JPWO2017069059A1 - コンデンサおよびその製造方法ならびにそれを用いた無線通信装置 - Google Patents
コンデンサおよびその製造方法ならびにそれを用いた無線通信装置 Download PDFInfo
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- JPWO2017069059A1 JPWO2017069059A1 JP2016563872A JP2016563872A JPWO2017069059A1 JP WO2017069059 A1 JPWO2017069059 A1 JP WO2017069059A1 JP 2016563872 A JP2016563872 A JP 2016563872A JP 2016563872 A JP2016563872 A JP 2016563872A JP WO2017069059 A1 JPWO2017069059 A1 JP WO2017069059A1
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- 238000000034 method Methods 0.000 claims description 51
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- 229910052751 metal Inorganic materials 0.000 claims description 46
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- 125000003118 aryl group Chemical group 0.000 claims description 18
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- PCADGSDEFOMDNL-UHFFFAOYSA-N tri(propan-2-yloxy)-(3,3,3-trifluoropropyl)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCC(F)(F)F PCADGSDEFOMDNL-UHFFFAOYSA-N 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- PMQIWLWDLURJOE-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F PMQIWLWDLURJOE-UHFFFAOYSA-N 0.000 description 1
- BPCXHCSZMTWUBW-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,8,8,8-tridecafluorooctyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F BPCXHCSZMTWUBW-UHFFFAOYSA-N 0.000 description 1
- NOBMQPILAFKJLD-UHFFFAOYSA-N triethoxy(2,2,2-trifluoroethyl)silane Chemical compound CCO[Si](CC(F)(F)F)(OCC)OCC NOBMQPILAFKJLD-UHFFFAOYSA-N 0.000 description 1
- ZLGWXNBXAXOQBG-UHFFFAOYSA-N triethoxy(3,3,3-trifluoropropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)F ZLGWXNBXAXOQBG-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- OJVURXAEXOZVPC-UHFFFAOYSA-K tris(2-pyridin-2-ylphenoxy)alumane Chemical compound N1=C(C=CC=C1)C1=C(C=CC=C1)[O-].N1=C(C=CC=C1)C1=C(C=CC=C1)[O-].N1=C(C=CC=C1)C1=C(C=CC=C1)[O-].[Al+3] OJVURXAEXOZVPC-UHFFFAOYSA-K 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 125000003774 valeryl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- NFTMJVYAFMEYLC-UHFFFAOYSA-L zinc;3-oxohexanoate Chemical compound [Zn+2].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O NFTMJVYAFMEYLC-UHFFFAOYSA-L 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
Classifications
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Abstract
Description
(1)絶縁基板上に、導電体と感光性有機化合物を含有する導電ペーストを用いて感光性導電膜を形成する工程。
(2)前記感光性導電膜を、フォトリソグラフィによりコンデンサの導電膜に対応するパターンに加工する工程。
(3)有機化合物と金属化合物を含有する組成物を塗布および乾燥して、誘電体層を形成する工程。
本発明のコンデンサは、少なくとも誘電体層と導電膜を含む。図1に示すコンデンサは本発明のコンデンサの実施形態の一つであり、一対の導電膜である第1の導電膜1と第2の導電膜2、誘電体層3を有する。第1の導電膜1と第2の導電膜2は電気的に接続しておらず、導電膜1と第2の導電膜2の間に誘電体層3が形成されている。
誘電体層は、有機化合物と金属化合物を含む。
有機化合物としては、一般式(3)で表されるシラン化合物、一般式(4)で表されるエポキシ基含有シラン化合物、これらの縮合物またはこれらを共重合成分とするポリシロキサン等が挙げられる。これらの中でもポリシロキサンは誘電率が高く、低温硬化が可能であるためより好ましい。ポリシロキサンの中でも、一般式(3)で表されるシラン化合物および一般式(4)で表されるエポキシ基含有シラン化合物を共重合成分とするポリシロキサンが特に好ましい。
R3は水素原子、アルキル基、複素環基、アリール基またはアルケニル基を示し、R3が複数存在する場合、それぞれのR3は同じでも異なっていてもよい。R4は水素原子、アルキル基、アシル基またはアリール基を示し、R4が複数存在する場合、それぞれのR4は同じでも異なっていてもよい。mは1〜3の整数を示す。
R5は1つ以上のエポキシ基を鎖の一部に有するアルキル基を示し、R5が複数存在する場合、それぞれのR5は同じでも異なっていてもよい。R6は水素原子、アルキル基、複素環基、アリール基またはアルケニル基を示し、R6が複数存在する場合、それぞれのR6は同じでも異なっていてもよい。R7は水素原子、アルキル基、アシル基またはアリール基を示し、R7が複数存在する場合、それぞれのR7は同じでも異なっていてもよい。lは0〜2の整数、nは1または2を示す。ただし、l+n≦3である。
金属化合物は、特に制限はなく、例えば金属酸化物、金属水酸化物、金属キレート化合物等が例示される。金属化合物に含まれる金属原子は、マグネシウム、アルミニウム、チタン、クロム、マンガン、コバルト、ニッケル、銅、亜鉛、ガリウム、ジルコニウム、ルテニウム、パラジウム、インジウム、ハフニウム、白金などが挙げられ、金属キレートを形成するものが好ましい。中でも、入手容易性、コスト、金属キレートの安定性の点からアルミニウムが好ましい。これらのような化合物を含むことにより、高誘電率な誘電体層が形成され、ESRの低いコンデンサができる。ESRは10Ω以下が好ましく、5Ω以下がより好ましい。
上記のような誘電体層の作製方法は特に制限はないが、有機化合物と金属化合物を含む組成物を塗布および乾燥することで得られたコーティング膜を必要に応じ熱処理することによって、誘電体層を形成できる。
重量平均分子量が1000以上のポリマーとしては、ヒドロキシル基、シラノール基、カルボキシル基、アミノ基およびメルカプト基からなる群より選ばれる少なくとも一つの基を繰り返し単位中に有することが好ましい。これらの官能基は組成物の熱硬化時に金属キレートと反応するため、リーク電流が抑制され溶媒耐性にも優れた強固な膜形成を可能とする。これらの中でもポリシロキサンは絶縁性が高く、低温硬化が可能であるためより好ましい。ポリシロキサンの中でも、一般式(3)で表されるシラン化合物および一般式(4)で表されるエポキシ基含有シラン化合物を共重合成分とするポリシロキサンが特に好ましい。
溶媒としては、特に限定されないが、具体的にはエチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノn−ブチルエーテル、プロピレングリコールモノt−ブチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジブチルエーテル、ジエチレングリコールエチルメチルエーテル等のエーテル類、エチレングリコールモノエチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、プロピルアセテート、ブチルアセテート、イソブチルアセテート、3−メトキシブチルアセテート、3−メチル−3−メトキシブチルアセテート、乳酸メチル、乳酸エチル、乳酸ブチル等のアセテート類、アセチルアセトン、メチルプロピルケトン、メチルブチルケトン、メチルイソブチルケトン、シクロペンタノン、2−ヘプタノン等のケトン類、ブチルアルコール、イソブチルアルコール、ペンタノール、4−メチル−2−ペンタノール、3−メチル−2−ブタノール、3−メチル−3−メトキシブタノール、ジアセトンアルコール等のアルコール類、トルエン、キシレン等の芳香族炭化水素類が挙げられる。これら溶媒は単独あるいは2種以上用いてもかまわない。
本発明に用いられる組成物は、さらに一般式(1)で表される金属キレートを含むのが好ましい。
R1は1価の2座配位子を示し、R1が複数存在する場合、それぞれのR1は同じでも異なっていてもよい。R2は水素、アルキル基、アシル基またはアリール基を示し、R2が複数存在する場合、それぞれのR2は同じでも異なっていてもよい。Mはy価の金属原子を示す。yは1〜6である。xは1〜yの整数を示す。
R1は一般式(1)におけるものと同じであり、それぞれのR1は同じでも異なっていてもよい。一般式(1)および(2)において、R1は、中でも、低コストで入手でき、安定なキレート形成を可能とするβジケトン誘導体またはβケトエステル誘導体が好ましい。
クロムキレートとしては、クロムトリス(2,4−ペンタンジオナート)、クロムトリス(エチルアセトアセテート)などが挙げられる。
マンガンキレートとしては、マンガン(II)ビス(2,4−ペンタンジオナート)、マンガン(II)ビス(エチルアセトアセテート)、マンガン(III)トリス(2,4−ペンタンジオナート)、マンガン(III)トリス(エチルアセトアセテート)などが挙げられる。
コバルトキレートとしては、コバルトトリス(2,4−ペンタンジオナート)、コバルトトリス(エチルアセトアセテート)などが挙げられる。
ニッケルキレートとしては、ニッケルビス(2,4−ペンタンジオナート)、ニッケルビス(エチルアセトアセテート)などが挙げられる。
銅キレートとしては、銅ビス(2,4−ペンタンジオナート)、銅ビス(エチルアセトアセテート)などが挙げられる。
亜鉛キレートとしては、亜鉛ビス(2,4−ペンタンジオナート)、亜鉛ビス(エチルアセトアセテート)、などが挙げられる。
ガリウムキレートとしては、ガリウムトリス(2,4−ペンタンジオナート)、ガリウムトリス(エチルアセトアセテート)などが挙げられる。
ルテニウムキレートとしては、ルテニウムトリス(2,4−ペンタンジオナート)、ルテニウムトリス(エチルアセトアセテート)などが挙げられる。
パラジウムキレートとしては、パラジウムビス(2,4−ペンタンジオナート)、パラジウムビス(エチルアセトアセテート)などが挙げられる。
ハフニウムキレートとしては、ハフニウムテトラキス(2,4−ペンタンジオナート)、ハフニウムテトラキス(エチルアセトアセテート)などが挙げられる。
白金キレートとしては、白金ビス(2,4−ペンタンジオナート)、白金ビス(エチルアセトアセテート)などが挙げられる。
誘電体層は単層でも複数層でもよい。また、1つの層を複数の誘電体組成物から形成してもよいし、複数の誘電体組成物を積層して複数の誘電体層を形成しても構わない。
本発明のコンデンサにおいて、一対の導電膜のうち少なくとも一方は、導電体および有機化合物を含む。導電体を含むことで、導電膜がコンデンサの電極として機能する。有機化合物を含むことで、導電膜の柔軟性が増し、屈曲時にも誘電体層との密着性が良い。そのことで、電気的接続が良好になり、ESRの低いコンデンサができる。その効果をより高める観点から、一対の導電膜のいずれもが導電体と有機化合物を含有することが好ましい。
白金、金、銀、銅、鉄、錫、亜鉛、アルミニウム、インジウム、クロム、リチウム、ナトリウム、カリウム、セシウム、カルシウム、マグネシウム、パラジウム、モリブデン、タングステン、アモルファスシリコンやポリシリコンなどの金属やこれらの合金;
ヨウ化銅、硫化銅などの無機導電性化合物;
ポリチオフェン、ポリピロール、ポリアニリン、ポリエチレンジオキシチオフェンとポリスチレンスルホン酸の錯体などの導電性ポリマー;
および、カーボンなどが挙げられるが、これらに限定されるものではない。
