TWI608054B - 樹脂組成物、預浸物、覆金屬之積層板及佈線基板 - Google Patents

樹脂組成物、預浸物、覆金屬之積層板及佈線基板 Download PDF

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TWI608054B
TWI608054B TW105107517A TW105107517A TWI608054B TW I608054 B TWI608054 B TW I608054B TW 105107517 A TW105107517 A TW 105107517A TW 105107517 A TW105107517 A TW 105107517A TW I608054 B TWI608054 B TW I608054B
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Taiwan
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component
resin composition
mass
prepreg
clad laminate
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TW105107517A
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English (en)
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TW201638211A (zh
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主税智恵
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京瓷股份有限公司
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    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
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Description

樹脂組成物、預浸物、覆金屬之積層板及佈線基板
本發明係關於預浸物、覆金屬積層板及配線基板。
近年來，隨著LSI的高速化和高積體化、記憶體的大容量化等進展迅速，伴隨此之各種電子零件的小型化、輕量化、薄型化等亦急速地進展。因此，對於材料方面亦要求更優異的耐熱性、尺寸穩定性、電特性等。
向來，在印刷配線板係使用酚樹脂、環氧樹脂、聚醯亞胺樹脂等熱硬化性樹脂。該等樹脂中，雖然具有各種性能皆平衡者，然而在高頻區域之介電特性並不充分。作為解決此問題之新穎材料的聚苯醚受到矚目，而被嘗試應用在覆金屬之積層板(專利文獻1)。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開2005-8829號公報
本發明之樹脂組成物，係含有：作為成分(A)之主鏈末端之羥基藉由乙烯性不飽和化合物所改質後之聚苯醚、作為成分(B)之具有羥基或羧基之烯烴樹脂、作為成分(C)之選自三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種、以及作為成分(D)之有機過氧化物。
本發明之預浸物，係由上述樹脂組成物與基材所構成者。本發明之覆金屬積層板，係於上述預浸物的表面具備有導電性金屬箔者。
本發明之配線基板，係具備複數層之絕緣層與配置在該絕緣層間之導體層，絕緣層係由上述樹脂組成物與基材所構成者。
本發明之樹脂組成物，係含有：作為成分(A)之主鏈末端之羥基藉由乙烯性不飽和化合物所改質之聚苯醚、作為成分(B)之具有羥基或羧基之烯烴樹脂、作為成分(C)之選自三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種、以及作為成分(D)之有機過氧化物。
