JPWO2013172251A1 - 弾性表面波装置 - Google Patents
弾性表面波装置 Download PDFInfo
- Publication number
- JPWO2013172251A1 JPWO2013172251A1 JP2014515589A JP2014515589A JPWO2013172251A1 JP WO2013172251 A1 JPWO2013172251 A1 JP WO2013172251A1 JP 2014515589 A JP2014515589 A JP 2014515589A JP 2014515589 A JP2014515589 A JP 2014515589A JP WO2013172251 A1 JPWO2013172251 A1 JP WO2013172251A1
- Authority
- JP
- Japan
- Prior art keywords
- film
- surface acoustic
- acoustic wave
- wave device
- aluminum nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 37
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 28
- 229910052706 scandium Inorganic materials 0.000 claims abstract description 19
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 15
- 239000010703 silicon Substances 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- FGUJWQZQKHUJMW-UHFFFAOYSA-N [AlH3].[B] Chemical compound [AlH3].[B] FGUJWQZQKHUJMW-UHFFFAOYSA-N 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 230000001902 propagating effect Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 100
- 229910052582 BN Inorganic materials 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052984 zinc sulfide Inorganic materials 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DJPURDPSZFLWGC-UHFFFAOYSA-N alumanylidyneborane Chemical compound [Al]#B DJPURDPSZFLWGC-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/0296—Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
2…基板
3…高音速膜
4…ScAlN膜
5,6…IDT電極
7…酸化ケイ素膜
Claims (5)
- シリコンまたはガラスからなる基板と、
前記基板上に設けられたスカンジウム含有窒化アルミニウム膜と、
前記スカンジウム含有窒化アルミニウム膜よりも伝搬する横波音速が高く、かつ前記基板と前記スカンジウム含有窒化アルミニウム膜との間に積層されている高音速膜と、
前記スカンジウム含有窒化アルミニウム膜上に形成されたIDT電極とを備える、弾性表面波装置。 - 弾性表面波としてセザワ波を利用する、請求項1に記載の弾性表面波装置。
- 前記高音速膜が、窒化アルミニウムまたは窒化ホウ素アルミニウムからなる、請求項1または2に記載の弾性表面波装置。
- 前記スカンジウム含有窒化アルミニウム膜と前記高音速膜との間に積層されている酸化ケイ素膜をさらに備える、請求項1〜3のいずれか1項に記載の弾性表面波装置。
- 前記基板が単結晶シリコン基板からなる、請求項1〜4のいずれか1項に記載の弾性表面波装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014515589A JP5811276B2 (ja) | 2012-05-17 | 2013-05-09 | 弾性表面波装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012113171 | 2012-05-17 | ||
JP2012113171 | 2012-05-17 | ||
PCT/JP2013/063078 WO2013172251A1 (ja) | 2012-05-17 | 2013-05-09 | 弾性表面波装置 |
JP2014515589A JP5811276B2 (ja) | 2012-05-17 | 2013-05-09 | 弾性表面波装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5811276B2 JP5811276B2 (ja) | 2015-11-11 |
JPWO2013172251A1 true JPWO2013172251A1 (ja) | 2016-01-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014515589A Active JP5811276B2 (ja) | 2012-05-17 | 2013-05-09 | 弾性表面波装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9948274B2 (ja) |
JP (1) | JP5811276B2 (ja) |
WO (1) | WO2013172251A1 (ja) |
Families Citing this family (33)
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WO2014087799A1 (ja) * | 2012-12-05 | 2014-06-12 | 株式会社村田製作所 | 圧電部材、弾性波装置及び圧電部材の製造方法 |
JP6132022B2 (ja) * | 2013-08-21 | 2017-05-24 | 株式会社村田製作所 | 圧電共振子及びその製造方法 |
JP5880520B2 (ja) * | 2013-10-30 | 2016-03-09 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
JP6432299B2 (ja) * | 2014-11-17 | 2018-12-05 | 株式会社デンソー | 弾性表面波素子 |
US10381998B2 (en) | 2015-07-28 | 2019-08-13 | Qorvo Us, Inc. | Methods for fabrication of bonded wafers and surface acoustic wave devices using same |
US10523178B2 (en) | 2015-08-25 | 2019-12-31 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
US9991870B2 (en) | 2015-08-25 | 2018-06-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US10541667B2 (en) | 2015-08-25 | 2020-01-21 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator having trap-rich region |
US10177734B2 (en) | 2015-08-25 | 2019-01-08 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
US10020796B2 (en) | 2015-08-25 | 2018-07-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US10812038B2 (en) * | 2015-08-25 | 2020-10-20 | Avago Technologies International Sales Pte. Limited | Acoustic wave resonator |
US10530327B2 (en) | 2015-08-25 | 2020-01-07 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