増感剤の具体例としては、2,3−ビス(4−ジエチルアミノベンザル)シクロペンタノン、2,6−ビス(4−ジメチルアミノベンザル)シクロヘキサノン、2,6−ビス(4−ジメチルアミノベンザル)−4−メチルシクロヘキサノン、4,4−ビス(ジメチルアミノ)カルコン、4,4−ビス(ジエチルアミノ)カルコン、p−ジメチルアミノシンナミリデンインダノン、p−ジメチルアミノベンジリデンインダノン、2−(p−ジメチルアミノフェニルビニレン)イソナフトチアゾール、1,3−ビス(4−ジメチルアミノフェニルビニレン)イソナフトチアゾール、1,3−ビス(4−ジメチルアミノベンザル)アセトン、1,3−カルボニルビス(4−ジエチルアミノベンザル)アセトン、3,3−カルボニルビス(7−ジエチルアミノクマリン)、トリエタノールアミン、メチルジエタノールアミン、トリイソプロパノールアミン、N−フェニル−N−エチルエタノールアミン、N−フェニルエタノールアミン、N−トリルジエタノールアミン、4−ジメチルアミノ安息香酸メチル、4−ジメチルアミノ安息香酸エチル、ジメチルアミノ安息香酸イソアミル、ジエチルアミノ安息香酸イソアミル、安息香酸(2−ジメチルアミノ)エチル、4−ジメチルアミノ安息香酸(n−ブトキシ)エチル、4−ジメチルアミノ安息香酸2−エチルヘキシル、3−フェニル−5−ベンゾイルチオテトラゾール、1−フェニル−5−エトキシカルボニルチオテトラゾール等が挙げられる。また、これらを2種以上組み合わせて使用しても良い。
上記のような導電膜の作製方法は特に制限はないが、例えば以下の方法が挙げられる。まず、前記導電体、感光性有機化合物を含むペーストをスピンコート法、ブレードコート法、スリットダイコート法、スクリーン印刷法、バーコーター法、鋳型法、印刷転写法、浸漬引き上げ法、インクジェット法などの公知の技術で絶縁基板上に塗布し、オーブン、ホットプレート、赤外線などを用いて乾燥を行い、感光性導電膜を形成する。
現像後、水によるリンス処理を施してもよい。ここでもエタノール、イソプロピルアルコールなどのアルコール類、乳酸エチル、プロピレングリコールモノメチルエーテルアセテートなどのエステル類などを水に加えてリンス処理をしてもよい。
コンデンサの作製方法は特に制限はないが、以下の工程を含む。
(1)絶縁基板上に、導電体と感光性有機化合物を含有する導電ペーストを用いて感光性導電膜を形成する工程;
(2)前記感光性導電膜を、フォトリソグラフィによりコンデンサの導電膜に対応するパターンに加工する工程;
(3)ケイ素原子と炭素原子の結合を含む有機化合物を含有する組成物を塗布および乾燥して、誘電体層を形成する工程。
本発明のコンデンサは、リーク電流が抑制されているため、高電圧まで駆動させることが可能である。すなわち、本発明のコンデンサは、動作耐圧が高いという特性を示す。
次に、本発明のコンデンサを有する回路について説明する。この回路は、同一基板上に、少なくとも上述のコンデンサおよびトランジスタから構成され、さらに必要に応じてダイオード、抵抗素子、メモリ素子を含んでいても良い。これらのトランジスタ、ダイオード、抵抗素子、メモリ素子等は、一般的に使用されるものであればよく、用いられる材料、形状は特に限定されない。中でもトランジスタは、絶縁基板上にゲート絶縁層、ゲート電極、半導体層、ソース電極およびドレイン電極を有する電界効果型トランジスタであることが好ましい。さらに、コンデンサの誘電体層とトランジスタのゲート絶縁層が同一材料から構成されることが好ましい。材料種類が少なくなり、コンデンサの誘電体層およびトランジスタのゲート絶縁層を同一工程で作製することで、製造工程数を削減しコスト低減が可能となるからである。
<無線通信装置>
次に、本発明のコンデンサを含有する無線通信装置について説明する。この無線通信装置は、例えばRFIDのような、リーダ/ライタに搭載されたアンテナから送信される搬送波をRFIDタグが受信することで電気通信を行う装置である。
ポリマーの重量平均分子量はサンプルを孔径0.45μmメンブレンフィルターで濾過後、GPC(GELPERMEATION CHROMATOGRAPHY:ゲル浸透クロマトグラフィー、東ソー(株)製HLC−8220GPC)(展開溶剤:テトラヒドロフラン、展開速度:0.4ml/分)を用いてポリスチレン換算により求めた。
測定対象の膜に超高真空中において軟X線を照射し、表面から放出される光電子を検出するX線光電子分光(PHI社製 QuanteraSXM)により膜中の元素情報、元素量を分析した。分析した各元素量比から各元素の重量を算出し、ケイ素原子と炭素原子の合計を100重量部とした際に含まれる金属原子重量を求めた。
図5を参照して説明する。コンデンサを形成した基板101について、コンデンサを形成した面上の中央部に直径30mmの金属円柱100を固定し、この円柱に沿って、円柱の抱き角0°(サンプルが平面の状態)の状態に置き(図5A参照)、円柱への抱き角が180°(円柱で折り返した状態)となる範囲(図5B参照)で、折り曲げ動作を行った。耐屈曲性は、曲げ動作前後のコンデンサパターンを光学顕微鏡で観察し、剥がれ、欠けの有無を確認し、以下の基準で評価を行った。
A(非常に良好):折り曲げ動作を500回繰り返しても剥がれ、欠けが見られない。
B(良好):折り曲げ動作を300回繰り返しても剥がれ、欠けが見られない。
