JPWO2018155592A1 - 中空構造体の製造方法、めっき複合体及び中空構造体 - Google Patents
中空構造体の製造方法、めっき複合体及び中空構造体 Download PDFInfo
- Publication number
- JPWO2018155592A1 JPWO2018155592A1 JP2018532179A JP2018532179A JPWO2018155592A1 JP WO2018155592 A1 JPWO2018155592 A1 JP WO2018155592A1 JP 2018532179 A JP2018532179 A JP 2018532179A JP 2018532179 A JP2018532179 A JP 2018532179A JP WO2018155592 A1 JPWO2018155592 A1 JP WO2018155592A1
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- Prior art keywords
- core material
- hollow structure
- plating layer
- plating
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Abstract
アルミニウム製の芯材1の表面を被覆して銅めっき層3を形成してめっき複合体を製造し、そのめっき複合体の一部を切除して芯材1の切断面を表出させ、ついでそのめっき複合体をアルミニウムは溶解するが銅は溶解しないナトリウム水溶液に浸漬して、アルミニウムだけを選択的に溶解除去して、芯材1の箇所を中空部5Aにし、銅めっき層3a、3b、3cの全体から成る骨格部5Bにする中空構造体5を製造する。
Description
芯材の表面にめっき処理を施して形成しためっき層を有するめっき複合体であって、前記めっき層から前記芯材の一部が表出した形態の前記めっき複合体を製造し、
ついで前記芯材は溶解するが前記めっき層は溶解しない溶液によって前記芯材を溶解除去して前記芯材の箇所を中空部に転化し、
前記めっき層を骨格部とした中空構造体を製造することを特徴とする中空構造体の製造方法を提供する。
前記芯材の厚みが0.001〜1mmであり、前記めっき層の厚みが0.001〜1mmであることが好ましい。
前記芯材として、厚み方向に少なくとも1つの貫通孔が形成されているものを用いることが好ましい。
前記芯材として、表面の少なくとも一部に凹凸部が形成されたものを用いることが好ましい。
前記芯材として、前記溶液によって溶解しない材料からなるシート状部材が一体化されたものを用い、前記中空部内に前記シート状部材を残存させる構成とすることが好ましい。
前記めっき処理する前に、前記芯材の表面の少なくとも一部を、耐食性に優れると共に前記溶液に溶解しない耐食性金属層で被覆しておき、前記めっき層からなる前記骨格部の内面の少なくとも一部を、前記耐食性金属層により被覆された構造とすることが好ましい。
電子機器用の放熱器として用いるため、前記中空部に熱媒体を封入する工程をさらに有することが好ましい。
前記芯材は溶解するが前記めっき層は溶解しない溶液によって前記芯材を溶解除去して前記芯材の箇所を中空部に転化し、前記めっき層を中空構造体の骨格部とするべく、前記芯材の一部が前記めっき層から表出した形態となっている前記中空構造体の製造に用いられるめっき複合体を提供する。
前記めっき複合体の前記芯材の表面の少なくとも一部に凹凸部が形成されていることが好ましい。
前記めっき複合体の前記芯材は、前記中空部内に残存させる、前記溶液によって溶解しない材料からなるシート状部材が一体化されたものであることが好ましい。
前記めっき複合体の前記芯材と前記めっき層との間に、耐食性に優れると共に前記溶液に溶解しない耐食性金属層が、前記芯材の表面の少なくとも一部を被覆して介在されていることが好ましい。
前記中空構造体の前記芯材の厚み方向に相当する前記中空部の対向する内面間の間隔が0.001〜1mmであり、前記骨格部の厚みが0.001〜1mmであることが好ましい。
前記中空構造体の前記中空部の内面の少なくとも一部に、凹凸部を有することが好ましい。
前記中空構造体の前記中空部内に、前記溶液によって溶解しない材料からなるシート状部材が挿入配置されていることが好ましい。
前記中空構造体の前記めっき層からなる前記骨格部の内面の少なくとも一部が、耐食性に優れると共に前記溶液によって溶解しない耐食性金属層により被覆された構造であることが好ましい。
前記中空構造体は、電子機器用の放熱器、ケーブル又は金属チューブとして用いられることが好ましい。
特に厚み方向に貫通孔を形成した芯材を用いると、形成された骨格部では、貫通孔の壁面にも円筒状にめっき層が形成され、そしてその上下両端は骨格部の上面部と下面部を構成するめっき層と連結して一体化しているので、その円筒状のめっき層が、得られた中空構造体の上面部と下面部のめっき層間におけるへたりを防ぐ厚み方向の支柱としての補強作用も発揮するので好適である。
ついで、芯材の一部が表出しているめっき複合体を後述する溶液に浸漬して芯材だけを選択的に溶解除去する。この浸漬処理により、最終的に得られた中空構造体では、めっき複合体の芯材の箇所は中空部に転化し、めっき層はそのまま残って上面部のめっき層、下面部のめっき層、そして両めっき層を連結する円筒状のめっき層(貫通孔を形成した芯材の場合)から成る一体構造の骨格部が形成される。
芯材としては浸漬処理時に用いる溶液に溶解する金属又は合成樹脂が選定される。そしてめっき層を形成する材料としては浸漬処理時に用いる溶液に溶解しない金属が選定される。したがって浸漬処理時に用いる溶液としては、芯材は溶解するがめっき層は溶解しない溶液が選定される。
溶液としてはアルカリ水溶液と酸性水溶液のいずれも用いることはできるが、芯材の材料とめっき層を形成する材料との組み合わせに対応してそのいずれかが選定される。
芯材としては任意の厚みの平坦な板材や箔であってもよいが、図1で示したように、芯材1の上面部1aから下面部1bに向かう厚み方向に1つ以上の貫通孔2が形成されているものが好ましい。その理由は後述する。これら貫通孔2の断面形状は図1で示したような円形であることを好適とするが、その形状はこれに限定されるものではなく、例えば三角形、四角形、楕円、星形その他の異形断面形状など任意の形状であってもよい。このような貫通孔2は、例えば機械的な打ち抜き加工やドリル加工によって形成したり、またフォトリソグラフィーとエッチング技術を適用したりして形成することができる。
例えば水酸化ナトリウム水溶液にめっき複合体4Aを浸漬すると、銅めっき層3の切断面3dの位置から、切断面1dが表出している芯材1は、両性金属であるアルミニウムからなるため、当該水溶液に溶解する。しかし芯材1を被覆している銅めっき層3の銅は溶解しない。そしてその後も銅めっき層3の溶解は進行しない状態で、アルミニウム製の板材1だけの当該水溶液への溶解は、それが表出する切断面1dから内部に向かって進行していき、最終的には芯材1の全部がめっき複合体4Aから溶解される。アルミニウム製の芯材1の溶解液は、銅めっき層3の切断面3dによって取り囲まれた部位(芯材1の切断面1dが表出していた部位)から外部に排出され、これにより、芯材1は除去される。
1a 芯材1の上面部
1b 芯材1の下面部
1d 芯材1の切断面
10 耐食性金属層
2 貫通孔
2a 貫通孔2の壁面部
2A 貫通孔
3 銅めっき層(めっき層)
3a 銅めっき層3の上面
3b 銅めっき層3の下面
3c 貫通孔2Aの壁面(立設された銅めっき層)
3d 銅めっき層3の切断面
4 芯材−めっき複合部材
4A めっき複合体
5,51,52,53,54 中空構造体
5A,51A、52A,53A,54A 中空構造体の中空部
5B,51B,52B 中空構造体の骨格部
Claims (20)
