JPWO2015155983A1 - センサ - Google Patents
センサInfo
- Publication number
- JPWO2015155983A1 JPWO2015155983A1 JP2016512603A JP2016512603A JPWO2015155983A1 JP WO2015155983 A1 JPWO2015155983 A1 JP WO2015155983A1 JP 2016512603 A JP2016512603 A JP 2016512603A JP 2016512603 A JP2016512603 A JP 2016512603A JP WO2015155983 A1 JPWO2015155983 A1 JP WO2015155983A1
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- layer
- wafer
- upper lid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0181—See-saws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/095—Feed-through, via through the lid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/096—Feed-through, via through the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0837—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being suspended so as to only allow movement perpendicular to the plane of the substrate, i.e. z-axis sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass
Abstract
Description
図1は実施の形態1におけるセンサ装置1000の斜視図であり、センサ装置1000から上蓋を取り外した状態を示す。センサ装置1000は、パッケージ300と、パッケージ300に搭載されたセンサ100と、パッケージ300に搭載されたプロセッサ200と、パッケージ300から引き出された端子301を備える。プロセッサ200はセンサ100からの出力に基づいて各種の演算を行う。パッケージ300から引き出された端子301は基板302に接続される。
図2Aと図2Bはそれぞれセンサ100の斜視図と分解斜視図である。センサ100では、X軸とY軸とZ軸の3つの軸の方向の加速度をそれぞれ検出する3つの重りが1チップ内に配置されている。X軸とY軸とを含むXY方向である平面方向の加速度は、一対のねじりビームを軸にして重りである可動電極をシーソー動作させることにより検出する。Z軸の方向である垂直方向の加速度は、2つ以上のビームにより保持された重りである可動電極を垂直方向に平行移動させることにより検出する。
互いに対向する電極により形成される静電容量Cは、電極間の誘電率ε、電極の対向面積S、電極間のギャップdを用いて、C=εS/dにより算出することができる。加速度により可動電極11、21が回転すると、ギャップdが変化するので静電容量Cが変化する。プロセッサ200は静電容量Cの変化を電圧に変換するCV変換を行う。
図9はZ軸の方向に1Gの加速度が印加された状態におけるセンサ100の断面図であり、Z検出部30の断面を示している。図10はZ軸の方向の加速度が印加されている状態におけるセンサ100の動作を示す概略図である。Z軸の方向の加速度が印加されていない状態において、可動電極31と固定電極33aとの間の静電容量C5と、可動電極31と固定電極33bとの間の静電容量C6は共に寄生容量Cs2である。プロセッサ200は、静電容量C5と静電容量C6の差分値(C5−C6=Cs2−Cs2=0)を算出し、Z出力として出力する。Z軸の方向の加速度が印加されている状態では、図10に示すように、可動電極31と固定電極33aとの間の静電容量C5はCs2+ΔCとなり、可動電極31と第3の固定電極33bとの間の静電容量C6はCs2−ΔCとなる。プロセッサ200は、静電容量C5と静電容量C6の差分値(C5−C6=Cs2+ΔC−(Cs2−ΔC)=2・ΔC)を算出し、Z出力として出力する。加速度により変化するZ出力により、Z検出部30は、静電容量C5、C6の変化に基づいてZ軸の方向の加速度を検出する。
図11Aから図11Gは実施の形態1におけるセンサ100の製造方法を示す断面図であり、図3と同様に、X検出部10の断面を示す。
図13Aと図13Bはそれぞれ実施の形態2におけるセンサ600の斜視図と分解斜視図である。実施の形態2におけるセンサ600は加速度を検出する加速度センサである。
2a 上蓋層
2b 下蓋層
14c 絶縁領域
14d 外周領域
14a,24a,34a,34b 貫通電極
15,16 突起
522 支持部
523,524,525,526 梁部
527,528,529,530 可動部
531,532,533,534,538A,538B 検出部
600 センサ
603 基板
605 基板
620 周縁部
621 粗化領域
622 接続部
623 上蓋ウェハ
625 検出素子ウェハ
627 下蓋ウェハ
631a,631b,633a,633b 改質層
643 粗化領域
651 平滑部
Claims (4)
- 上蓋層と、
下蓋層と、
前記上蓋層と前記下蓋層との間に設けられたセンサ層と、
を備え、
前記上蓋層と下蓋層のうちの一方は、
ガラスを主成分とする絶縁領域と、
前記絶縁領域に覆われた貫通電極と、
前記絶縁領域の外周に設けられたSiを主成分とする外周領域と、
を有する、センサ。 - 前記貫通電極はSiよりなる、請求項1に記載のセンサ。