C(可):折り曲げ動作を100回繰り返しても剥がれ、欠けが見られない。
D(不可):折り曲げ動作の繰り返しが100回未満で、剥がれ、欠けが見られた。
共重合比率(重量基準):エチルアクリレート(以下、「EA」)/メタクリル酸2−エチルヘキシル(以下、「2−EHMA」)/スチレン(以下、「St」)/グリシジルメタクリレート(以下、「GMA」)/アクリル酸(以下、「AA」)=20/40/20/5/15。
共重合比率(重量基準):2官能エポキシアクリレートモノマー(エポキシエステル3002A;共栄社化学(株)製)/2官能エポキシアクリレートモノマー(エポキシエステル70PA;共栄社化学(株)製)/GMA/St/AA=20/40/5/20/15。
窒素雰囲気の反応容器中に、100gのジエチレングリコールモノエチルエーテルアセテート(以下、「DMEA」)を仕込み、オイルバスを用いて80℃まで昇温した。これに、感光性成分P2を10g、3.5gのn−ヘキシルイソシアネート及び10gのDMEAからなる混合物を、1時間かけて滴下した。滴下終了後、さらに3時間反応を行った。得られた反応溶液をメタノールで精製することで未反応不純物を除去し、さらに24時間真空乾燥することで、ウレタン結合を有する化合物P3を得た。
100mlクリーンボトルに化合物P1を16g、化合物P3を4g、光重合開始剤OXE−01(BASFジャパン株式会社製)4g、酸発生剤SI−110(三新化学工業株式会社製)を0.6g、γ−ブチロラクトン(三菱ガス化学株式会社製)を10g充填し、自転−公転真空ミキサー“あわとり練太郎”(登録商標)(ARE−310;(株)シンキー製)で混合し、感光性樹脂溶液46.6g(固形分78.5重量%)を得た。得られた感光性樹脂溶液8.0gと平均粒子径2μmのAg粒子を42.0g混ぜ合わせ、3本ローラー“EXAKT M−50”(商品名、EXAKT社製)を用いて混練し、50gの感光性導電ペーストAを得た。
平均粒子径0.2μmのAg粒子を用いたこと以外は、調整例1と同様の方法で、感光性導電ペーストBを得た。
メチルトリメトキシシラン61.29g(0.45モル)、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン12.31g(0.05モル)、およびフェニルトリメトキシシラン99.15g(0.5モル)をプロピレングリコールモノブチルエーテル(沸点170℃)203.36gに溶解し、これに、水54.90g、リン酸0.864gを撹拌しながら加えた。得られた溶液をバス温105℃で2時間加熱し、内温を90℃まで上げて、主として副生するメタノールからなる成分を留出せしめた。次いでバス温130℃で2.0時間加熱し、内温を118℃まで上げて、主として水とプロピレングリコールモノブチルエーテルからなる成分を留出せしめた後、室温まで冷却し、固形分濃度26.0重量%のポリシロキサン溶液Aを得た。得られたポリシロキサンの重量平均分子量は6000であった。
ポリシロキサン溶液Aを2.5g、アルミキレートDの代わりにインジウムトリス(2,4−ペンタンジオナート)(和光純薬工業(株)製)を13g、PGMEAを49.8gとしたこと以外は、誘電体材料溶液Aと同様にして、誘電体材料溶液Bを得た。本溶液中の上記ポリマーの含有量はインジウムトリス(2,4−ペンタンジオナート) 100重量部に対して5重量部であった。
アルミキレートDを13g、PGMEAを42gとしたこと以外は、誘電体材料溶液Aと同様にして、誘電体材料溶液Cを得た。本溶液中の上記ポリマーの含有量はアルミキレートD 100重量部に対して20重量部であった。
ポリシロキサン溶液Aを2.5g、アルミキレートDを13g、PGMEAを49.5gとしたこと以外は、誘電体材料溶液Aと同様にして、誘電体材料溶液Dを得た。本溶液中の上記ポリマーの含有量はアルミキレートD 100重量部に対して5重量部であった。
アルミキレートDの代わりにチタニウムテトラ(2,4−ペンタンジオナート)(商品名「オルガチックスTC−401」、マツモトファインケミカル(株)製)を5.2g、PEGMEAを49.8gとしたこと以外は、誘電体材料溶液Aと同様にして、誘電体材料溶液Eを得た。本溶液中の上記ポリマーの含有量はジルコニウムテトラ(2,4−ペンタンジオナート) 100重量部に対して50重量部であった。
チタニウムテトラ(2,4−ペンタンジオナート)の代わりにインジウムトリス(2,4−ペンタンジオナート)(和光純薬工業(株)製)を5.2g用いたこと以外は、誘電体材料溶液Eと同様にして、誘電体材料溶液Fを得た。本溶液中の上記ポリマーの含有量はインジウムトリス(2,4−ペンタンジオナート) 100重量部に対して50重量部であった。