本發明之樹脂組成物所使用之成分(A)，係無特別限定，例如可列舉下述式(I)所示之化合物等。式(I)所示之化合物，係例如記載於日本專利第4913970號。
式(I)中，R1至R11係氫原子、或可具有取代基。作為取代基，係碳數1至8個的直鏈或分枝烷基、碳數2至8個的直鏈或分枝烯基、碳數2至8個的直鏈或分枝炔基、以及碳數6至10個的芳基之任一者。
作為其他取代基，例如可列舉：羧基、醛基、羥基、胺基等。Z表示羰基(>C=O)、硫羰基(>C=S)、亞甲基(-CH2-)、伸乙基(二亞甲基)(-CH2-CH2-)、三亞甲基(-CH2-CH2-CH2-)基或四亞甲基(-CH2-CH2-CH2-CH2-)。n為1至200的整數。
作為本發明之樹脂組成物所使用之成分(A)，可列舉上述式(I)中R1至R11為氫原子、甲基、乙基、或可具有取代基之苯基之化合物。
成分(A)的含量係無特別限定，當成分(A)、後述成分(B)、後述成分(C)及後述成分(D)之合計量為100質量%時，成分(A)之含有比率可為19.9至88質量%，藉由含有此比率之成分(A)，可降低介電常數及介電損耗角正切。成分(A)之含有比率可為30至73質量%，進一步含有比率可為58至66質量%。
本發明之樹脂組成物所使用之成分(B)，作為低介電常數/低介電損耗角正切成分而作用，由於為低分 子量，故成分(B)係與成分(A)與成分(C)之混合物進行混合時，三聚異氰酸三烯丙酯或三聚氰酸三烯丙酯之羰基，與烯烴樹脂的改質基之羥基或羧基產生氫鍵，由於未反應之成分(C)的取代基，及成分(A)與成分(C)之交聯物中的未交聯部的取代基，係抑制在高頻環境下的運動，因此加上作為成分(B)的材料所具有之優異的高頻特性，而發揮優異的高頻特性。作為成分(B)例如可列舉環烯烴共聚物、聚甲基戊烯等。
成分(B)的含量係無特別限定，當成分(A)、成分(B)、後述成分(C)及後述成分(D)之合計量為100質量%時，成分(B)之含有比率可為2.0至20.0質量%，藉由含有此比率之成分(B)，可降低介電常數及介電損耗角正切。成分(B)之含有比率可為2.0至10.0質量%。
本發明之樹脂組成物所使用之成分(C)係作為交聯劑而作用，可使用三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯中之一者或兩者。藉由使用三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯之至少1種，可發揮優異的高頻特性及耐熱性。
成分(C)的含量係無特別限定，當成分(A)、成分(B)、成分(C)及後述成分(D)之合計量為100質量%時，成分(C)之含有比率可為9.9至70質量%，藉由含有此比率之成分(C)，可發揮高耐熱性。成分(C)之含有比率可為20至50質量%。
本發明之樹脂組成物所使用之成分(D)，係 作為自由基起始劑而作用。亦即，成分(D)係為了使成分(A)、成分(B)及成分(C)進行自由基反應，以得到成分(A)、成分(B)及成分(C)之交聯物而使用。作為成分(D)係無特別限定，例如可列舉出過氧化二(第三丁基)、2,5-二甲基-2,5-二(過氧化第三丁基)己烷、2,5-二甲基-2,5-二(過氧化第三丁基)己炔-3等而無特別限定。該等化合物，市面上販售有例如「Perbutyl D」、「Perhexa 25B」、「Perhexyne 25B」(均為日油股份有限公司製)等。作為成分(D)，係可使用不含苯環之有機過氧化物。
本發明之樹脂組成物中，當成分(A)、成分(B)、成分(C)及成分(D)為100質量%時，成分(D)之含有比率為0.1至10質量%。藉由含有此比率之成分(D)，成分(A)、成分(B)及成分(C)的交聯反應有效地進行，可降低介電常數及介電損耗角正切。成分(D)之含有比率可為1至6質量%，進一步含有比率可為2至4質量%。
本發明之樹脂組成物中，在不阻礙本發明之樹脂組成物的效果之範圍內，可根據必要含有氧化矽、阻燃劑、應力緩和劑等。作為氧化矽，例如可列舉粉碎氧化矽、熔融氧化矽等，可單獨使用或混合2種以上使用。具體而言，可列舉經甲基丙烯酸矽烷處理之熔融氧化矽：SFP-130MC(電氣化學工業股份有限公司製)、FUSELEX E-2、Adma Fine SO-C5、PLV-3(均為龍森股份有限公司製)等。
