JPWO2018055669A1 - 部品実装機 - Google Patents
部品実装機 Download PDFInfo
- Publication number
- JPWO2018055669A1 JPWO2018055669A1 JP2018540513A JP2018540513A JPWO2018055669A1 JP WO2018055669 A1 JPWO2018055669 A1 JP WO2018055669A1 JP 2018540513 A JP2018540513 A JP 2018540513A JP 2018540513 A JP2018540513 A JP 2018540513A JP WO2018055669 A1 JPWO2018055669 A1 JP WO2018055669A1
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- JP
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- height
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011248 coating agent Substances 0.000 claims abstract description 68
- 238000000576 coating method Methods 0.000 claims abstract description 68
- 238000012546 transfer Methods 0.000 claims abstract description 36
- 238000005259 measurement Methods 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 26
- 238000013461 design Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000007781 pre-processing Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
下面に接続端子を備えた部品を保持可能な部品保持部を備えたヘッドと、
前記ヘッドを移動させるヘッド移動装置と、
底面と該底面とは異なる所定の測定箇所とが所定の高さ関係を有する容器を有し、前記部品の接続端子に転写させるペーストを前記容器の底面に所定厚さの塗膜として提供する転写装置と、
前記ヘッドに設けられ、前記容器の測定箇所の高度を測定可能な高度センサと、
前記転写装置によって提供された前記塗膜が前記部品保持部に保持された前記部品の接続端子に転写されるよう前記ヘッド及び前記ヘッド移動装置を制御する制御装置と、
を備え、
前記制御装置は、前記高度センサによって測定された前記容器の測定箇所の高度から前記容器の底面の高度又は前記塗膜の表面の高度を認識する、
ものである。
Claims (6)
- 下面に接続端子を備えた部品を保持可能な部品保持部を備えたヘッドと、
前記ヘッドを移動させるヘッド移動装置と、
底面と該底面とは異なる所定の測定箇所とが所定の高さ関係を有する容器を有し、前記部品の接続端子に転写させるペーストを前記容器の底面に所定厚さの塗膜として提供する転写装置と、
前記ヘッドに設けられ、前記容器の測定箇所の高度を測定可能な高度センサと、
前記転写装置によって提供された前記塗膜が前記部品保持部に保持された前記部品の接続端子に転写されるよう前記ヘッド及び前記ヘッド移動装置を制御する制御装置と、
を備え、
前記制御装置は、前記高度センサによって測定された前記容器の測定箇所の高度から前記容器の底面の高度又は前記塗膜の表面の高度を認識する、
部品実装機。 - 前記制御装置は、前記容器の測定箇所の高度から前記容器の底面の高度を認識し、前記容器の底面の高度に基づいて前記容器が適正に配置されているか否かを判定し、前記容器が適正でなかったならばオペレータに警告を報知する、
請求項1に記載の部品実装機。 - 前記制御装置は、前記容器の測定箇所の高度から前記塗膜の表面の高度を認識し、前記塗膜の表面の高度に基づいて前記部品保持部に保持された前記部品の接続端子を前記塗膜にディップする高度を設定する、
請求項1又は2に記載の部品実装機。 - 前記容器の測定箇所は、多角形の頂点となるように3箇所以上に設定されている、
請求項1〜3のいずれか1項に記載の部品実装機。 - 前記容器の測定箇所は、前記容器の底面を囲う側壁の上面に設定されている、
請求項1〜4のいずれか1項に記載の部品実装機。 - 前記高度センサは、光学センサである、
請求項1〜5のいずれか1項に記載の部品実装機。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/077671 WO2018055669A1 (ja) | 2016-09-20 | 2016-09-20 | 部品実装機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018055669A1 true JPWO2018055669A1 (ja) | 2019-07-04 |
JP6804544B2 JP6804544B2 (ja) | 2020-12-23 |
Family
ID=61690225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018540513A Active JP6804544B2 (ja) | 2016-09-20 | 2016-09-20 | 部品実装機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11503752B2 (ja) |