チタニウムテトラ(2,4−ペンタンジオナート)の代わりにアルミキレートDを5.2g用いたこと以外は、誘電体材料溶液Eと同様にして、誘電体材料溶液Gを得た。本溶液中の上記ポリマーの含有量はアルミキレートD 100重量部に対して50重量部であった。
アルミキレートDを13g、PGMEAを49.5gとしたこと以外は、誘電体材料溶液Aと同様にして、誘電体材料溶液Hを得た。本溶液中の上記ポリマーの含有量はアルミキレートD 100重量部に対して87重量部であった。
メチルトリメトキシシラン66.7g(0.49モル)、γ−グリシドキシプロピルトリメトキシシラン2.36g(0.01モル)、フェニルトリメトキシシラン99.2g(0.5モル)をプロピレングリコールモノメチルエーテル(沸点121℃)471.1gに溶解し、これに、水54.2g、リン酸0.85gを攪拌しながら加えた。得られた溶液をバス温105℃で2時間加熱し、内温を90℃まで上げて、主として副生するメタノールからなる成分を留出せしめた。次いでバス温115℃で4時間加熱し、内温を118℃まで上げて、主として水とプロピレングリコールモノメチルエーテルからなる成分を留出せしめた後、室温まで冷却し、固形分濃度40.0重量%のポリシロキサン溶液Bを得た。得られたポリシロキサンの重量平均分子量は9000であった。
ポリマーとして下記SPCR−69X(商品名、昭和電工(株)製、重量平均分子量15000)2.6g、アルミキレートD13g、PGMEA49.4gを混合して、室温にて2時間撹拌し、誘電体材料溶液Jを得た。
ポリシロキサン溶液Aの代わりにエチルシリケート48(商品名、コルコート(株)製、重量平均分子量1500)を用いたこと以外は、誘電体材料溶液Cと同様にして誘電体材料溶液Kを作製した。
図1に示すコンデンサを作製した。膜厚50μmのPETフィルム上に、導電ペーストAをスクリーン印刷で塗布し、乾燥オーブンで100℃、10分間プリベークを行った。その後、露光装置“PEM−8M”(商品名、ユニオン光学(株)製)を用いて露光した後、0.5%Na-2CO-3溶液で30秒間浸漬現像し、超純水でリンス後、乾燥オーブンで140℃、30分間キュアを行い、導電膜1を形成した。導電膜1の面積は、0.01mm2とした。次に上記誘電体材料溶液Aを導電膜1が形成されたPETフィルム上にスピンコート塗布(2000rpm×20秒)し、120℃で5分間熱処理後、再度誘電体材料溶液Aをスピンコート塗布(2000rpm×20秒)し、窒素気流下200℃で30分間熱処理することによって、膜厚0.2μmの誘電体層を形成した。次に、その上にフォトレジスト(商品名「LC100−10cP」、ローム・アンド・ハース(株)製)をスピンコート塗布(1000rpm×20秒)し、100℃で10分加熱乾燥した。作製したフォトレジスト膜を露光装置“PEM−8M”を用いて、マスクを介してパターン露光した後、2.38重量%水酸化テトラメチルアンモニウム水溶液であるELM−D(商品名、三菱ガス化学(株)製)で70秒間シャワー現像し、超純水でリンスした。その後、SEA−1(商品名、関東化学(株)製)で1分間エッチング処理した後、水で30秒間洗浄した。AZリムーバ100(商品名、AZエレクトロニックマテリアルズ(株)製)に5分間浸漬してレジストを剥離し、誘電体層3を形成した。次に、導電ペーストAをスクリーン印刷で塗布し、乾燥オーブンで100℃、10分間プリベークを行った。その後、露光装置“PEM−8M”を用いて露光した後、0.5%Na-2CO-3溶液で30秒間浸漬現像し、超純水でリンス後、乾燥オーブンで140℃、30分間キュアを行い、導電膜2を形成した。
表2に示す条件で実施例1と同様にしてコンデンサを作製した。得られたコンデンサについて、ESR、静電容量、リーク電流及び誘電体層と導電膜の密着性評価を行った。
導電膜1が形成されたPETフィルム上に、誘電体材料溶液Dをスピンコート塗布(500rpm×20秒)し、120℃で5分間熱処理後、再度誘電体材料溶液Dをスピンコート塗布(500rpm×20秒)し、窒素気流下200℃で30分間熱処理することによって、膜厚4.1μmの誘電体層を形成したこと以外は、実施例1と同様の方法でコンデンサを作製した。得られたコンデンサについて、ESR、静電容量、リーク電流及び誘電体層と導電膜の密着性評価を行った。
膜厚50μmのPETフィルム上に、抵抗加熱法により、マスクを通してクロムを5nmおよび銀を150nm真空蒸着し、導電膜1を形成した。その後、実施例4と同様にして誘電体層3、導電膜2を形成し、コンデンサを作製した。得られたコンデンサについて、ESR、静電容量、リーク電流及び誘電体層と導電膜の密着性評価を行った。
膜厚50μmのPETフィルム上に、抵抗加熱法により、マスクを通してクロムを5nmおよび銀を150nm真空蒸着し、導電膜1を形成した。その後、実施例3と同様にして誘電体層3を形成した。その後、再度抵抗加熱法により、マスクを通して銀を150nm真空蒸着して導電膜2を形成し、コンデンサを作製した。得られたコンデンサについて、ESR、静電容量、リーク電流及び誘電体層と導電膜の密着性評価を行った。
