JPWO2015118775A1 - ガス注入装置及び補助部材 - Google Patents
ガス注入装置及び補助部材 Download PDFInfo
- Publication number
- JPWO2015118775A1 JPWO2015118775A1 JP2015561175A JP2015561175A JPWO2015118775A1 JP WO2015118775 A1 JPWO2015118775 A1 JP WO2015118775A1 JP 2015561175 A JP2015561175 A JP 2015561175A JP 2015561175 A JP2015561175 A JP 2015561175A JP WO2015118775 A1 JPWO2015118775 A1 JP WO2015118775A1
- Authority
- JP
- Japan
- Prior art keywords
- injection port
- gas
- purge gas
- discharge
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C5/00—Methods or apparatus for filling containers with liquefied, solidified, or compressed gases under pressures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
- F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
- F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
- F17C2205/0323—Valves
- F17C2205/0335—Check-valves or non-return valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2221/00—Handled fluid, in particular type of fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2270/00—Applications
- F17C2270/05—Applications for industrial use
- F17C2270/0518—Semiconductors
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 第1の容器に設けられた第1の注入口、又は、第2の容器に設けられ且つ前記第1の注入口よりも大きな径を有する第2の注入口にパージガスを注入するガス注入装置であって、
前記第1の容器又は前記第2の容器が載置される載置部と、
前記載置部に配置され、前記パージガスを吐出する吐出部と、
前記第2の注入口に対して前記パージガスを注入する状態において、前記吐出部の周縁を囲むように前記載置部から突出して設けられる封止部と、を備え、
前記吐出部は、前記第1の注入口に対して前記パージガスを注入する状態において前記第1の注入口に接触して当該第1の注入口を封止すると共に、前記第2の注入口に対して前記パージガスを注入する状態において前記第2の注入口に非接触とされており、
前記封止部は、前記第2の注入口に前記パージガスを注入する状態において前記第2の注入口又は当該第2の注入口の周縁部に接触して当該第2の注入口を前記載置部との協働により封止すると共に、前記第1の注入口に前記パージガスを注入する状態において前記吐出部と前記第1の注入口との接触を妨げないことを特徴とするガス注入装置。 - 前記封止部は、弾性体によって構成されていることを特徴とする請求項1記載のガス注入装置。
- 前記封止部は、膜状の弾性体によって構成され、前記第2の注入口に前記パージガスが注入される状態において内側に向かって傾倒してその先端部が前記第2の注入口内に位置し、前記第2の注入口に接触することを特徴とする請求項2記載のガス注入装置。
- パージガスが注入される注入口を有する容器が載置される載置部と、当該載置部に設けられ且つ前記パージガスを吐出する吐出部と、を備えたガス注入装置に設けられ、前記パージガスの注入を補助する補助部材であって、
環状を呈し、前記吐出部の周縁を囲むように取り付けられる基部と、
前記基部から延設される側壁部と、を備え、
前記側壁部は、内側に向かって傾倒するテーパー形状を呈していることを特徴とする補助部材。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014022082 | 2014-02-07 | ||
JP2014022082 | 2014-02-07 | ||
PCT/JP2014/083001 WO2015118775A1 (ja) | 2014-02-07 | 2014-12-12 | ガス注入装置及び補助部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6098737B2 JP6098737B2 (ja) | 2017-03-22 |
JPWO2015118775A1 true JPWO2015118775A1 (ja) | 2017-03-23 |
Family
ID=53777591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015561175A Active JP6098737B2 (ja) | 2014-02-07 | 2014-12-12 | ガス注入装置及び補助部材 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10014200B2 (ja) |
JP (1) | JP6098737B2 (ja) |
CN (1) | CN105960704B (ja) |
TW (1) | TWI611492B (ja) |
WO (1) | WO2015118775A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201801353VA (en) * | 2015-08-25 | 2018-03-28 | Murata Machinery Ltd | Purge device, purge stocker, and purge method |
JP6794898B2 (ja) * | 2017-03-29 | 2020-12-02 | 株式会社ダイフク | 収納棚 |
US11139188B2 (en) * | 2017-04-28 | 2021-10-05 | Sinfonia Technology Co., Ltd. | Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus |
JP7234527B2 (ja) * | 2018-07-30 | 2023-03-08 | Tdk株式会社 | センサー内蔵フィルタ構造体及びウエハ収容容器 |
KR20200022682A (ko) * | 2018-08-23 | 2020-03-04 | 세메스 주식회사 | 버퍼 유닛, 그리고 이를 가지는 기판 처리 장치 및 방법 |
KR102113276B1 (ko) * | 2018-09-04 | 2020-05-20 | 주식회사 저스템 | 가스공급용 노즐패드 및 이를 구비한 웨이퍼 용기의 가스공급장치 |
US10923375B2 (en) * | 2018-11-28 | 2021-02-16 | Brooks Automation, Inc. | Load port module |
