JPWO2015194460A1 - ケーブル接続構造および内視鏡装置 - Google Patents
ケーブル接続構造および内視鏡装置 Download PDFInfo
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- 239000012212 insulator Substances 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000003384 imaging method Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 description 19
- 230000037431 insertion Effects 0.000 description 19
- 238000005452 bending Methods 0.000 description 13
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
- A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00064—Constructional details of the endoscope body
- A61B1/00071—Insertion part of the endoscope body
- A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
- A61B1/00096—Optical elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/00112—Connection or coupling means
- A61B1/00114—Electrical cables in or with an endoscope
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
- A61B1/051—Details of CCD assembly
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2407—Optical details
- G02B23/2423—Optical details of the distal end
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
- G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
- G02B23/2476—Non-optical details, e.g. housings, mountings, supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Astronomy & Astrophysics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Endoscopes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Abstract
Description
図1は、本発明の実施の形態にかかる内視鏡システムの全体構成を模式的に示す図である。図1に示すように、内視鏡装置1は、内視鏡2と、ユニバーサルコード6と、コネクタ7と、光源装置9と、プロセッサ(制御装置)10と、表示装置13とを備える。
実施の形態2に係るケーブル接続構造では、基材上に、外部接続電極の信号ケーブルの軸方向と垂直な両端部を覆うようにソルダーレジスト層が形成されている。図6は、本発明の実施の形態2に係るケーブル接続構造の上面図である。図7は、図6のB−B線断面図である。なお、図6においては、信号ケーブルと電極を接続するハンダを省略している。
実施の形態3に係るケーブル接続構造では、ビアは、外部接続電極51の信号ケーブル48の軸方向と垂直な両端部にそれぞれ設けられている。図9は、本発明の実施の形態3に係るケーブル接続構造の上面図である。図10は、図9のC−C線断面図である。なお、図9においては、信号ケーブルと電極を接続するハンダを省略している。
実施の形態4は、同軸ケーブルを基板に接続してなるケーブル接続構造である。図11は、本発明の実施の形態4に係るケーブル接続構造の上面図である。図12は、図11のD−D線断面図である。図13は、ビア、シールド接続電極、およびソルダーレジスト層の積層関係を示す図である。なお、図11においては、信号ケーブルと電極を接続するハンダを省略している。
2 内視鏡
4 挿入部
5 操作部
6 ユニバーサルコード
7 コネクタ
9 光源装置
10 プロセッサ
13 表示装置
17 処置具挿入口
31 先端部
32 湾曲部
33 可撓管部
36 光学部材ホルダ
37 プリズム
38 撮像素子
39 基板
40 撮像ユニット
41 先端部本体
41a 接着剤
42 被覆管
43 レンズユニット
43a−1〜43a−4 対物レンズ
44−1〜44−3 スペーサ
45 電子部品
46 封止樹脂
47 電気ケーブル束
48 信号ケーブル
48D 同軸ケーブル
49 熱収縮チューブ
50 基材
51 外部接続電極
51D 芯線接続電極
52、54 ビア
53、55 配線パターン
54b 接着樹脂
56 シールド接続電極
60、60D 芯線
61、61D ジャケット
62 ハンダ
63 内部絶縁体
64 シールド
70 ソルダーレジスト層
Claims (6)
- 芯線を絶縁体からなるジャケットで被覆したケーブルを基板に接続したケーブル接続構造であって、
前記基板は、絶縁体からなる基材と、前記基材表面に形成される前記芯線を接続する外部接続電極と、前記基材内部に設けられ前記ケーブルの実装面に端部が露出するとともに、前記外部接続電極と接続するビアとを有し、
前記ビアは、前記外部接続電極の前記ケーブルの軸方向と垂直な両端部であって、前記ケーブルの基端側に少なくとも設けられることを特徴とするケーブル接続構造。 - 前記基材上には、前記外部接続電極の前記ケーブルの軸方向と垂直な両端部を覆うようにソルダーレジスト層が形成されることを特徴とする請求項1に記載のケーブル接続構造。
- 前記ビアは、前記外部接続電極の前記ケーブルの軸方向と垂直な両端部であって、前記ケーブルの基端側と他端側にそれぞれ設けられ、前記ケーブルの基端側と他端側に形成される前記ビアは、前記外部接続電極の対角線上に対称に設けられることを特徴とする請求項1または2に記載のケーブル接続構造。
- 前記基板は、複数の前記外部接続電極を有し、複数の前記ケーブルが前記外部接続電極にそれぞれ接続されることを特徴とする請求項1〜3のいずれか一つに記載のケーブル接続構造。
- 前記ケーブルは、導電性材料からなる芯線と、前記芯線の外周を被覆する内部絶縁体と、前記内部絶縁体の外周を被覆するシールドと、前記シールドの外周を被覆する外部絶縁体とを有する同軸ケーブルであり、
前記基板は、複数の前記同軸ケーブルの前記芯線を接続する複数の芯線接続電極と、複数の前記シールドを接続する1つのシールド接続電極が設けられ、
前記ビアは、前記シールド接続電極の前記同軸ケーブルの軸方向と平行な両端部に対向するように2つ形成されることを特徴とする請求項4に記載のケーブル接続構造。 - 生体内に挿入され、生体内部を撮像する撮像装置を備えた内視鏡装置において、
前記撮像装置は、請求項1〜5のいずれか一つに記載のケーブル接続構造を備えることを特徴とする内視鏡装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014127359 | 2014-06-20 | ||
JP2014127359 | 2014-06-20 | ||
PCT/JP2015/066942 WO2015194460A1 (ja) | 2014-06-20 | 2015-06-11 | ケーブル接続構造および内視鏡装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2015194460A1 true JPWO2015194460A1 (ja) | 2017-04-20 |
JP6537508B2 JP6537508B2 (ja) | 2019-07-03 |
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JP2016529298A Active JP6537508B2 (ja) | 2014-06-20 | 2015-06-11 | ケーブル接続構造および内視鏡装置 |
Country Status (5)
Country | Link |
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US (1) | US10517465B2 (ja) |
JP (1) | JP6537508B2 (ja) |
CN (1) | CN106455933B (ja) |
DE (1) | DE112015002908T5 (ja) |
WO (1) | WO2015194460A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019026219A1 (ja) * | 2017-08-02 | 2019-02-07 | オリンパス株式会社 | ケーブル端部構造体、ケーブル接続構造体、および内視鏡 |
JP6596551B1 (ja) * | 2018-09-06 | 2019-10-23 | 株式会社フジクラ | 電子部品ユニット |
JPWO2024053096A1 (ja) * | 2022-09-09 | 2024-03-14 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009158668A (ja) * | 2007-12-26 | 2009-07-16 | Sumitomo Metal Electronics Devices Inc | セラミック多層配線基板及びその製造方法 |
JP2010069231A (ja) * | 2008-09-22 | 2010-04-02 | Fujifilm Corp | 撮像装置及び内視鏡 |
JP2011049205A (ja) * | 2009-08-25 | 2011-03-10 | Panasonic Corp | 積層基板およびその製造方法 |
JP2011071036A (ja) * | 2009-09-28 | 2011-04-07 | Olympus Corp | 電子回路モジュール |
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US6857898B2 (en) * | 2002-07-25 | 2005-02-22 | Tektronix, Inc. | Apparatus and method for low-profile mounting of a multi-conductor coaxial cable launch to an electronic circuit board |
JP4125570B2 (ja) * | 2002-09-19 | 2008-07-30 | 日本電気株式会社 | 電子装置 |
JP4558413B2 (ja) * | 2004-08-25 | 2010-10-06 | 新光電気工業株式会社 | 基板、半導体装置、基板の製造方法、及び半導体装置の製造方法 |
JP4885640B2 (ja) * | 2006-08-01 | 2012-02-29 | オリンパスメディカルシステムズ株式会社 | 内視鏡用挿入補助具 |
AU2007361170B2 (en) * | 2007-11-13 | 2014-03-06 | Artex Picture Frames Ltd. | Canvas stretching system with corner clamps |
CN102047102A (zh) * | 2008-05-27 | 2011-05-04 | 皇家飞利浦电子股份有限公司 | 等电聚焦生物芯片 |
JP5561460B2 (ja) * | 2009-06-03 | 2014-07-30 | 新光電気工業株式会社 | 配線基板および配線基板の製造方法 |
JP5303404B2 (ja) * | 2009-08-31 | 2013-10-02 | オリンパスメディカルシステムズ株式会社 | 撮像装置及び電子内視鏡 |
JP2011192808A (ja) * | 2010-03-15 | 2011-09-29 | Fujifilm Corp | 撮像モジュール及びその製造方法並びに内視鏡装置 |
US8339798B2 (en) * | 2010-07-08 | 2012-12-25 | Apple Inc. | Printed circuit boards with embedded components |
JP5670250B2 (ja) * | 2011-04-18 | 2015-02-18 | イビデン株式会社 | Led基板、発光モジュール、発光モジュールを有する機器、led基板の製造方法、発光モジュールの製造方法、及び発光モジュールを有する機器の製造方法 |
-
2015
- 2015-06-11 DE DE112015002908.7T patent/DE112015002908T5/de not_active Withdrawn
- 2015-06-11 JP JP2016529298A patent/JP6537508B2/ja active Active
- 2015-06-11 WO PCT/JP2015/066942 patent/WO2015194460A1/ja active Application Filing
- 2015-06-11 CN CN201580033043.2A patent/CN106455933B/zh active Active
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2016
- 2016-11-22 US US15/358,330 patent/US10517465B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009158668A (ja) * | 2007-12-26 | 2009-07-16 | Sumitomo Metal Electronics Devices Inc | セラミック多層配線基板及びその製造方法 |
JP2010069231A (ja) * | 2008-09-22 | 2010-04-02 | Fujifilm Corp | 撮像装置及び内視鏡 |
JP2011049205A (ja) * | 2009-08-25 | 2011-03-10 | Panasonic Corp | 積層基板およびその製造方法 |
JP2011071036A (ja) * | 2009-09-28 | 2011-04-07 | Olympus Corp | 電子回路モジュール |
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Publication number | Publication date |
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US10517465B2 (en) | 2019-12-31 |
JP6537508B2 (ja) | 2019-07-03 |
DE112015002908T5 (de) | 2017-03-02 |
CN106455933A (zh) | 2017-02-22 |
US20170071453A1 (en) | 2017-03-16 |
WO2015194460A1 (ja) | 2015-12-23 |
CN106455933B (zh) | 2018-10-30 |
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