JPWO2017038237A1 - 保管装置および保管方法 - Google Patents
保管装置および保管方法 Download PDFInfo
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- JPWO2017038237A1 JPWO2017038237A1 JP2017537615A JP2017537615A JPWO2017038237A1 JP WO2017038237 A1 JPWO2017038237 A1 JP WO2017038237A1 JP 2017537615 A JP2017537615 A JP 2017537615A JP 2017537615 A JP2017537615 A JP 2017537615A JP WO2017038237 A1 JPWO2017038237 A1 JP WO2017038237A1
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- 238000003860 storage Methods 0.000 title claims abstract description 203
- 238000000034 method Methods 0.000 title claims abstract description 96
- 238000010926 purge Methods 0.000 claims abstract description 210
- 239000007789 gas Substances 0.000 description 68
- 230000032258 transport Effects 0.000 description 65
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/14—Stack holders or separators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Dram (AREA)
Abstract
Description
2 処理装置
3 天井搬送車(搬送車)
4、5 ロードポート
6、7 入出庫ポート(搬送車用ポート)
11 保管棚
12 パージ装置
13 移載装置(入出庫装置)
15 パージ決定部
F 容器
Claims (10)
- 容器を保管する保管棚と、
前記保管棚に設けられ、前記容器にパージ処理を行うことが可能なパージ装置と、
前記保管棚への前記容器の搬入元、及び前記保管棚からの前記容器の搬出先の少なくとも一方に応じて、前記パージ処理の要否および条件の少なくとも一方を決定するパージ決定部と、を備える保管装置。 - 前記保管棚への前記容器の搬入および前記保管棚からの前記容器の搬出を行う入出庫装置を備え、
前記パージ決定部は、前記入出庫装置への搬送指令に応じて、前記パージ処理の要否を決定する、請求項1に記載の保管装置。 - 前記容器に収容された物品を処理する処理装置に併設され、搬送車によって前記容器が受け渡される搬送車用ポートと、前記処理装置のロードポートとの間で受け渡される前記容器を前記保管棚に保管し、
前記パージ決定部は、前記入出庫装置に対する前記搬送車用ポートと前記保管棚との間の前記搬送指令、または前記入出庫装置に対する前記ロードポートと前記保管棚との間の前記搬送指令に基づいて、前記パージ処理の要否を決定する、請求項2に記載の保管装置。 - 前記搬送指令が、前記容器を前記搬送車用ポートから前記保管棚へ搬送させる指令である場合、前記パージ決定部は、前記搬入元が前記搬送車用ポートであると特定する、請求項3に記載の保管装置。
- 前記搬送指令が、前記容器を前記搬送車用ポートから前記保管棚へ搬送させる指令である場合、前記パージ決定部は、前記搬出先が前記ロードポートであると特定する、請求項3または請求項4に記載の保管装置。
- 前記搬送指令が、前記容器を前記ロードポートから前記保管棚へ搬送させる指令である場合、前記パージ決定部は、前記搬入元が前記ロードポートであると特定する、請求項3に記載の保管装置。
- 前記搬送指令が、前記容器を前記ロードポートから前記保管棚へ搬送させる指令である場合、前記パージ決定部は、前記搬出先が前記搬送車用ポートであると特定する、請求項3または請求項6に記載の保管装置。
- 前記パージ決定部は、前記搬出先を特定した結果を、前記搬出先と前記パージ処理の要否とを関連付けた参照情報と照合して、前記パージ処理の要否を決定する、請求項5または請求項7に記載の保管装置。
- 前記パージ決定部は、前記搬入元を特定した結果を、前記搬入元と前記パージ処理の要否とを関連付けた参照情報と照合して、前記パージ処理の要否を決定する、請求項6または請求項8に記載の保管装置。
- 容器を保管棚に保管することと、
前記保管棚に設けられるパージ装置により前記容器にパージ処理を行うことと、
前記保管棚への前記容器の搬入元、及び前記保管棚からの前記容器の搬出先の少なくとも一方に応じて、前記パージ処理の要否および条件の少なくとも一方を決定することと、を含む保管方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015168594 | 2015-08-28 | ||
JP2015168594 | 2015-08-28 | ||
PCT/JP2016/069770 WO2017038237A1 (ja) | 2015-08-28 | 2016-07-04 | 保管装置および保管方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017038237A1 true JPWO2017038237A1 (ja) | 2018-08-02 |
JP6414338B2 JP6414338B2 (ja) | 2018-10-31 |
Family
ID=58187218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017537615A Active JP6414338B2 (ja) | 2015-08-28 | 2016-07-04 | 保管装置および保管方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US10882697B2 (ja) |
EP (1) | EP3343597B1 (ja) |
JP (1) | JP6414338B2 (ja) |
KR (1) | KR20180032624A (ja) |
CN (1) | CN107924857B (ja) |
IL (1) | IL257595B (ja) |
SG (1) | SG11201801385XA (ja) |
TW (1) | TWI665142B (ja) |
WO (1) | WO2017038237A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201801353VA (en) * | 2015-08-25 | 2018-03-28 | Murata Machinery Ltd | Purge device, purge stocker, and purge method |
DE102016205597B4 (de) * | 2016-04-05 | 2022-06-23 | Fabmatics Gmbh | Purge-Messsystem für FOUPs |
KR20210011915A (ko) * | 2018-05-23 | 2021-02-02 | 가부시키가이샤 다이후쿠 | 피킹 시스템 |
JP7090513B2 (ja) * | 2018-09-06 | 2022-06-24 | 東京エレクトロン株式会社 | 基板処理装置及びパージ方法 |
KR102126466B1 (ko) * | 2018-09-27 | 2020-06-24 | 크린팩토메이션 주식회사 | 이에프이엠 |
US11984335B2 (en) * | 2021-12-29 | 2024-05-14 | Applied Materials, Inc. | FOUP or cassette storage for hybrid substrate bonding system |
CN114493323A (zh) * | 2022-02-11 | 2022-05-13 | 内蒙古中科装备有限公司 | 储氢容器的紧急吹扫方法、系统及介质 |
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JP2014027258A (ja) * | 2012-06-20 | 2014-02-06 | Tdk Corp | ロードポート装置及びefemシステム |
JP2015009911A (ja) * | 2013-06-26 | 2015-01-19 | 株式会社ダイフク | 物品保管設備 |
JP2015029057A (ja) * | 2013-06-28 | 2015-02-12 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法並びに記録媒体 |
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JP2000003955A (ja) * | 1998-06-15 | 2000-01-07 | Mitsubishi Electric Corp | 半導体ウエハ収納装置 |
JP2003092345A (ja) * | 2001-07-13 | 2003-03-28 | Semiconductor Leading Edge Technologies Inc | 基板収納容器、基板搬送システム、保管装置及びガス置換方法 |
JP4692584B2 (ja) * | 2008-07-03 | 2011-06-01 | 村田機械株式会社 | パージ装置 |
JP2010241515A (ja) * | 2009-04-01 | 2010-10-28 | Murata Machinery Ltd | 保管倉庫 |
JP5083278B2 (ja) | 2009-06-15 | 2012-11-28 | 村田機械株式会社 | 装置前自動倉庫 |
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JP6044467B2 (ja) * | 2013-06-26 | 2016-12-14 | 株式会社ダイフク | 保管システム |
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-
2016
- 2016-07-04 KR KR1020187005227A patent/KR20180032624A/ko not_active Application Discontinuation
- 2016-07-04 WO PCT/JP2016/069770 patent/WO2017038237A1/ja active Application Filing
- 2016-07-04 SG SG11201801385XA patent/SG11201801385XA/en unknown
- 2016-07-04 EP EP16841269.0A patent/EP3343597B1/en active Active
- 2016-07-04 US US15/755,131 patent/US10882697B2/en active Active
- 2016-07-04 JP JP2017537615A patent/JP6414338B2/ja active Active
- 2016-07-04 CN CN201680049177.8A patent/CN107924857B/zh active Active
- 2016-07-04 IL IL257595A patent/IL257595B/en unknown
- 2016-08-26 TW TW105127431A patent/TWI665142B/zh active
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JP2009049286A (ja) * | 2007-08-22 | 2009-03-05 | Panasonic Corp | 半導体装置の製造管理装置および製造管理方法 |
JP2013139319A (ja) * | 2012-01-04 | 2013-07-18 | Daifuku Co Ltd | 物品保管設備 |
JP2014027258A (ja) * | 2012-06-20 | 2014-02-06 | Tdk Corp | ロードポート装置及びefemシステム |
JP2015009911A (ja) * | 2013-06-26 | 2015-01-19 | 株式会社ダイフク | 物品保管設備 |
JP2015029057A (ja) * | 2013-06-28 | 2015-02-12 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法並びに記録媒体 |
Also Published As
Publication number | Publication date |
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JP6414338B2 (ja) | 2018-10-31 |
IL257595B (en) | 2022-07-01 |
EP3343597A4 (en) | 2019-05-01 |
SG11201801385XA (en) | 2018-03-28 |
TWI665142B (zh) | 2019-07-11 |
CN107924857A (zh) | 2018-04-17 |
IL257595A (en) | 2018-04-30 |
EP3343597B1 (en) | 2022-04-20 |
CN107924857B (zh) | 2022-04-05 |
KR20180032624A (ko) | 2018-03-30 |
TW201711935A (zh) | 2017-04-01 |
WO2017038237A1 (ja) | 2017-03-09 |
EP3343597A1 (en) | 2018-07-04 |
US20180244470A1 (en) | 2018-08-30 |
US10882697B2 (en) | 2021-01-05 |
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