作為氧化矽，較佳是使用具有平均粒徑為5μm以下之氧化矽粒子。藉由使用具有該平均粒徑之氧化 矽粒子，樹脂組成物，例如使用於覆金屬積層板等時，可提升與金屬箔之密合性。當成分(A)、成分(B)、成分(C)及成分(D)之合計量為100質量份時，氧化矽之含有比率可為5至40質量份。藉由含有此比率之氧化矽，可提升樹脂組成物的熔融流動性。進一步，樹脂組成物，例如使用於覆金屬積層板等時，可提升與金屬箔之密合性，亦可提升通孔連接可靠度。
阻燃劑係無特別限定，例如可列舉：三聚氰胺磷酸鹽、蜜白胺多磷酸鹽、蜜勒胺多磷酸鹽、三聚氰胺焦磷酸鹽、多磷酸銨、紅磷、芳香族磷酸酯、膦酸酯、亞膦酸酯、膦氧化物、膦氮烯(Phosphazene)、三聚氰胺氰酸酯等。該等阻燃劑可單獨使用或2種以上併用。從介電特性及耐燃性、耐熱性、密合性、耐濕性、耐藥性、可靠度等觀點而言，可使用三聚氰胺焦磷酸鹽、三聚氰胺多磷酸鹽、蜜白胺多磷酸鹽或多磷酸銨。
當成分(A)、成分(B)、成分(C)及成分(D)之合計量為100質量份時，阻燃劑之含有比率可為15至45質量份。藉由含有此比率之阻燃劑，可在幾乎不對介電特性、密合性、耐濕性造成影響下而提升耐燃性。
應力緩和劑係無特別限定，例如可列舉聚矽氧樹脂粒子等。作為聚矽氧樹脂粒子，例如，作為矽橡膠粉末可列舉KMP-597(信越化學工業股份有限公司製)、X-52-875(信越化學工業股份有限公司製)，作為矽樹脂粉末可列舉KMP-590(信越化學工業股份有限公司製)、X-52-1621 (信越化學工業股份有限公司製)等。此等應力緩和劑可單獨使用或2種以上併用。
作為應力緩和劑，可使用具有10μm以下的平均粒徑者。藉由使用具有該平均粒徑之應力緩和劑，樹脂組成物，例如使用於覆金屬積層板等時，可提升與金屬箔之密合性。藉由含有此比率之應力緩和劑，樹脂組成物，例如使用於覆金屬積層板等時，可提升與金屬箔之密合性以及耐吸濕性，亦可提升通孔連接可靠度。
本發明之樹脂組成物，除了上述成分之外，可根據其用途適當地添加填充劑、添加劑等。作為填充劑，例如可列舉碳黑、氧化鈦、鈦酸鋇、玻璃珠、玻璃中空球等。作為添加劑，例如可列舉抗氧化劑、熱穩定劑、抗靜電劑、塑化劑、顏料、染料、著色劑等。添加劑的具體例，例如可列舉R-42(堺化學股份有限公司製)、IRGANOX1010(BASF公司製)等。填充劑或添加劑係可單獨使用或2種以上併用。
進一步，本發明之樹脂組成物中，可添加熱塑性樹脂及熱硬化性樹脂之至少1種。作為熱塑性樹脂，例如可列舉GPPS(泛用聚苯乙烯)、HIPS(耐衝擊性聚苯乙烯)、聚丁二烯、苯乙烯-丁二烯共聚物等。作為熱硬化性樹脂，例如可列舉環氧樹脂等。該等樹脂係可單獨使用或2種以上併用。
本發明之樹脂組成物，例如可混合上述成分(A)至(D)及根據必要之其他成分而得到，混合方法係無 特別限定。混合方法，例如可列舉使全部成分均勻地溶解或分散於溶劑中之溶液混合法、或是藉由擠壓機等予以加熱而進行之熔融摻合法等。作為溶液混合法中所使用之溶劑，例如可列舉出苯、甲苯、二甲苯等芳香族系溶劑；四氫呋喃等。該等溶劑係可單獨使用或2種以上併用。
接著，針對本發明之預浸物進行說明。本發明之預浸物係含有本發明之樹脂組成物及基材。例如可依照一般方法將本發明之樹脂組成物塗布或含浸至基材後，進行乾燥而得到預浸物。作為基材，例如可列舉玻璃、聚醯亞胺等纖維的織布及不織布、紙等。玻璃的材質，除了一般的E玻璃之外，可列舉D玻璃、S玻璃、石英玻璃等。
預浸物中基材所佔有之比率，可為在預浸物全體中含有20至80質量%。本發明之預浸物中，可根據必要將矽烷系偶合劑、鈦酸酯系偶合劑等偶合劑塗布在基材上使用。
預浸物中的樹脂組成(成分)及含量，可藉由質譜分析氣相層析(GC-MS)、核磁共振分析(1H-NMR及13C-NMR、傅里葉轉換紅外線光譜分析(FT-IR)進行分析而確認。
製造本發明之預浸物的方法係無特別限定，例如可列舉將本發明之樹脂組成物，根據必要均勻地溶解或分散於溶劑(例如上述之芳香族系溶劑、如甲基乙基酮之酮系溶劑等)，塗布或含浸至基材後進行乾燥之方法。
此外，亦可熔融樹脂組成物，使其含浸至基材中。塗布方法及含浸方法並無特別限定，例如可列舉：使用噴霧器、毛刷、棒塗布機等將樹脂組成物的溶解液或分散液進行塗布之方法；以及將基材浸漬於樹脂組成物的溶解液或分散液之方法(浸泡法)等。塗布或含浸，可根據必要重複進行複數次。或是可使用樹脂濃度不同之複數種溶解液或分散液，重複進行塗布或含浸。