- 前記上蓋層は下方に向かって突出する突起を有する、請求項1に記載のセンサ。
- 前記下蓋層は上方に向かって突出する突起を有する、請求項1に記載のセンサ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014079113 | 2014-04-08 | ||
JP2014079113 | 2014-04-08 | ||
JP2014132235 | 2014-06-27 | ||
JP2014132235 | 2014-06-27 | ||
PCT/JP2015/001943 WO2015155983A1 (ja) | 2014-04-08 | 2015-04-07 | センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2015155983A1 true JPWO2015155983A1 (ja) | 2017-04-13 |
Family
ID=54287569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016512603A Pending JPWO2015155983A1 (ja) | 2014-04-08 | 2015-04-07 | センサ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20170089941A1 (ja) |
JP (1) | JPWO2015155983A1 (ja) |
WO (1) | WO2015155983A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10649000B2 (en) * | 2015-12-17 | 2020-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Connection assembly |
JP2023042084A (ja) * | 2021-09-14 | 2023-03-27 | セイコーエプソン株式会社 | 慣性センサーモジュール |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05209894A (ja) * | 1992-01-31 | 1993-08-20 | Nissan Motor Co Ltd | 半導体加速度センサ |
JP2002098711A (ja) * | 2000-09-26 | 2002-04-05 | Matsushita Electric Works Ltd | 半導体加速度センサおよびその製造方法 |
JP2011043412A (ja) * | 2009-08-21 | 2011-03-03 | Panasonic Electric Works Co Ltd | 静電容量型加速度センサ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3517428B2 (ja) * | 1993-03-31 | 2004-04-12 | 株式会社日立製作所 | 容量式加速度センサ |
WO2005075969A1 (de) * | 2004-02-06 | 2005-08-18 | Micronas Gmbh | Sensor und verfahren zu dessen herstellung |
JP2013062339A (ja) * | 2011-09-13 | 2013-04-04 | Seiko Epson Corp | 複合基板、電子デバイス及び電子機器 |
US20160084870A1 (en) * | 2013-04-26 | 2016-03-24 | Panasonic Intellectual Property Management Co., Ltd. | Sensor |
WO2015008422A1 (ja) * | 2013-07-19 | 2015-01-22 | パナソニックIpマネジメント株式会社 | センサ |
WO2015052926A1 (ja) * | 2013-10-09 | 2015-04-16 | パナソニックIpマネジメント株式会社 | 加速度センサ |
-
2015
- 2015-04-07 US US15/128,096 patent/US20170089941A1/en not_active Abandoned
- 2015-04-07 WO PCT/JP2015/001943 patent/WO2015155983A1/ja active Application Filing
- 2015-04-07 JP JP2016512603A patent/JPWO2015155983A1/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05209894A (ja) * | 1992-01-31 | 1993-08-20 | Nissan Motor Co Ltd | 半導体加速度センサ |
JP2002098711A (ja) * | 2000-09-26 | 2002-04-05 | Matsushita Electric Works Ltd | 半導体加速度センサおよびその製造方法 |
JP2011043412A (ja) * | 2009-08-21 | 2011-03-03 | Panasonic Electric Works Co Ltd | 静電容量型加速度センサ |
Also Published As
Publication number | Publication date |
---|---|
US20170089941A1 (en) | 2017-03-30 |
WO2015155983A1 (ja) | 2015-10-15 |
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