- 芯材の表面にめっき処理を施して形成しためっき層を有するめっき複合体であって、前記めっき層から前記芯材の一部が表出した形態の前記めっき複合体を製造し、
ついで前記芯材は溶解するが前記めっき層は溶解しない溶液によって前記芯材を溶解除去して前記芯材の箇所を中空部に転化し、
前記めっき層を骨格部とした中空構造体を製造することを特徴とする中空構造体の製造方法。 - 前記芯材が、金属又は合成樹脂である請求項1記載の中空構造体の製造方法。
- 前記芯材の厚みが0.001〜1mmであり、前記めっき層の厚みが0.001〜1mmである請求項1又は2記載の中空構造体の製造方法。
- 前記芯材として、厚み方向に少なくとも1つの貫通孔が形成されているものを用いる請求項1〜3のいずれかに記載の中空構造体の製造方法。
- 前記芯材として、表面の少なくとも一部に凹凸部が形成されたものを用いる請求項1〜4のいずれか1に記載の中空構造体の製造方法。
- 前記芯材として、前記溶液によって溶解しない材料からなるシート状部材が一体化されたものを用い、前記中空部内に前記シート状部材を残存させる請求項1〜5のいずれか1に記載の中空構造体の製造方法。
- 前記めっき処理する前に、前記芯材の表面の少なくとも一部を、耐食性に優れると共に前記溶液に溶解しない耐食性金属層で被覆しておき、前記めっき層からなる前記骨格部の内面の少なくとも一部を、前記耐食性金属層により被覆された構造とする請求項1〜6のいずれか1に記載の中空構造体の製造方法。
- 電子機器用の放熱器として用いるため、前記中空部に熱媒体を封入する工程をさらに有する請求項1〜7のいずれか1に記載の中空構造体の製造方法。
- 芯材と、前記芯材の表面を被覆するめっき層とを有して構成され、
前記芯材は溶解するが前記めっき層は溶解しない溶液によって前記芯材を溶解除去して前記芯材の箇所を中空部に転化し、前記めっき層を中空構造体の骨格部とするべく、前記芯材の一部が前記めっき層から表出した形態となっている前記中空構造体の製造に用いられるめっき複合体。 - 前記芯材の厚みが0.001〜1mmであり、前記めっき層の厚みが0.001〜1mmである請求項9記載のめっき複合体。
- 前記芯材の表面の少なくとも一部に凹凸部が形成されている請求項9又は10記載のめっき複合体。
- 前記芯材は、前記中空部内に残存させる、前記溶液によって溶解しない材料からなるシート状部材が一体化されたものである請求項9〜11のいずれか1に記載のめっき複合体。
- 前記芯材と前記めっき層との間に、耐食性に優れると共に前記溶液に溶解しない耐食性金属層が、前記芯材の表面の少なくとも一部を被覆して介在されている請求項9〜12のいずれか1に記載のめっき複合体。
- 芯材の表面がめっき層で一部を除いて被覆されためっき複合体のうち、前記芯材は溶解するが前記めっき層は溶解しない溶液によって溶解除去された前記芯材の箇所が中空部を構成し、前記めっき層が骨格部を構成している中空構造体。
- 前記中空部に熱媒体が封入されている請求項14記載の中空構造体。
- 前記芯材の厚み方向に相当する前記中空部の対向する内面間の間隔が0.001〜1mmであり、前記骨格部の厚みが0.001〜1mmである請求項14又は15記載の中空構造体。
- 前記中空部の内面の少なくとも一部に、凹凸部を有する請求項14〜16のいずれか1に記載の中空構造体。
- 前記中空部内に、前記溶液によって溶解しない材料からなるシート状部材が挿入配置されている請求項14〜17のいずれか1に記載の中空構造体。
- 前記めっき層からなる前記骨格部の内面の少なくとも一部が、耐食性に優れると共に前記溶液によって溶解しない耐食性金属層により被覆された構造である請求項14〜18のいずれか1に記載の中空構造体。
- 電子機器用の放熱器、ケーブル又は金属チューブとして用いられる請求項14〜19のいずれか1に記載の中空構造体。
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