本發明之預浸物，例如提供於加熱成形而加工為積層板。積層板，例如可根據期望的厚度重疊複數片預浸物，進行加熱加壓成形而得到。進一步，亦可將得到之積層板與其他的預浸物組合，而得到更厚的積層板。積層成形及硬化，通常是使用熱壓機同時進行，惟兩者亦可分開進行。
亦即，首先進行積層成形而得到半硬化的積層板，接著藉由熱處理機進行處理使其完全硬化。加熱加壓成形，可在80至300℃、0.1至50MPa的加壓下進行1分鐘至10小時左右，亦可在150至250℃、0.5至10MPa的加壓下進行30分鐘至5小時左右。
接著針對本發明之覆金屬積層板進行說明。本發明之覆金屬積層板，係於本發明之預浸物的表面具備導電性金屬箔。例如，本發明之覆金屬積層板，係將重疊本發明之預浸物與導電性金屬箔進行加熱加壓成形而得到。作為導電性金屬箔係無特別限定，例如可列舉電解銅箔、軋壓銅箔等銅箔、鋁箔、重疊該等金屬箔而成之複 合箔等。該等導電性金屬箔中，較佳為銅箔。導電性金屬箔的厚度係無特別限定，可使用約5至105μm者。本發明之覆金屬積層板，亦可將本發明之預浸物與導電性金屬箔分別重疊期望之片數，進行加熱加壓成形而得到。本發明之覆金屬積層板，例如使用在印刷基板等。
接著，針對本發明之配線基板進行說明。本發明之配線基板，係具備複數層之絕緣層以及配置在該等絕緣層間之導體層，絕緣層由本發明之樹脂組成物與基材所構成。
本發明之配線基板，例如可於本發明之覆金屬積層板上重疊形成有電路及通孔之內層板與預浸物，使導電性金屬箔積層於預浸物的表面後，進行加熱加壓成形而得到。進一步，亦可於表面的導電性金屬箔形成電路及通孔，作為多層印刷配線基板。
若為本發明之樹脂組成物，可降低介電損耗角正切。此外，本揭示之配線基板，藉由使用如此之樹脂組成物，可得到介電損耗角正切低的預浸物以及覆金屬積層板，以及具有優異的高頻特性之配線基板。
[實施例]
以下，列舉實施例對本發明之樹脂組成物進行具體說明，惟本發明之樹脂組成物並不限定於該等實施例。
試樣中使用之成分如下所示。
SA9000：經甲基丙烯酸改質之聚苯醚(Sabic公司製)
COC：經順丁烯二酸改質之環烯烴共聚物(三井化學公司製)
HIPS：耐衝擊性聚苯乙烯(PS日本公司製)
TAIC：三聚異氰酸三烯丙酯(日本化成股份有限公司製)
Perbutyl P：α,α'-二-(第三丁基過氧基)二異丙基苯(日油股份有限公司製)
Perhexyne 25B：2,5-二甲基-2,5-二(第三丁基過氧化物)己炔-3(日油股份有限公司製)
氧化矽粒子：SFP-130MC(電氣化學工業股份有限公司製)
(試樣1至8)
將表1所示之成分以表1所示之比率進行混合，進一步，相對於成分(A)、成分(B)、成分(C)及成分(D)之合計量100質量份，添加作為阻燃劑之「SAYTEX8010」(Albemarle Asano股份有限公司製)30質量份，於室溫(25℃)攪拌而得到樹脂組成物。使所得之樹脂組成物溶解於甲苯而得到樹脂清漆。樹脂組成物與甲苯之質量比為50：50。
將得到之樹脂清漆使用棒塗布機在PET膜(載體膜)上成形，之後於110℃乾燥4分鐘，得到樹脂膜。
反覆操作得到之樹脂膜藉由層合機積層及載體膜之剝離而製作樹脂板。
接著，將得到之樹脂板的兩面以具有18μm 的厚度之銅箔夾住，於4MPa的加壓下加熱200分鐘(200℃)，得到具有1mm的厚度之覆銅積層板。
將得到之覆銅積層板的銅箔剝離，並藉由空腔共振器法測定在10GHz下的樹脂板之介電常數及介電損耗角正切。結果如表1所示。
如表1所示，可知試樣1至6所示之樹脂組成物的介電常數及介電損耗角正切較低。另一方面，可知沒有使用具有羥基或羧基之烯烴樹脂之試樣7、8的介電常數及介電損耗角正切皆高。

Claims (8)

  1. 一種樹脂組成物，其含有：成分(A)，係於主鏈的末端之羥基藉由乙烯性不飽和化合物所改質後之聚苯醚；成分(B)，係具有羥基或羧基之烯烴樹脂；成分(C)，係三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯中之至少1種；以及成分(D)，係有機過氧化物；其中，當前述成分(A)、前述成分(B)、前述成分(C)及前述成分(D)之合計量((A)+(B)+(C)+(D))為100質量%時，前述成分(A)之含有比率為19.9至88質量%。
  2. 一種樹脂組成物，其含有：成分(A)，係於主鏈的末端之羥基藉由乙烯性不飽和化合物所改質後之聚苯醚；成分(B)，係具有羥基或羧基之烯烴樹脂；成分(C)，係三聚異氰酸三烯丙酯及三聚氰酸三烯丙酯中之至少1種；以及成分(D)，係有機過氧化物；其中，當前述成分(A)、前述成分(B)、前述成分(C)及前述成分(D)之合計量((A)+(B)+(C)+(D))為100質量%時，前述成分(B)之含有比率為2.0至20.0質量%。
  3. 如申請專利範圍第1項所述之樹脂組成物，其中，前述成分(B)之含有比率為2.0至20.0質量%、前述成分(C)之含有比率為9.9至70質量%、前述成分(D)之含有比 率為0.1至10質量%。
  4. 如申請專利範圍第1至3項中任一項所述之樹脂組成物，更含有氧化矽。
  5. 一種預浸物，係由申請專利範圍第1至4項中任一項所述之樹脂組成物與基材所構成。
  6. 一種覆金屬積層板，係於申請專利範圍第5項所述之預浸物的表面具備導電性金屬箔。
  7. 如申請專利範圍第6項所述之覆金屬積層板，其中，前述預浸物中的樹脂組成物，係含有前述成分(A)、前述成分(B)、前述成分(C)及前述成分(D)之交聯物。
  8. 一種配線基板，係具備複數層之絕緣層與配置在該絕緣層間之導體層，前述絕緣層係由申請專利範圍第1至4項中任一項所述之樹脂組成物與基材所構成。
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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6749055B2 (ja) * 2016-09-09 2020-09-02 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
GB201706657D0 (en) * 2017-04-26 2017-06-07 Univ Liverpool Polymers
WO2019021862A1 (ja) * 2017-07-27 2019-01-31 三井金属鉱業株式会社 樹脂組成物、配線板用絶縁層及び積層体
CN111819227B (zh) * 2018-02-27 2023-04-04 京瓷株式会社 预浸渍体和电路基板用层叠板
US11661495B2 (en) * 2018-06-26 2023-05-30 Kyocera Corporation Organic board, metal-clad laminate, and wiring board
JP7375364B2 (ja) * 2018-08-21 2023-11-08 東洋紡エムシー株式会社 接着剤組成物、積層体、およびリチウムイオン電池用包装材料
US11879049B2 (en) * 2018-11-15 2024-01-23 Kyocera Corporation Organic insulating body, metal-clad laminate, and wiring board
CN110591241A (zh) * 2019-08-21 2019-12-20 瑞声科技（南京）有限公司 预浸料、覆铜层压板及印刷电路板
KR20220091463A (ko) * 2019-10-30 2022-06-30 린텍 가부시키가이샤 디바이스용 접착 시트
KR102324559B1 (ko) * 2020-02-28 2021-11-10 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
JP6905160B1 (ja) * 2020-03-13 2021-07-21 リンテック株式会社 デバイス用硬化性接着シート
WO2021181732A1 (ja) * 2020-03-13 2021-09-16 リンテック株式会社 デバイス用硬化性接着シート
