JPWO2018078667A1 - 高光電変換効率太陽電池及び高光電変換効率太陽電池の製造方法 - Google Patents
高光電変換効率太陽電池及び高光電変換効率太陽電池の製造方法 Download PDFInfo
- Publication number
- JPWO2018078667A1 JPWO2018078667A1 JP2017519704A JP2017519704A JPWO2018078667A1 JP WO2018078667 A1 JPWO2018078667 A1 JP WO2018078667A1 JP 2017519704 A JP2017519704 A JP 2017519704A JP 2017519704 A JP2017519704 A JP 2017519704A JP WO2018078667 A1 JPWO2018078667 A1 JP WO2018078667A1
- Authority
- JP
- Japan
- Prior art keywords
- solar cell
- layer
- forming
- conductivity type
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 title abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000000034 method Methods 0.000 claims abstract description 68
- 238000009792 diffusion process Methods 0.000 claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 49
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 26
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 26
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011521 glass Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 17
- 239000002019 doping agent Substances 0.000 claims description 16
- 238000010248 power generation Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002585 base Substances 0.000 description 106
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 24
- 230000008569 process Effects 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- -1 fluororesin Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/022458—Electrode arrangements specially adapted for back-contact solar cells for emitter wrap-through [EWT] type solar cells, e.g. interdigitated emitter-base back-contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Abstract
Description
前記半導体基板の第一主表面に、前記第一導電型を有し、かつ、前記半導体基板よりも高いドーパント濃度を有するベース層を形成する工程と、
該ベース層上に拡散マスクを形成する工程と、
前記拡散マスクをパターン状に除去し、除去した箇所以外の拡散マスクを残存させる工程と、
前記第一主表面の前記拡散マスクを除去した箇所に、前記第一導電型と反対の導電型である第二導電型を有するエミッタ層を形成する工程と、
前記残存させた拡散マスクを除去する工程と、
前記第一主表面上に誘電体膜を形成する工程と、
前記ベース層上にベース電極を形成する工程と、
前記エミッタ層上にエミッタ電極を形成する工程と
を有することを特徴とする太陽電池の製造方法を提供する。
少なくとも前記ベース電極と前記ベース層の接触界面において、前記半導体基板表面に凹凸が形成されており、
前記第一主表面上に表面が平坦である凹部をパターン状に有し、前記エミッタ層は該凹部内表面に形成されていることを特徴とする太陽電池を提供する。
第一導電型を有する半導体基板の両主表面に凹凸を形成する工程と、
前記半導体基板の第一主表面に、前記第一導電型を有し、かつ、前記半導体基板よりも高いドーパント濃度を有するベース層を形成する工程と、
該ベース層上に拡散マスクを形成する工程と、
前記拡散マスクをパターン状に除去し、除去した箇所以外の拡散マスクを残存させる工程と、
前記第一主表面の前記拡散マスクを除去した箇所に、前記第一導電型と反対の導電型である第二導電型を有するエミッタ層を形成する工程と、
前記残存させた拡散マスクを除去する工程と、
前記第一主表面上に誘電体膜を形成する工程と、
前記ベース層上にベース電極を形成する工程と、
前記エミッタ層上にエミッタ電極を形成する工程と
を有することを特徴とする太陽電池の製造方法が、上記課題を解決できることを見出し、本発明を完成させた。
第一導電型を有する半導体基板を備え、該基板の第一主表面に、前記第一導電型を有し、かつ、前記半導体基板よりも高いドーパント濃度を有するベース層及び前記第一導電型と反対の導電型である第二導電型を有するエミッタ層を備え、前記ベース層上及び前記エミッタ層上に誘電体膜を備え、前記ベース層と電気的に接続されるベース電極を備え、前記エミッタ層と電気的に接続されるエミッタ電極を備える太陽電池であって、
少なくとも前記ベース電極と前記ベース層の接触界面において、前記半導体基板表面に凹凸が形成されており、
前記第一主表面上に表面が平坦である凹部をパターン状に有し、前記エミッタ層は該凹部内表面に形成されていることを特徴とする太陽電池が、上記課題を解決できることを見出し、本発明を完成させた。
