JPWO2019225187A1 - コンデンサ - Google Patents
コンデンサ Download PDFInfo
- Publication number
- JPWO2019225187A1 JPWO2019225187A1 JP2020521082A JP2020521082A JPWO2019225187A1 JP WO2019225187 A1 JPWO2019225187 A1 JP WO2019225187A1 JP 2020521082 A JP2020521082 A JP 2020521082A JP 2020521082 A JP2020521082 A JP 2020521082A JP WO2019225187 A1 JPWO2019225187 A1 JP WO2019225187A1
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit board
- bus bar
- capacitor element
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 126
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 238000009429 electrical wiring Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 32
- 239000004734 Polyphenylene sulfide Substances 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 8
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000011104 metalized film Substances 0.000 description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
Abstract
Description
以上、本実施の形態によれば、以下の効果が奏される。
100 コンデンサ素子
110 第1端面電極(電極)
120 第1端面電極(電極)
200 第1バスバー(バスバー)
300 第2バスバー(バスバー)
500 回路基板
510 放電回路(電子回路)
600 基板ホルダ(基板保持部)
620 固定ボス(固定部)
621 載置面
622 ネジ穴
630 堀部
631 第1壁部
632 第2壁部
640 桟
641 桟
650 開口部
670 第1信号バスバー(電気配線)
680 第2信号バスバー(電気配線)
800 ケース
900 充填樹脂
Claims (7)
- コンデンサ素子と、
前記コンデンサ素子が収容されるケースと、
前記ケース内に充填される充填樹脂と、
電子回路が搭載された回路基板を固定するための固定部を有し、前記回路基板が前記充填樹脂から露出した状態で保持される基板保持部と、
を備えることを特徴とするコンデンサ。 - 請求項1に記載のコンデンサにおいて、
前記固定部は、前記回路基板が載せられる載置面を有し、
前記基板保持部は、少なくとも前記載置面が前記充填樹脂から露出するように、前記充填樹脂中に埋没する、
ことを特徴とするコンデンサ。 - 請求項2に記載のコンデンサにおいて、
前記固定部には、前記載置面に前記回路基板をネジ止めするためのネジ穴が形成され、
前記基板保持部には、前記固定部を取り囲む第1壁部と、前記固定部と前記第1壁部との間を埋める第2壁部とからなる堀部が、前記固定部の周囲に設けられる、
ことを特徴とするコンデンサ。 - 請求項2または3に記載のコンデンサにおいて、
前記基板保持部は、前記コンデンサ素子よりも前記ケースの開口側に配置され、
前記基板保持部には、前記ケースの開口側と前記コンデンサ素子側との間で貫通する開口部が設けられる、
ことを特徴とするコンデンサ。 - 請求項4に記載のコンデンサにおいて、
前記基板保持部には、前記開口部が複数設けられ、
隣接する2つの前記開口部の間に、T字状の断面形状を有する桟が形成される、
ことを特徴とするコンデンサ。 - 請求項1ないし5の何れか一項に記載のコンデンサにおいて、
前記コンデンサ素子の両端面に形成された電極に接続されるバスバーを、さらに備え、
前記基板保持部には、前記バスバーと前記電子回路とを電気的に接続する電気配線が設けられる、
ことを特徴とするコンデンサ。 - 請求項1ないし6の何れか一項に記載のコンデンサにおいて、
前記基板保持部の前記固定部に固定された前記回路基板を、さらに備える、
ことを特徴とするコンデンサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018100913 | 2018-05-25 | ||
JP2018100913 | 2018-05-25 | ||
PCT/JP2019/015583 WO2019225187A1 (ja) | 2018-05-25 | 2019-04-10 | コンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019225187A1 true JPWO2019225187A1 (ja) | 2021-06-10 |
JP7336637B2 JP7336637B2 (ja) | 2023-09-01 |
Family
ID=68615572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020521082A Active JP7336637B2 (ja) | 2018-05-25 | 2019-04-10 | コンデンサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US11869717B2 (ja) |
JP (1) | JP7336637B2 (ja) |
CN (1) | CN112166484B (ja) |
WO (1) | WO2019225187A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021014927A1 (ja) * | 2019-07-23 | 2021-01-28 | ||
JPWO2021157262A1 (ja) * | 2020-02-07 | 2021-08-12 | ||
JP7409491B2 (ja) | 2020-04-28 | 2024-01-09 | 株式会社村田製作所 | コンデンサモジュール |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049556A (ja) * | 2004-08-04 | 2006-02-16 | Shizuki Electric Co Inc | コンデンサ |
JP2010074935A (ja) * | 2008-09-18 | 2010-04-02 | Mitsubishi Heavy Ind Ltd | インバータ装置 |
JP2014207427A (ja) * | 2013-03-20 | 2014-10-30 | 株式会社デンソー | コンデンサモジュール |
JP2017130545A (ja) * | 2016-01-20 | 2017-07-27 | ニチコン株式会社 | フィルムコンデンサ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667267A (en) * | 1985-01-22 | 1987-05-19 | Rogers Corporation | Decoupling capacitor for pin grid array package |
JP5167922B2 (ja) | 2008-04-15 | 2013-03-21 | パナソニック株式会社 | ケースモールド型コンデンサ |
JP6421601B2 (ja) * | 2015-01-08 | 2018-11-14 | 株式会社オートネットワーク技術研究所 | キャパシタモジュール |
CN105244164B (zh) * | 2015-11-13 | 2020-09-01 | 纽茵泰克株式会社 | 改善了散热性及轻量化的外壳内置型电容器的放电电阻器加装结构 |
-
2019
- 2019-04-10 JP JP2020521082A patent/JP7336637B2/ja active Active
- 2019-04-10 WO PCT/JP2019/015583 patent/WO2019225187A1/ja active Application Filing
- 2019-04-10 CN CN201980032793.6A patent/CN112166484B/zh active Active
-
2020
- 2020-10-27 US US17/080,923 patent/US11869717B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049556A (ja) * | 2004-08-04 | 2006-02-16 | Shizuki Electric Co Inc | コンデンサ |
JP2010074935A (ja) * | 2008-09-18 | 2010-04-02 | Mitsubishi Heavy Ind Ltd | インバータ装置 |
JP2014207427A (ja) * | 2013-03-20 | 2014-10-30 | 株式会社デンソー | コンデンサモジュール |
JP2017130545A (ja) * | 2016-01-20 | 2017-07-27 | ニチコン株式会社 | フィルムコンデンサ |
Also Published As
Publication number | Publication date |
---|---|
US11869717B2 (en) | 2024-01-09 |
WO2019225187A1 (ja) | 2019-11-28 |
JP7336637B2 (ja) | 2023-09-01 |
CN112166484B (zh) | 2022-05-03 |
US20210043377A1 (en) | 2021-02-11 |
CN112166484A (zh) | 2021-01-01 |
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