表2に示す条件で実施例1と同様にしてコンデンサを作製した。得られたコンデンサについて、ESR、静電容量、リーク電流及び誘電体層と導電膜の密着性評価を行った。
各実施例および比較例で用いた誘電体材料溶液の組成およびコンデンサの構成を表2に、評価結果を表3に、それぞれ示す。
2 導電膜
3 誘電体層
10 基板
100 金属円柱
101 アンテナ基板
Claims (16)
- 少なくとも一対の導電膜と、前記一対の導電膜間に設けられた誘電体層を備えるコンデンサであって、前記誘電体層が有機化合物と金属化合物を含有し、前記一対の導電膜のうち少なくとも一方の導電膜が金属と有機化合物を含有することを特徴とするコンデンサ。
- 前記誘電体層中の有機化合物がケイ素原子と炭素原子の結合を有する請求項1記載のコンデンサ。
- 前記誘電体層中の金属化合物が金属原子と酸素原子の結合を有する金属化合物を含む請求項1または2記載のコンデンサ。
- 前記誘電体層が、炭素原子とケイ素原子の合計100重量部に対して金属原子を10〜180重量部含む請求項3記載のコンデンサ。
- 前記金属原子がアルミニウムである請求項3または4記載のコンデンサ。
- 前記誘電体層の膜厚が0.1μm〜5μmである請求項1〜5のいずれかに記載のコンデンサ。
- 前記導電膜中の有機化合物がウレタン基を有する請求項1〜6のいずれかに記載のコンデンサ。
- 請求項1〜7のいずれかに記載のコンデンサと、トランジスタを少なくとも有する回路。
- トランジスタがゲート絶縁層を備えており、該ゲート絶縁層と前記誘電体層が同一材料である請求項8記載の回路。
- 少なくとも以下の工程を含む、コンデンサの製造方法;
(1)絶縁基板上に、導電体と感光性有機化合物を含有する導電ペーストを用いて感光性導電膜を形成する工程;
(2)前記感光性導電膜を、フォトリソグラフィによりコンデンサの導電膜に対応するパターンに加工する工程;
(3)有機化合物と金属化合物を含有する組成物を塗布および乾燥して、誘電体層を形成する工程。 - 前記組成物がケイ素原子と炭素原子の結合を有する化合物を含む請求項10記載のコンデンサの製造方法。
- 前記組成物が、重量平均分子量が1000以上のポリマーを含有する組成物である請求項10または11記載のコンデンサの製造方法。
- 前記組成物が、さらに一般式(1)で表される金属キレート化合物を含有する組成物である請求項10〜12のいずれかに記載のコンデンサの製造方法。
R1 xM(OR2)y−x (1)
(R1は1価の2座配位子を示し、R1が複数存在する場合、それぞれのR1は同じでも異なっていてもよい。R2は水素原子、アルキル基、アシル基またはアリール基を示し、R2が複数存在する場合、それぞれのR2は同じでも異なっていてもよい。Mはy価の金属原子を示す。yは1〜6である。xは1〜yの整数を示す。) - 前記組成物が、一般式(1)で表される金属キレート化合物100重量部に対して重量平均分子量が1000以上のポリマーを5〜90重量部含有する組成物である請求項13記載のコンデンサの製造方法。
- 少なくとも以下の工程を含む、回路の製造方法;
(1)絶縁基板上に、コンデンサの下部電極と、トランジスタのゲート電極またはソース/ドレイン電極を形成する工程;
(2)有機化合物と金属化合物を含有する組成物を塗布および乾燥して、コンデンサの誘電体層とトランジスタのゲート絶縁層を同時に形成する工程。 - 請求項1〜7のいずれかに記載のコンデンサ、並びにトランジスタ及びアンテナパターンを少なくとも有する無線通信装置。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0520924A (ja) * | 1991-07-08 | 1993-01-29 | Olympus Optical Co Ltd | 有機誘電体ペーストおよびその製造方法 |
JPH10112216A (ja) * | 1996-08-09 | 1998-04-28 | Toray Ind Inc | 感光性導電ペースト、それを用いた電極およびその製造方法 |
JPH11130515A (ja) * | 1997-10-21 | 1999-05-18 | Daiki Aluminium Industry Co Ltd | アルミニウム残灰からセラミック製品を製造する方法 |
JP2006309202A (ja) * | 2005-03-29 | 2006-11-09 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた半導体装置 |
