JPWO2017013725A1 - 熱輸送装置及び電子装置 - Google Patents
熱輸送装置及び電子装置 Download PDFInfo
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- JPWO2017013725A1 JPWO2017013725A1 JP2017529195A JP2017529195A JPWO2017013725A1 JP WO2017013725 A1 JPWO2017013725 A1 JP WO2017013725A1 JP 2017529195 A JP2017529195 A JP 2017529195A JP 2017529195 A JP2017529195 A JP 2017529195A JP WO2017013725 A1 JPWO2017013725 A1 JP WO2017013725A1
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- heat
- refrigerant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
受熱部材(34)と放熱部材(36)の間で冷媒を循環させる冷媒循環路(38)を有する。冷媒循環路(38)は、冷媒が流れる本流部(56)と、本流部(56)が部分的に複数の流路に分かれる分流部(58)と、を備える。分流部(58)のそれぞれにはポンプ(60)が設けられる。ポンプ(60)の出口側の分流部(58)のそれぞれと本流部(56)とをバイパスするバイパス流路(70)を有する。
Description
26 電子部品
32 冷却装置
34 受熱部材
36 放熱部材
38 冷媒循環路
38G 蒸気流路
38L 液流路
52 分流点
54 合流点
56 本流部
58 分流部
60 ポンプ
66 分岐点
68 接続点
70 バイパス流路
72 連通流路
74 接続流路
76 継手部材
80 バイパス流路
82 冷却装置
86 継手部材
92 冷却装置
Claims (11)
- 熱を受ける受熱部材と、
熱を放出する放熱部材と、
冷媒が流れる本流部と前記本流部が部分的に複数の流路に分かれる分流部とを備え、前記受熱部材と前記放熱部材の間で冷媒を循環させる冷媒循環路と、
前記分流部にそれぞれ設けられるポンプと、
前記ポンプの出口側の前記分流部のそれぞれと、前記本流部とをバイパスするバイパス流路と、
を有する熱輸送装置。 - 前記バイパス流路が、
前記分流部どうしを連通する連通流路と、
前記連通流路の中間部分と前記本流部とを接続する接続流路と、
を有する請求項1に記載の熱輸送装置。 - 前記バイパス流路が、
前記分流部のそれぞれから分岐し前記本流部にそれぞれ接続される請求項1に記載の熱輸送装置。 - 前記バイパス流路が、前記分流部が合流する合流点よりも下流側で前記本流部に接続される請求項1〜請求項3のいずれか1項に記載に熱輸送装置。
- 前記バイパス流路の流路断面積が前記分流部の流路断面積以下である請求項1〜請求項4のいずれか1項に記載の熱輸送装置。
- 前記バイパス流路の前記本流部との接続点よりも下流側における前記本流部の流路断面積が、前記接続点よりも上流側における前記バイパス流路と前記本流部を合わせた流路断面積以上である請求項1〜請求項5のいずれか1項に記載の熱輸送装置。
- 前記バイパス流路の長さが、前記バイパス流路の前記分流部からの分岐点から前記本流部への接続点までの前記冷媒循環路の長さ以上である請求項1〜請求項6のいずれか1項に記載の熱輸送装置。
- 前記本流部に対する上流側から視た前記バイパス流路の接続角が0度以上90度以下である請求項1〜請求項7のいずれか1項に記載の熱輸送装置。
- 前記接続角が0度である請求項8に記載の熱輸送装置。
- 前記冷媒循環路に前記バイパス流路を接続させる継手部材を有する請求項1〜請求項9のいずれか1項に記載の熱輸送装置。
- 電子部品と、
前記電子部品の熱を受ける受熱部材と、
熱を放出する放熱部材と、
冷媒が流れる本流部と前記本流部が部分的に複数の流路に分かれる分流部とを備え、前記受熱部材と前記放熱部材の間で冷媒を循環させる冷媒循環路と、
前記分流部にそれぞれ設けられるポンプと、
前記ポンプの出口側の前記分流部のそれぞれと、前記本流部とをバイパスするバイパス流路と、
を有する電子装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/070620 WO2017013725A1 (ja) | 2015-07-17 | 2015-07-17 | 熱輸送装置及び電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017013725A1 true JPWO2017013725A1 (ja) | 2018-07-05 |
JP6447731B2 JP6447731B2 (ja) | 2019-01-09 |
Family
ID=57834164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017529195A Active JP6447731B2 (ja) | 2015-07-17 | 2015-07-17 | 熱輸送装置及び電子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20180139864A1 (ja) |
JP (1) | JP6447731B2 (ja) |
WO (1) | WO2017013725A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7238400B2 (ja) * | 2018-12-28 | 2023-03-14 | 日本電産株式会社 | 冷却装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119088U (ja) * | 1985-01-09 | 1986-07-26 | ||
JPH04105979U (ja) * | 1991-02-26 | 1992-09-11 | 神鋼電機株式会社 | 循環装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04105979A (ja) * | 1990-08-27 | 1992-04-07 | Canon Inc | 記録装置 |
JP2000297447A (ja) * | 1999-04-14 | 2000-10-24 | Bridgestone Corp | 建築排水システム |
JP2005228237A (ja) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | 液冷システム及びそれを備えた電子機器 |
US9848509B2 (en) * | 2011-06-27 | 2017-12-19 | Ebullient, Inc. | Heat sink module |
-
2015
- 2015-07-17 WO PCT/JP2015/070620 patent/WO2017013725A1/ja active Application Filing
- 2015-07-17 JP JP2017529195A patent/JP6447731B2/ja active Active
-
2018
- 2018-01-12 US US15/869,468 patent/US20180139864A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61119088U (ja) * | 1985-01-09 | 1986-07-26 | ||
JPH04105979U (ja) * | 1991-02-26 | 1992-09-11 | 神鋼電機株式会社 | 循環装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6447731B2 (ja) | 2019-01-09 |
US20180139864A1 (en) | 2018-05-17 |
WO2017013725A1 (ja) | 2017-01-26 |
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