EP (1) | EP3518632B1 (ja) |
JP (1) | JP6804544B2 (ja) |
CN (1) | CN109691243B (ja) |
WO (1) | WO2018055669A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021053718A (ja) * | 2019-09-27 | 2021-04-08 | ファナック株式会社 | ワークを検出する検出システム |
WO2021130975A1 (ja) * | 2019-12-26 | 2021-07-01 | 株式会社Fuji | 部品実装機及び転写材転写方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000340933A (ja) * | 1999-05-27 | 2000-12-08 | Hitachi Via Mechanics Ltd | 導電性ボール搭載装置におけるフラックス供給装置 |
JP2002185117A (ja) * | 2000-12-11 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 粘性流体転写装置及び転写方法、電子部品実装装置及び実装方法、並びに半導体装置 |
JP2005329274A (ja) * | 2004-05-18 | 2005-12-02 | Matsushita Electric Ind Co Ltd | 膜形成装置 |
JP2014078581A (ja) * | 2012-10-10 | 2014-05-01 | Panasonic Corp | 電子部品実装装置および転写膜厚検出方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3295529B2 (ja) * | 1994-05-06 | 2002-06-24 | 松下電器産業株式会社 | Ic部品実装方法及び装置 |
JP3714097B2 (ja) * | 2000-03-21 | 2005-11-09 | 松下電器産業株式会社 | バンプ付電子部品の実装方法 |
JP5861040B2 (ja) * | 2012-12-27 | 2016-02-16 | パナソニックIpマネジメント株式会社 | ペースト転写ユニットおよび電子部品実装装置ならびに転写膜厚測定方法 |
WO2015015578A1 (ja) * | 2013-07-31 | 2015-02-05 | 富士機械製造株式会社 | 電子部品装着装置及び装着方法 |
WO2017007229A1 (ko) * | 2015-07-06 | 2017-01-12 | 엘지이노텍(주) | 자동 물공급장치 |
US20180317699A1 (en) * | 2015-10-15 | 2018-11-08 | Nestec S.A. | Beverage preparation machine |
JP6778261B2 (ja) * | 2016-05-31 | 2020-10-28 | 株式会社Fuji | 部品供給装置 |
-
2016
- 2016-09-20 CN CN201680089199.7A patent/CN109691243B/zh active Active
- 2016-09-20 US US16/333,464 patent/US11503752B2/en active Active
- 2016-09-20 EP EP16916740.0A patent/EP3518632B1/en active Active
- 2016-09-20 WO PCT/JP2016/077671 patent/WO2018055669A1/ja unknown
- 2016-09-20 JP JP2018540513A patent/JP6804544B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000340933A (ja) * | 1999-05-27 | 2000-12-08 | Hitachi Via Mechanics Ltd | 導電性ボール搭載装置におけるフラックス供給装置 |
JP2002185117A (ja) * | 2000-12-11 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 粘性流体転写装置及び転写方法、電子部品実装装置及び実装方法、並びに半導体装置 |
JP2005329274A (ja) * | 2004-05-18 | 2005-12-02 | Matsushita Electric Ind Co Ltd | 膜形成装置 |
JP2014078581A (ja) * | 2012-10-10 | 2014-05-01 | Panasonic Corp | 電子部品実装装置および転写膜厚検出方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3518632B1 (en) | 2021-09-15 |
US11503752B2 (en) | 2022-11-15 |
US20190261541A1 (en) | 2019-08-22 |
EP3518632A1 (en) | 2019-07-31 |
JP6804544B2 (ja) | 2020-12-23 |
EP3518632A4 (en) | 2019-09-25 |
CN109691243B (zh) | 2022-04-26 |
WO2018055669A1 (ja) | 2018-03-29 |
CN109691243A (zh) | 2019-04-26 |
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