US10536133B2 (en) | 2016-04-22 | 2020-01-14 | Avago Technologies International Sales Pte. Limited | Composite surface acoustic wave (SAW) device with absorbing layer for suppression of spurious responses |
US10090822B2 (en) | 2015-08-25 | 2018-10-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Surface acoustic wave (SAW) resonator |
US10469056B2 (en) | 2015-08-25 | 2019-11-05 | Avago Technologies International Sales Pte. Limited | Acoustic filters integrated into single die |
US10084427B2 (en) * | 2016-01-28 | 2018-09-25 | Qorvo Us, Inc. | Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof |
US10128814B2 (en) | 2016-01-28 | 2018-11-13 | Qorvo Us, Inc. | Guided surface acoustic wave device providing spurious mode rejection |
JP2017151408A (ja) * | 2016-02-22 | 2017-08-31 | 株式会社タムロン | 赤外線透過膜、光学膜、反射防止膜、光学部品、光学系及び撮像装置 |
US10177735B2 (en) | 2016-02-29 | 2019-01-08 | Avago Technologies International Sales Pte. Limited | Surface acoustic wave (SAW) resonator |
WO2017149675A1 (ja) * | 2016-03-01 | 2017-09-08 | 株式会社村田製作所 | 圧電膜、その製造方法、及び圧電膜を用いた圧電部品 |
WO2017159409A1 (ja) * | 2016-03-16 | 2017-09-21 | 株式会社村田製作所 | 複合フィルタ装置 |
CN109155622B (zh) * | 2016-05-13 | 2022-07-12 | 株式会社村田制作所 | 弹性波装置、高频前端电路以及通信装置 |
US10658564B2 (en) * | 2016-11-24 | 2020-05-19 | Huawei Technologies Co., Ltd. | Surface acoustic wave device |
KR102294238B1 (ko) * | 2017-03-09 | 2021-08-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치, 탄성파 장치 패키지, 멀티플렉서, 고주파 프론트 엔드 회로 및 통신 장치 |
US10574208B2 (en) | 2017-06-20 | 2020-02-25 | Skyworks Solutions, Inc. | Acoustic wave filters with thermally conductive sheet |
US11206007B2 (en) | 2017-10-23 | 2021-12-21 | Qorvo Us, Inc. | Quartz orientation for guided SAW devices |
WO2019226461A1 (en) | 2018-05-21 | 2019-11-28 | Skyworks Solutions, Inc. | Multi-layer piezoelectric substrate with heat dissipation |
KR102607899B1 (ko) * | 2018-09-20 | 2023-11-29 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
CN112997403A (zh) * | 2018-11-16 | 2021-06-18 | 株式会社村田制作所 | 弹性波装置 |
CN113228508A (zh) * | 2018-12-20 | 2021-08-06 | 三安日本科技株式会社 | 弹性波装置、弹性波滤波器、双工器及模块 |
WO2021090775A1 (ja) * | 2019-11-06 | 2021-05-14 | 株式会社村田製作所 | 弾性波装置 |
US20210184653A1 (en) * | 2019-12-12 | 2021-06-17 | University Of Florida Research Foundation, Incorporated | Acoustically coupled radio frequency (rf) filter |
CN113293355B (zh) * | 2021-06-11 | 2023-05-05 | 武汉大学 | 一种智能螺栓用AlCrN/AlScN纳米复合压电涂层及其制备方法 |
Citations (6)
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JPH08316782A (ja) * | 1995-05-15 | 1996-11-29 | Sanyo Electric Co Ltd | 弾性表面波素子及びその製造方法 |
JP2004282232A (ja) * | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | 弾性表面波デバイス |
JP2005354650A (ja) * | 2004-02-05 | 2005-12-22 | Seiko Epson Corp | 弾性表面波デバイス |
JP2006270360A (ja) * | 2005-03-23 | 2006-10-05 | Seiko Epson Corp | 弾性表面波素子 |
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2013
- 2013-05-09 WO PCT/JP2013/063078 patent/WO2013172251A1/ja active Application Filing
- 2013-05-09 JP JP2014515589A patent/JP5811276B2/ja active Active
-
2014
- 2014-11-14 US US14/541,180 patent/US9948274B2/en active Active
Patent Citations (6)
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JPH08316782A (ja) * | 1995-05-15 | 1996-11-29 | Sanyo Electric Co Ltd | 弾性表面波素子及びその製造方法 |
JP2004282232A (ja) * | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | 弾性表面波デバイス |
JP2005354650A (ja) * | 2004-02-05 | 2005-12-22 | Seiko Epson Corp | 弾性表面波デバイス |
JP2006270360A (ja) * | 2005-03-23 | 2006-10-05 | Seiko Epson Corp | 弾性表面波素子 |
JP2009010926A (ja) * | 2007-05-31 | 2009-01-15 | National Institute Of Advanced Industrial & Technology | 圧電体薄膜、圧電体およびそれらの製造方法、ならびに当該圧電体薄膜を用いた圧電体共振子、アクチュエータ素子および物理センサー |
WO2011046117A1 (ja) * | 2009-10-13 | 2011-04-21 | 株式会社村田製作所 | 弾性表面波装置 |
Also Published As
Publication number | Publication date |
---|---|
US20150069882A1 (en) | 2015-03-12 |
JP5811276B2 (ja) | 2015-11-11 |
US9948274B2 (en) | 2018-04-17 |
WO2013172251A1 (ja) | 2013-11-21 |
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