JPWO2019221902A5 - - Google Patents
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- Publication number
- JPWO2019221902A5 JPWO2019221902A5 JP2021514285A JP2021514285A JPWO2019221902A5 JP WO2019221902 A5 JPWO2019221902 A5 JP WO2019221902A5 JP 2021514285 A JP2021514285 A JP 2021514285A JP 2021514285 A JP2021514285 A JP 2021514285A JP WO2019221902 A5 JPWO2019221902 A5 JP WO2019221902A5
- Authority
- JP
- Japan
- Prior art keywords
- optical
- memory device
- memory
- die
- stacked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023144166A JP2023168350A (ja) | 2018-05-17 | 2023-09-06 | 光学的に接合された積層メモリ、並びに関連する方法及びシステム |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862673046P | 2018-05-17 | 2018-05-17 | |
| US62/673,046 | 2018-05-17 | ||
| US201862680195P | 2018-06-04 | 2018-06-04 | |
| US62/680,195 | 2018-06-04 | ||
| PCT/US2019/029803 WO2019221902A1 (en) | 2018-05-17 | 2019-04-30 | Optically interfaced stacked memories and related methods and systems |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023144166A Division JP2023168350A (ja) | 2018-05-17 | 2023-09-06 | 光学的に接合された積層メモリ、並びに関連する方法及びシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021524977A JP2021524977A (ja) | 2021-09-16 |
| JPWO2019221902A5 true JPWO2019221902A5 (de) | 2022-05-12 |
| JP7346555B2 JP7346555B2 (ja) | 2023-09-19 |
Family
ID=68540900
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021514285A Active JP7346555B2 (ja) | 2018-05-17 | 2019-04-30 | 光学的に接合された積層メモリ、並びに関連する方法及びシステム |
| JP2023144166A Pending JP2023168350A (ja) | 2018-05-17 | 2023-09-06 | 光学的に接合された積層メモリ、並びに関連する方法及びシステム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023144166A Pending JP2023168350A (ja) | 2018-05-17 | 2023-09-06 | 光学的に接合された積層メモリ、並びに関連する方法及びシステム |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11367711B2 (de) |
| EP (1) | EP3811219A4 (de) |
| JP (2) | JP7346555B2 (de) |
| KR (1) | KR20210020925A (de) |
| CN (1) | CN112400161A (de) |
| CA (1) | CA3100481A1 (de) |
| SG (1) | SG11202011400PA (de) |
| TW (1) | TW202013668A (de) |
| WO (1) | WO2019221902A1 (de) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113853753A (zh) | 2019-03-06 | 2021-12-28 | 轻物质公司 | 光子通信平台 |
| EP3909075A4 (de) | 2019-05-17 | 2022-09-07 | Yangtze Memory Technologies Co., Ltd. | Dreidimensionale speichervorrichtung mit statischem direktzugriffsspeicher |
| KR20210122287A (ko) | 2019-05-17 | 2021-10-08 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | 정적 랜덤 액세스 메모리를 사용하는 3차원 메모리 디바이스의 캐시 프로그램 작동 |
| US11676636B2 (en) * | 2019-09-05 | 2023-06-13 | Seagate Technology Llc | Scalable storage device |
| US20210096311A1 (en) * | 2019-09-27 | 2021-04-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photonic semiconductor device and method of manufacture |
| KR20220137062A (ko) | 2020-02-03 | 2022-10-11 | 라이트매터, 인크. | 광자 웨이퍼 통신 시스템들 및 관련 패키지들 |
| KR20210098728A (ko) * | 2020-02-03 | 2021-08-11 | 삼성전자주식회사 | 적층형 메모리 장치 및 상기 적층형 메모리 장치의 동작 방법 |
| TW202209323A (zh) * | 2020-02-14 | 2022-03-01 | 美商爾雅實驗室公司 | 藉由單體式封裝光學i/o實施的遠端記憶體架構 |
| CN111399116A (zh) * | 2020-04-24 | 2020-07-10 | 罕王微电子（辽宁）有限公司 | 一种堆叠式光波导结构及制备方法 |
| CN114660710B (zh) * | 2020-12-23 | 2023-04-07 | 中国科学院半导体研究所 | 晶圆级光互连与交换片上系统 |
| US11880263B2 (en) * | 2021-05-13 | 2024-01-23 | Meta Platforms, Inc. | Systems having disaggregated components coupled by optical media |
| WO2023064337A1 (en) | 2021-10-13 | 2023-04-20 | Lightmatter, Inc. | Multi-tenant isolation on a multi-reticle photonic communication platform |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6202165B1 (en) | 1998-07-23 | 2001-03-13 | Conexant Systems, Inc. | Photonic clock distribution method and apparatus for electronic systems |
| US7941056B2 (en) | 2001-08-30 | 2011-05-10 | Micron Technology, Inc. | Optical interconnect in high-speed memory systems |
| US20080044128A1 (en) | 2001-10-09 | 2008-02-21 | Infinera Corporation | TRANSMITTER PHOTONIC INTEGRATED CIRCUITS (TxPICs) AND OPTICAL TRANSPORT NETWORK SYSTEM EMPLOYING TxPICs |
| US7251386B1 (en) | 2004-01-14 | 2007-07-31 | Luxtera, Inc | Integrated photonic-electronic circuits and systems |