以下、本発明の太陽電池について、図面を用いて説明するが、本発明はこれに限定されるものではない。図3は、本発明に係る、裏面電極型太陽電池の概観図である。また、図4は、本発明に係る、裏面電極型太陽電池の断面模式図である。図4に示すように、本発明の太陽電池300は、第一導電型を有する半導体基板110を備える。また、半導体基板110の第一主表面に、第一導電型を有し、かつ、半導体基板110よりも高いドーパント濃度を有するベース層113及び第一導電型と反対の導電型である第二導電型を有するエミッタ層112を備える。また、ベース層113上及びエミッタ層112上に誘電体膜(裏面保護膜)144を備える。また、ベース層113と電気的に接続されるベース電極123を備える。また、エミッタ層112と電気的に接続されるエミッタ電極122を備える。
本発明の方法の工程の概略フローを図9(a)に示す。以下に、具体的な本発明の太陽電池製造方法をN型基板の場合を例に図1を用いて説明する。
本発明の方法を用い太陽電池の作製を行った。
実施例1において、レーザー開口まで実施例1と同様に処理を行い、80℃KOH水溶液に浸漬する工程を実施せず、ホウ素拡散工程以降実施例1と同様の処理を行い太陽電池作製を行った。
実施例1において、レーザー開口、80℃KOH水溶液浸漬工程まで実施例1と同様に処理を行った後、BBr3と酸素とアルゴンの混合ガス雰囲気下、1000℃で受光面同士を重ね合わせた状態で10分間熱処理し、更に、酸素雰囲気下1000℃で酸化処理を行うことで、開口部にホウ素拡散層及び酸化シリコン膜100nmを形成した。25%ふっ酸浸漬による表面ガラス除去工程以降は実施例1と同様に行った。
ホウ素ドープ{100}P型シリコン基板に対し本発明の方法を適用した。基板両面にテクスチャ形成、洗浄後、基板を2枚一組として重ね合わせた状態で熱処理炉に戴置し、BBr3と酸素とアルゴンの混合ガスを導入して1000℃で10分熱処理を行い、引き続いて1000℃3時間酸素雰囲気中で熱酸化してマスク形成した。
実施例4において、両面窒化シリコン膜形成まで実施例4と同様に処理した後、電極形成時エミッタ電極接触領域の窒化シリコン膜開口を実施せず電極形成を行った。
比較用にベース層表面にテクスチャを有しない太陽電池の作製を行った。
Claims (15)
- 第一導電型を有する半導体基板の両主表面に凹凸を形成する工程と、
前記半導体基板の第一主表面に、前記第一導電型を有し、かつ、前記半導体基板よりも高いドーパント濃度を有するベース層を形成する工程と、
該ベース層上に拡散マスクを形成する工程と、
前記拡散マスクをパターン状に除去し、除去した箇所以外の拡散マスクを残存させる工程と、
前記第一主表面の前記拡散マスクを除去した箇所に、前記第一導電型と反対の導電型である第二導電型を有するエミッタ層を形成する工程と、
前記残存させた拡散マスクを除去する工程と、
前記第一主表面上に誘電体膜を形成する工程と、
前記ベース層上にベース電極を形成する工程と、
前記エミッタ層上にエミッタ電極を形成する工程と
を有することを特徴とする太陽電池の製造方法。 - 前記拡散マスクをパターン状に除去する工程の後、かつ、前記エミッタ層を形成する工程の前に、前記拡散マスクを除去した箇所の半導体基板表面をエッチングすることを特徴とする請求項1に記載の太陽電池の製造方法。
- 前記エミッタ層形成後の該エミッタ層上の酸化シリコン膜厚を95nm以下とすることを特徴とする請求項1又は請求項2に記載の太陽電池の製造方法。
- 前記第一導電型をP型とし、前記第二導電型をN型とし、前記ベース層を形成する工程において、前記ベース層を形成する際に同時に前記第一主表面上にガラス層を形成し、前記拡散マスクを形成する工程において、前記ガラス層を残留させたまま前記ベース層上に拡散マスクを形成することを特徴とする請求項1から請求項3のいずれか1項に記載の太陽電池の製造方法。
- 前記第一導電型をP型とし、前記第二導電型をN型とし、前記誘電体膜形成後、該誘電体膜を除去することなく前記ベース電極及び前記エミッタ電極を形成することを特徴とする請求項1から請求項4のいずれか1項に記載の太陽電池の製造方法。
- 前記第一導電型をN型とし、前記第二導電型をP型とし、前記誘電体膜を形成する工程を、前記ベース層及び前記エミッタ層を覆うように酸化アルミニウム膜を形成し、該酸化アルミニウム膜上に窒化シリコン膜を形成する工程とすることを特徴とする請求項1から請求項3のいずれか1項に記載の太陽電池の製造方法。
- 前記ベース層を形成する工程において、前記ベース層を前記第一主表面の全面に形成することを特徴とする請求項1から請求項6のいずれか1項に記載の太陽電池の製造方法。
- 前記凹凸をテクスチャとすることを特徴とする請求項1から請求項7のいずれか1項に記載の太陽電池の製造方法。
- 第一導電型を有する半導体基板を備え、該基板の第一主表面に、前記第一導電型を有し、かつ、前記半導体基板よりも高いドーパント濃度を有するベース層及び前記第一導電型と反対の導電型である第二導電型を有するエミッタ層を備え、前記ベース層上及び前記エミッタ層上に誘電体膜を備え、前記ベース層と電気的に接続されるベース電極を備え、前記エミッタ層と電気的に接続されるエミッタ電極を備える太陽電池であって、
少なくとも前記ベース電極と前記ベース層の接触界面において、前記半導体基板表面に凹凸が形成されており、
前記第一主表面上に表面が平坦である凹部をパターン状に有し、前記エミッタ層は該凹部内表面に形成されていることを特徴とする太陽電池。 - 前記第一導電型はN型であり、前記第二導電型はP型であり、前記誘電体膜は酸化アルミニウム膜と窒化シリコン膜の積層構造であり、前記酸化アルミニウム膜が前記第一主表面と接することを特徴とする請求項9に記載の太陽電池。
- 前記ベース層及び前記エミッタ層が隣接することを特徴とする請求項9又は請求項10に記載の太陽電池。
- 前記半導体基板の第二主表面に凹凸が形成されていることを特徴とする請求項9から請求項11のいずれか1項に記載の太陽電池。
- 前記凹凸がテクスチャであることを特徴とする請求項9から請求項12のいずれか1項に記載の太陽電池。
- 請求項9から請求項13のいずれか1項に記載の太陽電池が内蔵されていることを特徴とする太陽電池モジュール。