US11031265B2 (en) | 2018-11-28 | 2021-06-08 | Brooks Automation, Inc. | Load port module |
KR102012389B1 (ko) * | 2019-04-03 | 2019-08-20 | (주)에이이 | 로드 포트용 퍼지노즐 모듈 |
TWI735874B (zh) * | 2019-05-09 | 2021-08-11 | 呂保儀 | 充氣系統 |
Citations (4)
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JP3055728U (ja) * | 1998-07-10 | 1999-01-29 | 卓也 初瀬川 | 空気吸引による瓶つぶし作業のための吸引口との接続具 |
JP2010040912A (ja) * | 2008-08-07 | 2010-02-18 | Tdk Corp | 密閉容器の蓋開閉システム及び蓋開閉方法 |
JP2010147451A (ja) * | 2008-12-18 | 2010-07-01 | Nippon Cambridge Filter Kk | Foup用n2パージ装置 |
JP2012229861A (ja) * | 2011-04-26 | 2012-11-22 | Noritz Corp | 排気アダプタおよびこれを備えた燃焼装置 |
Family Cites Families (16)
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JP3055728B2 (ja) * | 1991-12-11 | 2000-06-26 | パイオニア株式会社 | ディスクプレーヤ |
US5810062A (en) * | 1996-07-12 | 1998-09-22 | Asyst Technologies, Inc. | Two stage valve for charging and/or vacuum relief of pods |
US5879458A (en) * | 1996-09-13 | 1999-03-09 | Semifab Incorporated | Molecular contamination control system |
US5988233A (en) * | 1998-03-27 | 1999-11-23 | Asyst Technologies, Inc. | Evacuation-driven SMIF pod purge system |
US6319297B1 (en) * | 1998-03-27 | 2001-11-20 | Asyst Technologies, Inc. | Modular SMIF pod breather, adsorbent, and purge cartridges |
US20040237244A1 (en) * | 2003-05-26 | 2004-12-02 | Tdk Corporation | Purge system for product container and interface seal used in the system |
US20110303125A1 (en) * | 2004-11-09 | 2011-12-15 | Hiroshi Itou | Load port and adaptor |
JP2007221042A (ja) * | 2006-02-20 | 2007-08-30 | Tdk Corp | インターフェースシール |
KR100981804B1 (ko) * | 2006-04-11 | 2010-09-13 | 히라따기꼬오 가부시키가이샤 | Foup오프너의 foup도어 위치결정장치 |
JP2007317909A (ja) | 2006-05-26 | 2007-12-06 | Kondo Kogyo Kk | シャッター付きブレスフィルター装置 |
JP4896260B2 (ja) * | 2008-02-27 | 2012-03-14 | ミライアル株式会社 | 裏面支持構造付きウエハ収納容器 |
JP5193673B2 (ja) | 2008-05-12 | 2013-05-08 | 株式会社ゴールドエイト | 精密基板収納容器 |
TWI346638B (en) * | 2008-12-26 | 2011-08-11 | Gudeng Prec Industral Co Ltd | A purging valve and a wafer container having the purging valve |
JP5236518B2 (ja) * | 2009-02-03 | 2013-07-17 | 株式会社ダン・タクマ | 保管システムおよび保管方法 |
JP2011187539A (ja) * | 2010-03-05 | 2011-09-22 | Sinfonia Technology Co Ltd | ガス注入装置、ガス排出装置、ガス注入方法及びガス排出方法 |
US10242896B2 (en) * | 2012-04-04 | 2019-03-26 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
-
2014
- 2014-12-12 US US15/101,085 patent/US10014200B2/en active Active
- 2014-12-12 WO PCT/JP2014/083001 patent/WO2015118775A1/ja active Application Filing
- 2014-12-12 CN CN201480074961.5A patent/CN105960704B/zh active Active
- 2014-12-12 JP JP2015561175A patent/JP6098737B2/ja active Active
-
2015
- 2015-01-21 TW TW104101968A patent/TWI611492B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3055728U (ja) * | 1998-07-10 | 1999-01-29 | 卓也 初瀬川 | 空気吸引による瓶つぶし作業のための吸引口との接続具 |
JP2010040912A (ja) * | 2008-08-07 | 2010-02-18 | Tdk Corp | 密閉容器の蓋開閉システム及び蓋開閉方法 |
JP2010147451A (ja) * | 2008-12-18 | 2010-07-01 | Nippon Cambridge Filter Kk | Foup用n2パージ装置 |
JP2012229861A (ja) * | 2011-04-26 | 2012-11-22 | Noritz Corp | 排気アダプタおよびこれを備えた燃焼装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201537659A (zh) | 2015-10-01 |
TWI611492B (zh) | 2018-01-11 |
CN105960704A (zh) | 2016-09-21 |
US20160307785A1 (en) | 2016-10-20 |
US10014200B2 (en) | 2018-07-03 |
WO2015118775A1 (ja) | 2015-08-13 |
CN105960704B (zh) | 2019-03-01 |
JP6098737B2 (ja) | 2017-03-22 |
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