JP2008112147A (ja) * | 2006-09-27 | 2008-05-15 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5805409A (en) * | 1995-08-18 | 1998-09-08 | Tdk Corporation | Multi-layer electronic part having external electrodes that have a thermosetting resin and metal particles |
JP2000276945A (ja) * | 1999-03-25 | 2000-10-06 | Murata Mfg Co Ltd | 導体ペースト及びそれを用いた回路基板 |
JP2005280287A (ja) * | 2004-03-31 | 2005-10-13 | Tokai Aluminum Foil Co Ltd | 共振ラベル用積層材の製造法 |
US20070232734A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto |
KR100829539B1 (ko) * | 2007-04-13 | 2008-05-16 | 삼성전자주식회사 | 박막 제조 방법, 이를 이용한 게이트 구조물 및 커패시터의제조 방법 |
US8536242B2 (en) * | 2007-08-09 | 2013-09-17 | Sekisui Chemical Co., Ltd. | Photocurable composition |
KR101539125B1 (ko) | 2007-10-10 | 2015-07-23 | 코비오 인코포레이티드 | 인쇄 집적 회로소자를 포함하는 무선 장치 및 이의 제조 및 사용 방법 |
CA2702324C (en) | 2007-10-10 | 2017-04-11 | Kovio, Inc. | High reliability surveillance and/or identification tag/devices and methods of making and using the same |
US20090230363A1 (en) * | 2007-11-14 | 2009-09-17 | Samsung Electro-Mechanics Co., Ltd. | Polymer composite |
KR101420147B1 (ko) * | 2009-03-31 | 2014-07-21 | 주식회사 잉크테크 | 박막 캐패시터의 제조 방법 |
CN102668062B (zh) * | 2009-10-21 | 2014-12-10 | 株式会社半导体能源研究所 | 半导体器件 |
CN103193477B (zh) * | 2012-01-06 | 2016-03-16 | 三菱综合材料株式会社 | 介电薄膜形成用组合物、介电薄膜的形成方法及介电薄膜 |
WO2014142105A1 (ja) * | 2013-03-14 | 2014-09-18 | 東レ株式会社 | 電界効果型トランジスタ |
CN107849266B (zh) * | 2015-06-11 | 2020-11-10 | 京瓷株式会社 | 复合树脂材料、介电膜、使用其的膜电容器和连结型电容器、以及逆变器、电动车辆 |
-
2016
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0520924A (ja) * | 1991-07-08 | 1993-01-29 | Olympus Optical Co Ltd | 有機誘電体ペーストおよびその製造方法 |
JPH10112216A (ja) * | 1996-08-09 | 1998-04-28 | Toray Ind Inc | 感光性導電ペースト、それを用いた電極およびその製造方法 |
JPH11130515A (ja) * | 1997-10-21 | 1999-05-18 | Daiki Aluminium Industry Co Ltd | アルミニウム残灰からセラミック製品を製造する方法 |
JP2006309202A (ja) * | 2005-03-29 | 2006-11-09 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた半導体装置 |
JP2008112147A (ja) * | 2006-09-27 | 2008-05-15 | Toray Ind Inc | 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置 |
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