- 請求項14に記載の太陽電池モジュールを有することを特徴とする太陽光発電システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/004690 WO2018078667A1 (ja) | 2016-10-25 | 2016-10-25 | 高光電変換効率太陽電池及び高光電変換効率太陽電池の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6220483B1 JP6220483B1 (ja) | 2017-10-25 |
JPWO2018078667A1 true JPWO2018078667A1 (ja) | 2018-10-25 |
Family
ID=60156837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017519704A Active JP6220483B1 (ja) | 2016-10-25 | 2016-10-25 | 高光電変換効率太陽電池及び高光電変換効率太陽電池の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20190157478A1 (ja) |
EP (1) | EP3340316B1 (ja) |
JP (1) | JP6220483B1 (ja) |
KR (1) | KR102581702B1 (ja) |
CN (2) | CN117613134A (ja) |
TW (2) | TWI660521B (ja) |
WO (1) | WO2018078667A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3343639A4 (en) | 2016-11-07 | 2018-09-26 | Shin-Etsu Chemical Co., Ltd | Solar cell with high photoelectric conversion efficiency and method for producing solar cell with high photoelectric conversion efficiency |
CN115188834B (zh) | 2021-09-10 | 2023-09-22 | 上海晶科绿能企业管理有限公司 | 太阳能电池及其制备方法、光伏组件 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5053083A (en) * | 1989-05-08 | 1991-10-01 | The Board Of Trustees Of The Leland Stanford Junior University | Bilevel contact solar cells |
JPH06101570B2 (ja) * | 1992-04-16 | 1994-12-12 | 株式会社日立製作所 | 太陽電池素子 |
US7339110B1 (en) | 2003-04-10 | 2008-03-04 | Sunpower Corporation | Solar cell and method of manufacture |
US8551866B2 (en) * | 2009-05-29 | 2013-10-08 | Solexel, Inc. | Three-dimensional thin-film semiconductor substrate with through-holes and methods of manufacturing |
EP2395554A3 (en) * | 2010-06-14 | 2015-03-11 | Imec | Fabrication method for interdigitated back contact photovoltaic cells |
TW201230371A (en) * | 2011-01-07 | 2012-07-16 | Motech Ind Inc | Method for manufacturing crystalline silicon solar cell |
EP2579320A2 (en) * | 2011-10-06 | 2013-04-10 | Samsung SDI Co., Ltd. | Photovoltaic device |
CN103035779A (zh) * | 2011-10-06 | 2013-04-10 | 三星Sdi株式会社 | 光伏装置 |
JP6108858B2 (ja) * | 2012-02-17 | 2017-04-05 | 株式会社半導体エネルギー研究所 | p型半導体材料および半導体装置 |
JP2014086590A (ja) * | 2012-10-24 | 2014-05-12 | Sharp Corp | 結晶太陽電池の製造方法および結晶太陽電池 |
JP2014112600A (ja) * | 2012-12-05 | 2014-06-19 | Sharp Corp | 裏面電極型太陽電池の製造方法および裏面電極型太陽電池 |
TW201431108A (zh) * | 2013-01-25 | 2014-08-01 | Nat Univ Tsing Hua | 指叉狀背部電極太陽能電池之製造方法及其元件 |
US8574951B1 (en) * | 2013-02-20 | 2013-11-05 | National Tsing Hua University | Process of manufacturing an interdigitated back-contact solar cell |
JP2015106624A (ja) * | 2013-11-29 | 2015-06-08 | 京セラ株式会社 | 太陽電池の製造方法 |
JP6199727B2 (ja) | 2013-12-17 | 2017-09-20 | 信越化学工業株式会社 | 太陽電池の製造方法 |
CN103794679B (zh) * | 2014-01-26 | 2016-07-06 | 晶澳(扬州)太阳能科技有限公司 | 一种背接触太阳能电池的制备方法 |
