terminal to adjacent non-RF terminal |
US9748076B1 (en) * | 2016-04-20 | 2017-08-29 | Advanced Energy Industries, Inc. | Apparatus for frequency tuning in a RF generator |
US10187032B2 (en) * | 2016-06-17 | 2019-01-22 | Lam Research Corporation | Combiner and distributor for adjusting impedances or power across multiple plasma processing stations |
US10553465B2 (en) * | 2016-07-25 | 2020-02-04 | Lam Research Corporation | Control of water bow in multiple stations |
CN106234557A (zh) * | 2016-10-10 | 2016-12-21 | 成都沃特塞恩电子技术有限公司 | 一种射频功率源和射频解冻装置 |
CN108270412A (zh) * | 2016-12-30 | 2018-07-10 | 中微半导体设备(上海)有限公司 | 一种等离子体处理装置及其射频滤波电路 |
US10395896B2 (en) | 2017-03-03 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for ion energy distribution manipulation for plasma processing chambers that allows ion energy boosting through amplitude modulation |
US10264663B1 (en) | 2017-10-18 | 2019-04-16 | Lam Research Corporation | Matchless plasma source for semiconductor wafer fabrication |
CN111373504B (zh) * | 2018-04-04 | 2023-01-06 | 应用材料公司 | 偏置操作上的rf定制电压 |
US20190311884A1 (en) * | 2018-04-04 | 2019-10-10 | Applied Materials, Inc. | Rf tailored voltage on bias operation |
WO2020014113A1 (en) * | 2018-07-09 | 2020-01-16 | Lam Research Corporation | Radio frequency (rf) signal source supplying rf plasma generator and remote plasma generator |
US10854427B2 (en) * | 2018-08-30 | 2020-12-01 | Applied Materials, Inc. | Radio frequency (RF) pulsing impedance tuning with multiplier mode |
GB2584146A (en) | 2019-05-23 | 2020-11-25 | Comet Ag | Radio frequency generator |
WO2022054072A1 (en) * | 2020-09-13 | 2022-03-17 | Sigma Carbon Technologies | System for growth of crystalline material(s) |
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CN1039110A (zh) * | 1988-06-28 | 1990-01-24 | 东北工学院 | 以射频测定金属液位的方法及其装置 |
US5206604A (en) * | 1991-12-20 | 1993-04-27 | Harris Corporation | Broadband high power amplifier |
US5649308A (en) * | 1993-04-12 | 1997-07-15 | Trw Inc. | Multiformat auto-handoff communications handset |
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US6642149B2 (en) | 1998-09-16 | 2003-11-04 | Tokyo Electron Limited | Plasma processing method |
JP3897582B2 (ja) | 2000-12-12 | 2007-03-28 | キヤノン株式会社 | 真空処理方法、真空処理装置、半導体装置の製造方法および半導体装置 |
US7144521B2 (en) | 2003-08-22 | 2006-12-05 | Lam Research Corporation | High aspect ratio etch using modulation of RF powers of various frequencies |
-
2007
- 2007-04-13 CN CN2007100394535A patent/CN101287327B/zh active Active
- 2007-04-25 US US11/739,785 patent/US7503996B2/en active Active
- 2007-12-27 KR KR1020070138711A patent/KR100982374B1/ko active IP Right Grant
-
2008
- 2008-01-11 JP JP2008004244A patent/JP2008263587A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1039110A (zh) * | 1988-06-28 | 1990-01-24 | 东北工学院 | 以射频测定金属液位的方法及其装置 |
US5206604A (en) * | 1991-12-20 | 1993-04-27 | Harris Corporation | Broadband high power amplifier |
US5649308A (en) * | 1993-04-12 | 1997-07-15 | Trw Inc. | Multiformat auto-handoff communications handset |
Non-Patent Citations (1)
Title |
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JP特开2006-101209A 2006.04.13 |
Also Published As
Publication number | Publication date |
---|---|
KR20080092830A (ko) | 2008-10-16 |
US7503996B2 (en) | 2009-03-17 |
JP2008263587A (ja) | 2008-10-30 |
US20080251207A1 (en) | 2008-10-16 |
KR100982374B1 (ko) | 2010-09-14 |
CN101287327A (zh) | 2008-10-15 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Radio frequency power source system and plasma reaction chamber applying same Effective date of registration: 20150202 Granted publication date: 20110720 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170809 Granted publication date: 20110720 Pledgee: China Development Bank Co Pledgor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Registration number: 2009310000663 |
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Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |