JPWO2014087760A1 - 基板搬送前室機構 - Google Patents
基板搬送前室機構 Download PDFInfo
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- JPWO2014087760A1 JPWO2014087760A1 JP2014550987A JP2014550987A JPWO2014087760A1 JP WO2014087760 A1 JPWO2014087760 A1 JP WO2014087760A1 JP 2014550987 A JP2014550987 A JP 2014550987A JP 2014550987 A JP2014550987 A JP 2014550987A JP WO2014087760 A1 JPWO2014087760 A1 JP WO2014087760A1
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- 238000012546 transfer Methods 0.000 title claims abstract description 76
- 230000007246 mechanism Effects 0.000 title claims abstract description 61
- 238000012545 processing Methods 0.000 claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000004065 semiconductor Substances 0.000 abstract description 77
- 230000003028 elevating effect Effects 0.000 abstract description 33
- 235000012431 wafers Nutrition 0.000 description 88
- 230000005540 biological transmission Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 238000005192 partition Methods 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
- B25J9/0027—Means for extending the operation range
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
以下、この発明の実施の形態1について、本発明を半導体製造装置の基板搬送前室機構に適用する場合を例に採って説明する。
110 処理室
120 装置前室
121 容器載置台
123 搬送アーム
130 ウェハ搬送容器
131 半導体ウェハ
132 受渡底部
133 蓋部
201 仕切り板
210 クリーン化室
220 駆動室
230 ウェハ昇降機構
231 昇降体
231a 載置部
231b 突起
232 昇降軸
233 ウェハ昇降ベローズ
234 支持部材
235 ねじ軸
236 ナット
237 案内部材
238 ウェハ昇降モータ機構
240 水平搬送機構
241 スライド機構
242 昇降板
243a,243b アーム昇降ベローズ
244 昇降軸
245 アーム昇降モータ機構
246a,246b 支持台
248 駆動軸
249 アーム伸縮モータ機構
251 給気バルブ
252 排気バルブ
253 排気管
700 ベース板
701,702,711,712,721,722,731,732 プーリ
703,713,723,733 ベルト
704,714,724,734 スライド部材
705,715,725,735 ガイドレール
706,716,726,736 伝達部材
710 第1スライドアーム
720 第2スライドアーム
730 第3スライドアーム
740 第4スライドアーム
Claims (4)
- 処理基板に所望の処理を施す処理室と、該処理室との間で前記処理基板の搬入及び搬出を行う装置前室とを有する小型製造装置の、基板搬送前室機構であって、
前記処理基板が収容された基板搬送容器をセットするために前記装置前室の上面に設けられた容器載置台と、
前記基板搬送容器の受渡底部を、前記処理基板が載置されたままの状態で下側から保持して下降することにより、該処理基板を前記装置前室に搬入するために、前記装置前室内に設けられた基板昇降機構と、
前記処理基板を前記受渡底部から受け取って水平方向に伸延する搬送アームを用いて、該処理基板を前記処理室に搬送するために、前記装置前室内に設けられた水平搬送機構と、
を備えることを特徴とする基板搬送前室機構。 - 前記処理室と前記装置前室とが分離可能に構成されたことを特徴とする請求項1に記載の基板搬送前室機構。
- 前記水平搬送機構を下降させて前記処理室内の基板載置台に前記処理基板を載置するために、前記装置前室内に設けられた搬送アーム昇降機構を更に備えることを特徴とする請求項1に記載の基板搬送前室機構。
- 前記処理基板が、径が20mm以下のウェハであることを特徴とする請求項1に記載の基板搬送前室機構。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265071 | 2012-12-04 | ||
JP2012265071 | 2012-12-04 | ||
PCT/JP2013/079225 WO2014087760A1 (ja) | 2012-12-04 | 2013-10-29 | 基板搬送前室機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014087760A1 true JPWO2014087760A1 (ja) | 2017-01-05 |
JP6103723B2 JP6103723B2 (ja) | 2017-03-29 |
Family
ID=50883187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014550987A Active JP6103723B2 (ja) | 2012-12-04 | 2013-10-29 | 基板搬送前室機構 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9524895B2 (ja) |
JP (1) | JP6103723B2 (ja) |
KR (1) | KR101725472B1 (ja) |
CN (1) | CN104838481B (ja) |
WO (1) | WO2014087760A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10332768B2 (en) | 2014-12-01 | 2019-06-25 | National Institute Of Advanced Industrial Science And Technology | Compact manufacturing device, and inter-device transport system for production line |
JP6445853B2 (ja) * | 2014-12-02 | 2018-12-26 | 国立研究開発法人産業技術総合研究所 | 抵抗加熱炉 |
JP6422317B2 (ja) * | 2014-12-02 | 2018-11-14 | 国立研究開発法人産業技術総合研究所 | 小型製造装置 |
CN110364466B (zh) * | 2019-06-13 | 2021-09-07 | 上海提牛机电设备有限公司 | 空晶圆盒送出装置与晶圆上料系统 |
TWI760096B (zh) * | 2021-02-05 | 2022-04-01 | 矽碁科技股份有限公司 | 微型化半導體製程系統 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001093958A (ja) * | 1999-09-27 | 2001-04-06 | Rorze Corp | 基板移送装置 |
JP2001284433A (ja) * | 2000-01-28 | 2001-10-12 | Sony Corp | 基板移載装置及び基板移載方法 |
JP2002050667A (ja) * | 2000-08-04 | 2002-02-15 | Canon Inc | 基板搬送装置、半導体製造装置および半導体デバイス製造方法 |
JP2004537867A (ja) * | 2001-08-10 | 2004-12-16 | エーエスエムエル ユーエス インコーポレイテッド | レチクルを保護及び搬送する装置及び方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532970A (en) | 1983-09-28 | 1985-08-06 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
US4674939A (en) | 1984-07-30 | 1987-06-23 | Asyst Technologies | Sealed standard interface apparatus |
US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
JP3455072B2 (ja) | 1997-07-31 | 2003-10-06 | 株式会社東芝 | 荷電ビーム描画装置及び方法 |
US6719516B2 (en) * | 1998-09-28 | 2004-04-13 | Applied Materials, Inc. | Single wafer load lock with internal wafer transport |
JP2003174072A (ja) | 2001-12-07 | 2003-06-20 | Sony Corp | 基板移載装置及び基板移載方法 |
US20090326703A1 (en) * | 2007-04-30 | 2009-12-31 | Presley Bryan S | Integrated miniature microelectronic device factory |
WO2014087879A1 (ja) * | 2012-12-04 | 2014-06-12 | タツモ株式会社 | リンク式搬送ロボット |
-
2013
- 2013-10-29 KR KR1020157012894A patent/KR101725472B1/ko active IP Right Grant
- 2013-10-29 JP JP2014550987A patent/JP6103723B2/ja active Active
- 2013-10-29 US US14/647,685 patent/US9524895B2/en active Active
- 2013-10-29 WO PCT/JP2013/079225 patent/WO2014087760A1/ja active Application Filing
- 2013-10-29 CN CN201380063574.7A patent/CN104838481B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001093958A (ja) * | 1999-09-27 | 2001-04-06 | Rorze Corp | 基板移送装置 |
JP2001284433A (ja) * | 2000-01-28 | 2001-10-12 | Sony Corp | 基板移載装置及び基板移載方法 |
JP2002050667A (ja) * | 2000-08-04 | 2002-02-15 | Canon Inc | 基板搬送装置、半導体製造装置および半導体デバイス製造方法 |
JP2004537867A (ja) * | 2001-08-10 | 2004-12-16 | エーエスエムエル ユーエス インコーポレイテッド | レチクルを保護及び搬送する装置及び方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20150092110A (ko) | 2015-08-12 |
JP6103723B2 (ja) | 2017-03-29 |
KR101725472B1 (ko) | 2017-04-10 |
CN104838481B (zh) | 2017-06-13 |
US9524895B2 (en) | 2016-12-20 |
WO2014087760A1 (ja) | 2014-06-12 |
CN104838481A (zh) | 2015-08-12 |
US20150311101A1 (en) | 2015-10-29 |
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