US9263625B2 (en) * | 2014-06-30 | 2016-02-16 | Sunpower Corporation | Solar cell emitter region fabrication using ion implantation |
JP5963999B1 (ja) * | 2014-11-21 | 2016-08-03 | 三菱電機株式会社 | 太陽電池の製造方法および太陽電池 |
JP6456279B2 (ja) * | 2015-01-29 | 2019-01-23 | 三菱電機株式会社 | 太陽電池の製造方法 |
JP6116616B2 (ja) | 2015-05-28 | 2017-04-19 | シャープ株式会社 | 裏面電極型太陽電池及びその製造方法 |
-
2016
- 2016-10-25 US US15/753,630 patent/US20190157478A1/en active Granted
- 2016-10-25 KR KR1020197009541A patent/KR102581702B1/ko active IP Right Grant
- 2016-10-25 CN CN202311207172.1A patent/CN117613134A/zh active Pending
- 2016-10-25 CN CN201680090315.7A patent/CN109891604A/zh active Pending
- 2016-10-25 JP JP2017519704A patent/JP6220483B1/ja active Active
- 2016-10-25 EP EP16897471.5A patent/EP3340316B1/en active Active
- 2016-10-25 WO PCT/JP2016/004690 patent/WO2018078667A1/ja active Application Filing
-
2017
- 2017-03-09 TW TW106107811A patent/TWI660521B/zh active
- 2017-03-09 TW TW108113579A patent/TWI699901B/zh active
-
2020
- 2020-05-12 US US16/872,589 patent/US20200274009A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2018078667A1 (ja) | 2018-05-03 |
US20200274009A1 (en) | 2020-08-27 |
TW201830719A (zh) | 2018-08-16 |
TWI699901B (zh) | 2020-07-21 |
CN117613134A (zh) | 2024-02-27 |
CN109891604A (zh) | 2019-06-14 |
US20190157478A1 (en) | 2019-05-23 |
JP6220483B1 (ja) | 2017-10-25 |
KR102581702B1 (ko) | 2023-09-22 |
TW201941451A (zh) | 2019-10-16 |
EP3340316A4 (en) | 2019-01-23 |
EP3340316B1 (en) | 2022-11-30 |
EP3340316A1 (en) | 2018-06-27 |
TWI660521B (zh) | 2019-05-21 |
KR20190073362A (ko) | 2019-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2581950A2 (en) | Method of manufacturing a photoelectric device | |
US20230420581A1 (en) | Solar cell with high photoelectric conversion efficiency and method for manufacturing solar cell with high photoelectric conversion efficiency | |
TWI649884B (zh) | 高光電變換效率太陽電池及高光電變換效率太陽電池之製造方法 | |
US20200274009A1 (en) | Method for manufacturing solar cell with high photoelectric conversion efficiency | |
JP6792465B2 (ja) | 高光電変換効率太陽電池の製造方法 | |
JP6564081B2 (ja) | 高光電変換効率太陽電池及び高光電変換効率太陽電池の製造方法 | |
CN110121787B (zh) | 高光电变换效率太阳能电池及高光电变换效率太阳能电池的制造方法 | |
JP6663492B2 (ja) | 太陽電池、太陽電池の製造方法及び太陽電池の製造システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170601 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170601 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20170601 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170704 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170711 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170904 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170919 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170929 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6220483 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |