JPWO2013146954A1 - 多孔質材料及びハニカム構造体 - Google Patents
多孔質材料及びハニカム構造体 Download PDFInfo
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- JPWO2013146954A1 JPWO2013146954A1 JP2014507990A JP2014507990A JPWO2013146954A1 JP WO2013146954 A1 JPWO2013146954 A1 JP WO2013146954A1 JP 2014507990 A JP2014507990 A JP 2014507990A JP 2014507990 A JP2014507990 A JP 2014507990A JP WO2013146954 A1 JPWO2013146954 A1 JP WO2013146954A1
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- Japan
- Prior art keywords
- porous material
- aggregate
- phase
- powder
- honeycomb structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011148 porous material Substances 0.000 title claims abstract description 165
- 239000002245 particle Substances 0.000 claims abstract description 75
- 239000011230 binding agent Substances 0.000 claims abstract description 67
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 35
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 33
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052863 mullite Inorganic materials 0.000 claims abstract description 33
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 23
- 229910052878 cordierite Inorganic materials 0.000 claims abstract description 19
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims abstract description 12
- 238000005452 bending Methods 0.000 claims description 33
- 239000011777 magnesium Substances 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 230000035939 shock Effects 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 8
- 239000000843 powder Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 22
- 239000002994 raw material Substances 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 238000002441 X-ray diffraction Methods 0.000 description 13
- 238000010304 firing Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 239000004927 clay Substances 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000007088 Archimedes method Methods 0.000 description 4
- 238000004453 electron probe microanalysis Methods 0.000 description 4
- 238000004445 quantitative analysis Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 238000007561 laser diffraction method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000000634 powder X-ray diffraction Methods 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
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- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007604 dielectric heating drying Methods 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- -1 hydroxypropoxyl Chemical group 0.000 description 2
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 2
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 2
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 2
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 235000010981 methylcellulose Nutrition 0.000 description 2
- 238000002459 porosimetry Methods 0.000 description 2
- 238000004451 qualitative analysis Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910001753 sapphirine Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
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Abstract
Description
本発明の多孔質材料は、主骨材と副骨材とを骨材として含有し、骨材同士が、結合相を介して、細孔を形成するように結合されているものである。そして、主骨材は炭化珪素粒子であり、副骨材はムライト粒子及びアルミナ粒子の少なくとも一方である。そして、結合相が、非晶質相及びコージェライト相の少なくとも一方を含有するものである。更に、本発明の多孔質材料は、気孔率が40〜90%である。図1は、本発明の多孔質材料の一の実施形態の断面を拡大して示す模式図である。図1に示される本実施形態の多孔質材料1は、骨材2同士が、結合相5を介して、細孔6を形成するように結合され、ムライト粒子4及びアルミナ粒子3が副骨材として含有されている例である。
本発明のハニカム構造体は、上述した本発明の多孔質材料により構成され、「一方の端面から他方の端面まで延びる複数のセル」を区画形成する隔壁、を備えたものである。上記セルは、流体の流路となるものである。また、ハニカム構造体は、最外周に位置する外周壁を有する構造であることが好ましい。隔壁の厚さは、30〜1000μmが好ましく、50〜500μmが更に好ましく、50〜200μmが特に好ましい。セル密度は、10〜200セル/cm2が好ましく、20〜200セル/cm2が更に好ましく、50〜150セル/cm2が特に好ましい。
本発明の多孔質材料の製造方法について、以下に説明する。以下に説明する多孔質材料の製造方法は、多孔質材料によって構成されるハニカム構造体を、製造する方法でもある。
炭化珪素(SiC)粉末、アルミナ粉末及び結合材粉末を、100:17:19(質量比)の比率で混合した。得られた混合物に、バインダ及び造孔材を添加すると共に、水を添加して成形原料とした。バインダとしては、ヒドロキシプロピルメチルセルロースを用いた。造孔材としては、デンプン、吸水性樹脂を用いた。結合材粉末としては、タルク粉末、水酸化アルミニウム粉末及びシリカ粉末の混合物を用いた。結合材粉末は、結合相となる粉末である。尚、焼成により、アルミナ粉末と結合材粉末中のシリカ成分が反応して、副骨材であるムライトが生成される。
炭化珪素粒子の質量比率は、X線回折分析により行った。具体的には、X線回折装置を用いて多孔質材料のX線回折パターンを得る。X線回折装置としては、回転対陰極型X線回折装置(理学電機社製、RINT)を用いる。X線回折測定の条件は、CuKα線源、50kV、300mA、2θ=10〜60°とする。また、得られたX線回折データの解析方法としては、「RIR(Reference Intensity Ratio)法を用いて、X線回折データを解析して各成分を定量する」簡易定量分析を用いる。また、X線回折データの解析は、MDI社製「X線データ解析ソフトJADE7」を用いて行う。
ムライト粒子の質量比率は、上記「炭化珪素粒子の質量比率」と同様の方法で求める。
アルミナ粒子の質量比率は、上記「炭化珪素粒子の質量比率」と同様の方法で求める。
結合相が、コージェライト相である場合、結合相の質量比率は、上記「炭化珪素粒子の質量比率」と同様の方法で求める。結合相が、非晶質相の場合、非晶質の量が既知であるサンプルと、当該サンプルの2θ=25°付近のX線回折強度の比率から、結合相の質量比率を求める。
非晶質相の構成元素の同定は、粉末XRD(X線回折)による構成相(構成成分)の同定・定量分析とともに、EPMA(電子線マイクロアナライザ)による定性分析及び元素マッピングの結果に基づいて行う。粉末XRDとしては、理学電機社製、商品名:RINTを使用した。X線回折測定の条件は、CuKα線源、50kV、300mA、2θ=10〜60°とした。EPMAとしては、日本電子社製、商品名:JXA8800を使用した。EPMAの条件は、加速電圧15kV、ビーム径50nm、照射電流100nAとし、3000倍の倍率で観察した視野を分析した。
気孔率は、水銀圧入法(JIS R 1655準拠)による全細孔容積[cm3/g]とアルキメデス法による見掛密度[g/cm3]から算出する。気孔率の算出に際しては、「開気孔率(%)=100×全細孔容積/{(1/見掛密度)+全細孔容積}」の式を用いる。
水中アルキメデス法(JIS R 1626準拠)により測定する。
水銀圧入法(JIS R 1655準拠)により測定する。
水銀圧入法(JIS R 1655準拠)により測定する。
ハニカム構造体をセルが貫通する方向を長手方向とした試験片(縦5セル×横10セル×長さ40mm)に加工し、JIS R1601に準拠した曲げ試験によりハニカム構造体の曲げ強度を算出する。
上記「曲げ強度」の測定方法により「応力−歪曲線」を作成し、当該「応力−歪曲線」の傾きを算出する。得られた「応力−歪曲線の傾き」をヤング率とする。
JIS R1618に準拠して、測定する。具体的には、ハニカム構造体から縦3セル×横3セル×長さ20mmの試験片を切り出し、40〜800℃のA軸方向(ハニカム構造体の流路に対して平行方向)の平均線熱膨張係数(熱膨張係数)を測定する。
各条件を表1に示す条件とした以外は実施例1と同様にして多孔質材料(ハニカム構造体)を作製した。実施例1の場合と同様にして、各評価を行った。結果を表1に示す。
焼成条件を以下のようにし、その他の条件を表1に示す条件とした以外は、実施例1と同様にして多孔質材料(ハニカム構造体)を作製した。実施例1の場合と同様にして、各評価を行った。結果を表1に示す。
得られたハニカム乾燥体を、大気雰囲気にて550℃で3時間かけて脱脂し、その後、Ar不活性雰囲気にて、約1480℃で2時間焼成し、ハニカム構造の多孔質材料(ハニカム構造体)を得た。
成形原料を以下のようにして作製し、焼成条件を以下のようにし、その他の条件を表1に示す条件とした以外は、実施例1と同様にして多孔質材料(ハニカム構造体)を作製した。実施例1の場合と同様にして、各評価を行った。結果を表1に示す。
炭化珪素(SiC)粉末、及び結合材粉末を、100:20(質量比)の比率で混合した。得られた混合物に、バインダ及び造孔材を添加すると共に、水を添加して成形原料とした。バインダとしては、ヒドロキシプロピルメチルセルロースを用いた。造孔材としては、デンプン、吸水性樹脂を用いた。結合材粉末としては、タルク粉末、水酸化アルミニウム粉末及びシリカ粉末の混合物を用いた。結合材粉末は、結合相となる粉末である。
得られたハニカム乾燥体を、大気雰囲気にて550℃で3時間かけて脱脂し、その後、Ar不活性雰囲気にて、約1450℃で2時間焼成し、ハニカム構造の多孔質材料(ハニカム構造体)を得た。
Claims (9)
- 主骨材と副骨材とを骨材として含有し、
前記主骨材が炭化珪素粒子であり、前記副骨材がムライト粒子及びアルミナ粒子の少なくとも一方であり、
前記骨材同士が、結合相を介して、細孔を形成するように結合されており、
前記結合相が非晶質相及びコージェライト相の少なくとも一方を含有し、
気孔率が40〜90%である多孔質材料。 - 前記主骨材、前記副骨材及び前記結合相の合計質量に対して、前記副骨材を8.0〜35.0質量%含有する請求項1に記載の多孔質材料。
- 前記主骨材、前記副骨材及び前記結合相の合計質量に対して、前記結合相を、2.0〜15.0質量%含有する請求項1又は2に記載の多孔質材料。
- 前記非晶質相が、マグネシウム、アルミニウム、珪素及び酸素を含有するものである請求項1〜3のいずれかに記載の多孔質材料。
- 平均細孔径が10〜40μmである請求項1〜4のいずれかに記載の多孔質材料。
- 細孔径10μm未満の細孔が細孔全体の20%以下であり、細孔径40μmを超える細孔が細孔全体の10%以下である請求項1〜5のいずれかに記載の多孔質材料。
- 前記主骨材である炭化珪素粒子の平均粒子径が5〜100μmであり、前記副骨材の平均粒子径が5〜100μmである請求項1〜6のいずれかに記載の多孔質材料。
- 曲げ強度が6.5MPa以上であり、曲げ強度/ヤング率比が1.4×10−3以上である請求項1〜7のいずれかに記載の多孔質材料。
- 請求項1〜8のいずれかに記載の多孔質材料により構成され、一方の端面から他方の端面まで延びる複数のセルを、区画形成する隔壁を備えたハニカム構造体。
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JP6906468B2 (ja) * | 2018-03-30 | 2021-07-21 | 日本碍子株式会社 | セラミックス多孔体及びその製造方法、並びに集塵用フィルタ |
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