WO2022210673A1 (ja) * 2021-03-30 2022-10-06 リンテック株式会社 硬化性接着剤組成物、硬化物、及び硬化物の製造方法
TW202300607A (zh) * 2021-03-30 2023-01-01 日商琳得科股份有限公司 接著片
JPWO2022210671A1 (zh) * 2021-03-30 2022-10-06
KR20240036556A (ko) * 2021-07-20 2024-03-20 린텍 가부시키가이샤 경화성 접착제 조성물, 및 경화성 접착 시트
WO2023053976A1 (ja) * 2021-09-29 2023-04-06 日本ゼオン株式会社 樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281789A (ja) * 1989-04-24 1990-11-19 Mitsubishi Gas Chem Co Inc 高周波プリント配線板用積層板
CN1659232A (zh) * 2002-04-09 2005-08-24 通用电气公司 热固性组合物、方法和制品
CN101164174A (zh) * 2005-04-26 2008-04-16 奥斯兰姆奥普托半导体有限责任公司 光学元件，含有该元件的光电器件及其制备
JP2011001473A (ja) * 2009-06-19 2011-01-06 Hitachi Chem Co Ltd 電子部品用絶縁材料
CN102304264A (zh) * 2011-08-23 2012-01-04 南亚塑胶工业股份有限公司 一种高频铜箔基板及其所使用的复合材料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0491161A (ja) * 1990-08-07 1992-03-24 Asahi Chem Ind Co Ltd 新規な硬化性樹脂組成物
JPH06116349A (ja) * 1992-10-06 1994-04-26 Asahi Chem Ind Co Ltd ポリフェニレンエーテル樹脂組成物および複合材料
JPH06172468A (ja) * 1992-12-07 1994-06-21 Asahi Chem Ind Co Ltd 新規な硬化性ポリフェニレンエーテル系樹脂組成物
JP4255759B2 (ja) 2003-06-20 2009-04-15 京セラケミカル株式会社 ポリフェニレンエーテル樹脂組成物、それを含有するプリプレグ、積層板、銅張積層板及びプリント配線板
ES2655275T3 (es) * 2010-07-14 2018-02-19 Guangdong Shengyi Sci. Tech Co., Ltd Material compuesto y sustrato de circuito de alta frecuencia fabricado con el material compuesto y el método de fabricación del mismo

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281789A (ja) * 1989-04-24 1990-11-19 Mitsubishi Gas Chem Co Inc 高周波プリント配線板用積層板
CN1659232A (zh) * 2002-04-09 2005-08-24 通用电气公司 热固性组合物、方法和制品
CN101164174A (zh) * 2005-04-26 2008-04-16 奥斯兰姆奥普托半导体有限责任公司 光学元件，含有该元件的光电器件及其制备
JP2011001473A (ja) * 2009-06-19 2011-01-06 Hitachi Chem Co Ltd 電子部品用絶縁材料
CN102304264A (zh) * 2011-08-23 2012-01-04 南亚塑胶工业股份有限公司 一种高频铜箔基板及其所使用的复合材料

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