JPWO2018074279A1 - エッチング液組成物及びエッチング方法 - Google Patents
エッチング液組成物及びエッチング方法 Download PDFInfo
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- JPWO2018074279A1 JPWO2018074279A1 JP2018546262A JP2018546262A JPWO2018074279A1 JP WO2018074279 A1 JPWO2018074279 A1 JP WO2018074279A1 JP 2018546262 A JP2018546262 A JP 2018546262A JP 2018546262 A JP2018546262 A JP 2018546262A JP WO2018074279 A1 JPWO2018074279 A1 JP WO2018074279A1
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- etching
- copper
- mass
- acid
- width
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- 238000005530 etching Methods 0.000 title claims abstract description 91
- 239000000203 mixture Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims description 28
- 239000010949 copper Substances 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 18
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- 239000002253 acid Substances 0.000 claims abstract description 14
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- 125000005842 heteroatom Chemical group 0.000 claims abstract description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- XOAAWQZATWQOTB-UHFFFAOYSA-N taurine Chemical compound NCCS(O)(=O)=O XOAAWQZATWQOTB-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000004471 Glycine Substances 0.000 claims description 3
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- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 description 1
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- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- IWVSKNFJIVKXHH-UHFFFAOYSA-N pyrazine;pyrimidine Chemical compound C1=CN=CN=C1.C1=CN=CC=N1 IWVSKNFJIVKXHH-UHFFFAOYSA-N 0.000 description 1
- FICMSTTYJICTDM-UHFFFAOYSA-N pyridazine;triazine Chemical compound C1=CC=NN=C1.C1=CN=NN=C1 FICMSTTYJICTDM-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
(実施例1〜10)
表1に示す配合となるように各成分を混合してエッチング液組成物(実施例組成物No.1〜10)を得た。なお、成分の合計が100質量%となるように水を配合した。実施例組成物No.1〜7については、pH調整剤として酸性フッ化水素アンモニウムを用いた。
表2に示す配合となるように各成分を混合してエッチング液組成物(比較組成物1〜3)を得た。なお、成分の合計が100質量%となるように水を配合し、pH調整剤として酸性フッ化水素アンモニウムを用いた。
(実施例11〜20)
厚さ200μmのPET基体上にITO層(50nm)、Cu層(200nm)、及びCuNi層(30nm)をこの順に積層した基体に、液状レジストを用いて幅10μm、開口部10μmのレジストパターンを形成した。レジストパターンを形成した基体を縦20mm×横20mmに切断してテストピースを得た。得られたテストピースに対し、実施例組成物No.1〜10を用いて、35℃、1分間、撹拌下でディップ式によるパターンエッチング(エッチング処理)を行った。
比較組成物1〜3を用いたこと以外は、上記の実施例11〜20と同様にして、ディップ式によるパターンエッチングを行った。
厚さ200μmのPET基体上にITO層(50nm)、Cu層(200nm)、及びCuNi層(30nm)をこの順に積層した基体に、ドライフィルムレジストを用いて幅10μm、開口部10μmのレジストパターンを形成した。レジストパターンを形成した基体を縦20mm×横20mmに切断してテストピースを得た。得られたテストピースに対し、実施例組成物No.1〜10を用いて、35℃、1分間、撹拌下でディップ式によるパターンエッチング(エッチング処理)を行った。
レーザー顕微鏡を使用して、細線の状態、及びレジストパターンの幅と細線の幅とのズレを評価した。細線の状態については、細線上部の特定の長さの欠けの有無を確認することで評価した。具体的には、0.5μm以上の長さの欠けが確認できなかったものを「++」と評価し、0.5μm以上1μm未満の長さの欠けが確認できたものを「+」と評価し、1μm以上の長さの欠けが確認できたものを「−」と評価した。
Claims (3)
- 銅系層をエッチングするためのエッチング液組成物であって、
(A)過酸化水素0.1〜35質量%;
(B)ヒドロキシアルカンスルホン酸0.1〜20質量%;
(C)アゾール系化合物、及び1以上の窒素原子を含み且つ3つの2重結合を有する複素6員環を構造中に有する化合物から選ばれる少なくとも1種の化合物0.01〜1質量%;及び
水を含有し、
25℃におけるpHが0.1〜4の範囲内であるエッチング液組成物。 - 請求項1又は2に記載のエッチング液組成物を用いて銅系層をエッチングする工程を有するエッチング方法。
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