JPWO2019004223A1 - 有機絶縁体、金属張積層板および配線基板 - Google Patents
有機絶縁体、金属張積層板および配線基板 Download PDFInfo
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Abstract
Description
本開示の金属張積層板は、上記の有機絶縁体と、有機絶縁体の少なくとも一方の面に積層された金属箔とを備えている。
本開示の配線基板は、上記の有機絶縁体により構成されている複数の絶縁層と、絶縁層間に配置された金属箔とを備えている。
COC:架橋可能な官能基を有する環状オレフィンコポリマー(三井化学(株)製)
(成分(B):エチレン性不飽和基の数が2以上のモノマー)
A−DCP:トリシクロデカンジメタノールジアクリレート(新中村化学工業(株)製)
DCP:トリシクロデカンジメタノールジメタクリレート(新中村化学工業(株)製)
TAIC:トリアリルイソシアヌレート(日本化成(株)製)
(過酸化物)
パークミルD:ジクミルパーオキシド(ベンゼン環有り、日油(株)製)
(難燃剤)
SAYTEX8010:1,2−ビス(2,3,4,5,6−ペンタブロモフェニル)エタン(アルベマール社製)
(球状シリカ)
SFP−30M:メタクリル処理、DENKA製)
3、23、43、63、83 有機樹脂相
5、25、45、65、85 耐候安定剤
9、29、49、69、89 内部領域
11、31、51、71、91 表層領域
13、33、53、73、93 無機粒子
95(95a、95b、95c、95d、95e) 単位層
97 界面
100 金属張積層板
103、113 金属箔
110 配線基板
Claims (18)
- 有機樹脂相を主成分とし、該有機樹脂相に耐候安定剤が含まれており、前記有機樹脂相が内部領域と該内部領域の少なくとも1つの表面に形成された表面領域とを含み、前記耐候安定剤の含有割合が、前記内部領域より前記表面領域の方が高い有機絶縁体。
- 板状を有しており、前記表面領域が前記有機絶縁体の面のうち最も面積の広い主面に存在している請求項1に記載の有機絶縁体。
- 前記表面領域が、前記内部領域の対向する2つの主面に存在する請求項2に記載の有機絶縁体。
- 前記有機樹脂相が無機粒子をさらに含み、無機粒子の含有割合が、前記内部領域より前記表面領域の方が低い請求項1〜3のいずれかに記載の有機絶縁体。
- 前記有機樹脂相が難燃剤をさらにを含み、前記内部領域に含まれる前記耐候安定剤の含有割合をSI、前記表面領域に含まれる前記耐候安定剤の含有割合をSO、前記内部領域に含まれる前記難燃剤の含有割合をFI、前記表面領域に含まれる前記難燃剤の含有割合をFO、としたときに、SO/SI>FO/FIの関係を有する、請求項1〜4のいずれかに記載の有機絶縁体。
- 前記表面領域が層状を有している、請求項1〜5のいずれかに記載の有機絶縁体。
- 前記有機樹脂相が、複数の単位層が積層された積層構造を有している、請求項1〜6のいずれかに記載の有機絶縁体。
- 前記単位層同士が重なった界面は、前記単位層の界面以外の部分に比べて、前記耐候安定剤および前記無機粒子の少なくとも一方の含有割合が低い、請求項7に記載の有機絶縁体。
- 前記有機樹脂相が熱硬化性樹脂を含む請求項1〜8のいずれかに記載の有機絶縁体。
- 前記有機樹脂相が熱可塑性樹脂を含む請求項9に記載の有機絶縁体。
- 前記熱可塑性樹脂の主成分が、環状オレフィンコポリマーである請求項10に記載の有機絶縁体。
- 前記熱硬化性樹脂が、環状オレフィンコポリマーを主成分とし、ベンゼン環を有する過酸化物を含む請求項9〜11のいずれかに記載の有機絶縁体。
- 前記熱硬化性樹脂が、分子内に架橋可能な官能基を有する環状オレフィンコポリマーと、分子内に少なくとも2個のエチレン性不飽和基を有するモノマーと、分子内にベンゼン環を有する過酸化物とを含む樹脂組成物の硬化物である請求項9〜12のいずれかに記載の有機絶縁体。
- 前記エチレン性不飽和基を有するモノマーが、トリシクロデカンジメタノールジアクリレート、トリシクロデカンジメタノールジメタクリレートおよびトリアリルイソシアヌレートからなる群より選択される少なくとも1種を含む、請求項13に記載の有機絶縁体。
- 前記エチレン性不飽和基を有するモノマーが、前記環状オレフィンコポリマーを100質量部としたときに、1質量部以上8質量部以下の割合で含まれる請求項13または14に記載の有機絶縁体。
- 難燃剤として、1,2−ビス(2,3,4,5,6−ペンタブロモフェニル)エタンをさらに含む請求項13〜15のいずれかに記載の有機絶縁体。
- 請求項1〜16のいずれかに記載の有機絶縁体と、該有機絶縁体の少なくとも一方の面に積層された金属箔とを備えている、金属張積層板。
- 請求項1〜16のいずれかに記載の有機絶縁体により構成されている、複数の絶縁層と、該絶縁層間に配置された金属箔とを備えている、配線基板。
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JP2017125277 | 2017-06-27 | ||
JP2017125277 | 2017-06-27 | ||
JP2017207258 | 2017-10-26 | ||
JP2017207258 | 2017-10-26 | ||
PCT/JP2018/024230 WO2019004223A1 (ja) | 2017-06-27 | 2018-06-26 | 有機絶縁体、金属張積層板および配線基板 |
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US (1) | US10772198B2 (ja) |
EP (1) | EP3648116A4 (ja) |
JP (1) | JP6884207B2 (ja) |
CN (1) | CN110741445B (ja) |
WO (1) | WO2019004223A1 (ja) |
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US11661495B2 (en) | 2018-06-26 | 2023-05-30 | Kyocera Corporation | Organic board, metal-clad laminate, and wiring board |
JP7237532B2 (ja) * | 2018-11-02 | 2023-03-13 | 京セラ株式会社 | 配線基板 |
US11879049B2 (en) | 2018-11-15 | 2024-01-23 | Kyocera Corporation | Organic insulating body, metal-clad laminate, and wiring board |
JPWO2021241469A1 (ja) * | 2020-05-27 | 2021-12-02 |
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JPS5660241A (en) * | 1979-10-22 | 1981-05-25 | Dainichi Nippon Cables Ltd | Continuous manufacture of vulcanized rubber and plastic molded article and electric wire covered with vulcanized rubber and plastic |
JP2003110246A (ja) * | 2001-09-27 | 2003-04-11 | Kyocera Corp | 絶縁シートおよびその製法並びに多層配線基板およびその製法 |
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JP2010100843A (ja) | 2008-09-29 | 2010-05-06 | Mitsui Chemicals Inc | 環状オレフィン共重合体およびその架橋体 |
CN104137658B (zh) * | 2012-02-23 | 2017-03-08 | 京瓷株式会社 | 布线基板、使用了该布线基板的安装结构体以及布线基板的制造方法 |
WO2015064668A1 (ja) * | 2013-10-29 | 2015-05-07 | 京セラ株式会社 | 配線基板、これを用いた実装構造体および積層シート |
WO2018061781A1 (ja) * | 2016-09-27 | 2018-04-05 | 富士フイルム株式会社 | ドライエッチング用組成物、キット、パターン形成方法および光学フィルタの製造方法 |
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JPS5660241A (en) * | 1979-10-22 | 1981-05-25 | Dainichi Nippon Cables Ltd | Continuous manufacture of vulcanized rubber and plastic molded article and electric wire covered with vulcanized rubber and plastic |
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JP2003238761A (ja) * | 2002-02-21 | 2003-08-27 | Nof Corp | 架橋性樹脂組成物、架橋性成形品および架橋成形品 |
JP2010123497A (ja) * | 2008-11-21 | 2010-06-03 | Nippon Zeon Co Ltd | 電気絶縁性多層シ−ト |
WO2013047726A1 (ja) * | 2011-09-30 | 2013-04-04 | 日本ゼオン株式会社 | 絶縁性接着フィルム、プリプレグ、積層体、硬化物、及び複合体 |
WO2014050871A1 (ja) * | 2012-09-27 | 2014-04-03 | 積水化学工業株式会社 | 多層基板の製造方法、多層絶縁フィルム及び多層基板 |
WO2018016527A1 (ja) * | 2016-07-22 | 2018-01-25 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
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US10772198B2 (en) | 2020-09-08 |
JP6884207B2 (ja) | 2021-06-09 |
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US20200128667A1 (en) | 2020-04-23 |
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