| US7894699B2 (en) | 2006-10-16 | 2011-02-22 | Hewlett-Packard Development Company, L.P. | Photonic based interconnects for interconnecting multiple integrated circuits |
| US7898885B2 (en) | 2007-07-19 | 2011-03-01 | Micron Technology, Inc. | Analog sensing of memory cells in a solid state memory device |
| US8346087B2 (en) | 2007-09-28 | 2013-01-01 | Oracle America, Inc. | Wavelength-division multiplexing for use in multi-chip systems |
| US8059443B2 (en) * | 2007-10-23 | 2011-11-15 | Hewlett-Packard Development Company, L.P. | Three-dimensional memory module architectures |
| US8831437B2 (en) | 2009-09-04 | 2014-09-09 | Luxtera, Inc. | Method and system for a photonic interposer |
| JP5656853B2 (ja) | 2008-10-27 | 2015-01-21 | ジェナリーテ， インコーポレイテッド | 光学的な探査及び検知に基づくバイオセンサ |
| US8450186B2 (en) | 2009-09-25 | 2013-05-28 | Intel Corporation | Optical modulator utilizing wafer bonding technology |
| WO2011143548A2 (en) | 2010-05-14 | 2011-11-17 | Cornell University | Electro-optic modulator structures, related methods and applications |
| US9316788B2 (en) | 2010-10-14 | 2016-04-19 | Rwth Aachen | Laser to chip coupler |
| WO2012072726A1 (en) | 2010-12-01 | 2012-06-07 | Stmicroelectronics S.R.L. | Integrated driver and related method |
| US8222084B2 (en) | 2010-12-08 | 2012-07-17 | Skorpios Technologies, Inc. | Method and system for template assisted wafer bonding |
| JP5897414B2 (ja) | 2011-08-23 | 2016-03-30 | 日本オクラロ株式会社 | 光デバイスの製造方法 |
| WO2013064592A2 (en) * | 2011-11-04 | 2013-05-10 | Technische Universiteit Eindhoven | Wafer scale technique for interconnecting vertically stacked dies |
| US9627357B2 (en) * | 2011-12-02 | 2017-04-18 | Intel Corporation | Stacked memory allowing variance in device interconnects |
| WO2013086047A1 (en) | 2011-12-06 | 2013-06-13 | Cornell University | Integrated multi-chip module optical interconnect platform |
| US9697147B2 (en) * | 2012-08-06 | 2017-07-04 | Advanced Micro Devices, Inc. | Stacked memory device with metadata management |
| US9236958B2 (en) | 2012-08-10 | 2016-01-12 | Skorpios Technologies, Inc. | Method and system for performing testing of photonic devices |
| US9922887B2 (en) | 2012-12-11 | 2018-03-20 | Acacia Communications, Inc. | Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters |
| US9766409B2 (en) | 2013-06-10 | 2017-09-19 | Nxp Usa, Inc. | Optical redundancy |
| US9798083B2 (en) * | 2014-07-14 | 2017-10-24 | University Of Copenhagen | Optical device having efficient light-matter interface for quantum simulations |
| US9558779B2 (en) * | 2014-12-22 | 2017-01-31 | Mohammad A Mazed | System on chip (SoC) based on phase transition and/or phase change material |
| US20160191188A1 (en) | 2014-12-31 | 2016-06-30 | Alcatel-Lucent Usa Inc. | System and method for local interconnection of optical nodes |
| US9976844B2 (en) | 2015-02-06 | 2018-05-22 | Medlumics S.L. | Miniaturized OCT package and assembly thereof |
| US9910232B2 (en) * | 2015-10-21 | 2018-03-06 | Luxtera, Inc. | Method and system for a chip-on-wafer-on-substrate assembly |
| US10371893B2 (en) | 2017-11-30 | 2019-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hybrid interconnect device and method |
| US10284291B1 (en) * | 2018-04-25 | 2019-05-07 | Western Digital Technologies, Inc. | Node configuration in optical network |
| CN113853753A (zh) | 2019-03-06 | 2021-12-28 | 轻物质公司 | 光子通信平台 |
-
2019
- 2019-04-30 WO PCT/US2019/029803 patent/WO2019221902A1/en active Application Filing
- 2019-04-30 SG SG11202011400PA patent/SG11202011400PA/en unknown
- 2019-04-30 KR KR1020207036475A patent/KR20210020925A/ko not_active Application Discontinuation
- 2019-04-30 JP JP2021514285A patent/JP7346555B2/ja active Active
- 2019-04-30 CN CN201980046732.5A patent/CN112400161A/zh active Pending
- 2019-04-30 EP EP19803311.0A patent/EP3811219A4/de active Pending
- 2019-04-30 CA CA3100481A patent/CA3100481A1/en not_active Abandoned
- 2019-04-30 US US17/055,549 patent/US11367711B2/en active Active
- 2019-05-06 TW TW108115495A patent/TW202013668A/zh unknown
-
2023
- 2023-09-06 JP JP2023144166A patent/JP2023168350A/ja active Pending
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